IP Library Granted Patent US 11,581,439
Granted Patent B2
US 11,581,439 · App. 16/693,482 · Granted Feb 14, 2023

Semiconductor device

Inventors: Shunpei Yamazaki (Tokyo, JP); Yoshiyuki Kobayashi (Kanagawa, JP); Daisuke Matsubayashi (Kanagawa, JP); Akihisa Shimomura (Kanagawa, JP); Daigo Ito (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/7869H01L29/42376H01L29/42384H01L29/66969H01L29/78645H01L29/78648H01L29/78693H01L29/78696
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Quick Facts
Patent No.
US 11,581,439
App. No.
16/693,482
Granted
Feb 14, 2023
Kind
B2
Abstract

To provide a semiconductor device in which a large current can flow. To provide a semiconductor device which can be driven stably at a high driving voltage. The semiconductor device includes a semiconductor layer, a first electrode and a second electrode electrically connected to the semiconductor layer and apart from each other in a region overlapping with the semiconductor layer, a first gate electrode and a second gate electrode with the semiconductor layer therebetween, a first gate insulating layer between the semiconductor layer and the first gate electrode, and a second gate insulating layer between the semiconductor layer and the second gate electrode. The first gate electrode overlaps with part of the first electrode, the semiconductor layer, and part of the second electrode. The second gate electrode overlaps with the semiconductor layer and part of the first electrode, and does not overlap with the second electrode.

Claims (25)

1. A semiconductor device comprising:

a semiconductor layer including a channel formation region;

a first electrode and a second electrode electrically connected to the semiconductor layer;

a first gate insulating layer and a second gate insulating layer with the semiconductor layer therebetween;

a first gate electrode overlapping with the first electrode, the semiconductor layer, and the second electrode through the first gate insulating layer; and

a second gate electrode overlapping with the semiconductor layer and the first electrode through the second gate insulating layer,

wherein an outer end of the second gate electrode extends beyond an end of the semiconductor layer, and an inner end of the second gate electrode overlaps with the semiconductor layer,

wherein each of the first gate electrode and the second gate electrode has a circular ring shape with an opening, and

wherein, in a top view, the opening of the second gate electrode is larger than the opening of the first gate electrode.

2. The semiconductor device according to claim 1 ,

wherein the first electrode is a drain electrode, and

wherein the second electrode is a source electrode.

3. The semiconductor device according to claim 1 ,

wherein the first electrode is a source electrode, and

wherein the second electrode is a drain electrode.

4. The semiconductor device according to claim 3 , wherein the second gate electrode is configured to receive a potential lower than a potential applied to the source electrode.

5. The semiconductor device according to claim 1 ,

wherein the semiconductor layer has an island shape,

wherein one of the first electrode and the second electrode has a ring shape and an opening of the ring shape overlaps with the semiconductor layer, and

wherein the other of the first electrode and the second electrode is in the opening.

6. The semiconductor device according to claim 1 , wherein the semiconductor layer includes an oxide semiconductor.

7. The semiconductor device according to claim 6 , further comprising:

a first oxide layer between the semiconductor layer and the second gate insulating layer; and

a second oxide layer between the semiconductor layer and the first gate insulating layer,

wherein the first oxide layer and the second oxide layer each contain one or more of metal elements contained in the semiconductor layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2019
From: YAMAZAKI, SHUNPEI; KOBAYASHI, YOSHIYUKI; MATSUBAYASHI, DAISUKE; SHIMOMURA, AKIHISA; ITO, DAIGO
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 051113/0570 →
Priority Claims (2)
JP 2013-134865 · Jun 27, 2013 · national
JP 2013-156551 · Jul 29, 2013 · national
Continuity (2)
Division 14313008 · Jun 24, 2014
Related Publication 20200127137A1 · Apr 23, 2020