Multi-feed packaged antenna based on fan-out package
A multi-feed packaged antenna based on fan-out package, which relates to packaged antennas. A first passivation layer is arranged under a packaging layer, and first and second redistribution layers are arranged on the first passivation layer to build the multi-feed packaged antenna. Connecting ends of multiple channels of a chip are connected to a feed structure of a packaged antenna. A metal layer of the feed structure is achieved by the first redistribution layer, and the second redistribution layer is mainly configured to package an antenna. The coaxial feed is adopted herein, in which two redistribution layers are provided, by which a multi-port power combining can be achieved on the antenna, providing a wide-beam performance.
1. A multi-feed packaged antenna based on a fan-out package, comprising:
a packaging layer; and
a chip;
wherein the chip is embedded in the packaging layer; and a first passivation layer is provided on a side where a plurality of connecting ends of the chip are located;
the first passivation layer comprises a first redistribution layer and a second redistribution layer;
an antenna feed structure is provided in the first redistribution layer;
a packaged antenna is arranged in the second redistribution layer;
the plurality of connecting ends of the chip are connected to the packaged antenna in the second redistribution layer through the antenna feed structure in the first redistribution layer;
the antenna feed structure comprises a plurality of feeders corresponding to the plurality of connection ends of the chip; a first end of each of the plurality of feeders is connected to one of the plurality of connecting ends of the chip through one of a plurality of first via holes; a second end of each feeder of the plurality of feeders is connected to the packaged antenna through one of a plurality of second via holes; the plurality of feeders are the same length; and
the packaged antenna is a dual-feed patch antenna, and two of the plurality of second via holes are symmetrically distributed with respect to a center line of the packaged antenna.
2. The multi-feed packaged antenna of claim 1 , wherein the packaging layer is made of glass.
3. The multi-feed packaged antenna of claim 1 , wherein a solder ball array is provided on a lower end surface of the first passivation layer; solder balls in the solder ball array are arranged spaced apart; and the solder ball array is arranged around a periphery of the chip and the packaged antenna.
4. The multi-feed packaged antenna of claim 3 , wherein the solder ball array is connected to a metal line on an external printed circuit board.
5. A multi-feed packaged antenna based on a fan-out package, comprising:
a packaging layer; and
a chip;
wherein the chip is embedded in the packaging layer; and a first passivation layer is provided on a side where a plurality of connecting ends of the chip are located;
the first passivation layer comprises a first redistribution layer and a second redistribution layer;
an antenna feed structure is provided in the first redistribution layer;
a packaged antenna is arranged in the second redistribution layer;
the plurality of connecting ends of the chip are connected to the packaged antenna in the second redistribution layer through the antenna feed structure in the first redistribution layer;
the antenna feed structure comprises a plurality of feeders corresponding to the plurality of connection ends of the chip; a first end of each of the plurality of feeders is connected to one of the plurality of connecting ends of the chip through one of a plurality of first via holes; a second end of each feeder of the plurality of feeders is connected to the packaged antenna through one of a plurality of second via holes; the plurality of feeders are the same length; and
the packaged antenna is a triple-feed patch antenna, and one of the plurality of second via holes is arranged on a center line of the packaged antenna, and two of the plurality of second via holes are symmetrically distributed with respect to the center line of the packaged antenna.
6. The multi-feed packaged antenna of claim 5 , wherein the packaging layer is made of glass.
7. The multi-feed packaged antenna of claim 5 , wherein a solder ball array is provided on a lower end surface of the first passivation layer; solder balls in the solder ball array are arranged spaced apart; and the solder ball array is arranged around a periphery of the chip and the packaged antenna.
8. The multi-feed packaged antenna of claim 7 , wherein the solder ball array is connected to a metal line on an external printed circuit board.