IP Library Granted Patent US 11,569,913
Granted Patent B2
US 11,569,913 · App. 17/340,479 · Granted Jan 31, 2023

Optical modulator control system for interconnect transceivers

Inventors: Eric Bernier (Kanata, CA); Mohammad Mehdi Mansouri Rad (Kanata, CA)
Assignee: HUAWEI TECHNOLOGIES CO., LTD.
H04B10/40H04B10/0771H04B10/503
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Quick Facts
Patent No.
US 11,569,913
App. No.
17/340,479
Granted
Jan 31, 2023
Kind
B2
Abstract

An interconnect transceiver for transmitting and receiving optical signals, comprising an electronics module with a transceiver engine, and a photonics module with a laser source, a modulator, a photodetector to monitor the laser, one to receive an external optical signal, and a controller to operate the laser source and the laser source modulator, an electronic switch having two states is proposed. The first state is to allow monitoring of the modulated laser source by the transceiver engine, so as to acquire a reference set of operating parameters, and the second state is where a signal from the modulated laser source is directed to the controller, such as to allow real-time control of the source of the transmitting laser and modulator by the controller.

Claims (29)

1. An interconnect transceiver for transmitting and receiving optical signals, comprising:

a transceiver engine;

a modulator configured to controllably modulate an optical carrier to produce an optical signal;

a photodetector configured to monitor the optical signal output by the modulator;

a controller configured to control the modulator; and

a switch switchable between a first state and a second state, wherein:

in the first state, the switch directs an output signal of the photodetector to the transceiver engine; and

in the second state, the switch directs the output signal of the photodetector to the controller.

2. The interconnect transceiver of claim 1 , wherein the transceiver engine is implemented using a complementary metal-oxide semiconductor (CMOS) fabrication process.

3. The interconnect transceiver of claim 1 , wherein the modulator is implemented using a silicon-based fabrication process, a silicon nitride fabrication process, or an indium phosphide fabrication process.

4. The interconnect transceiver of claim 1 , wherein the switch is implemented using a complementary metal-oxide semiconductor (CMOS) fabrication process.

5. The interconnect transceiver of claim 1 , wherein the modulator is a microring resonance modulator.

6. The interconnect transceiver of claim 1 , wherein the photodetector has a bandwidth equal to or greater than a bandwidth of the optical signal.

7. The interconnect transceiver of claim 1 , wherein the photodetector has a bandwidth less than a bandwidth of the optical signal.

8. The interconnect transceiver of claim 1 , further comprising a second photodetector configured to receive an external optical signal, wherein said directing the output signal of the photodetector to the transceiver engine comprises directing the output signal of the photodetector to a first input of the transceiver engine, and wherein the switch is configured, in the second state, to direct an output signal of the second photodetector to the first input of the transceiver engine.

9. A method, in an interconnect transceiver for transmitting and receiving optical signals, the interconnect transceiver comprising a transceiver engine, a modulator configured to controllably modulate an optical carrier to produce an optical signal, and a controller configured to control the modulator, the method comprising:

monitoring, using a photodetector, the optical signal output by the modulator;

using a switch operating in a first state, directing an output signal of the photodetector to the transceiver engine; and

using the switch operating in a second state, directing the output signal of the photodetector to the controller.

10. The method of claim 9 , wherein the transceiver engine is implemented using a complementary metal-oxide semiconductor (CMOS) fabrication process.

11. The method of claim 9 , wherein the modulator is implemented using a silicon-based fabrication process, a silicon nitride fabrication process, or an indium phosphide fabrication process.

12. The method of claim 9 , wherein the switch is implemented using a complementary metal-oxide semiconductor (CMOS) fabrication process.

13. The method of claim 9 , wherein the modulator is a microring resonance modulator.

14. The method of claim 9 , wherein the photodetector has a bandwidth equal to or greater than a bandwidth of the optical signal.

15. The method of claim 9 , wherein the photodetector has a bandwidth less than a bandwidth of the optical signal.

16. The method of claim 9 ,

wherein said directing the output signal of the photodetector to the transceiver engine comprises directing the output signal of the photodetector to the first input of the transceiver engine, the method further comprising:

receiving, using a second photodetector, an external optical signal;

using the switch operating in the second state, directing an output signal of the second photodetector to the first input of the transceiver engine.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2022
From: BERNIER, ERIC; MANSOURI RAD, MOHAMMAD MEHDI
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 061824/0085 →
Continuity (2)
Provisional Application 63041575 · Jun 19, 2020
Related Publication 20210399806A1 · Dec 23, 2021