Pump mechanism, pump system, and manufacturing method of pump mechanism
A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.
1. A pump mechanism, comprising:
a housing, comprising:
a first recess;
a second recess;
a plate, disposed between the first recess and the second recess;
a channel, passing through the plate and communicated with the first recess and the second recess;
an input pipe, connected to the channel and passing through the housing and the plate;
a first output pipe, communicated with the first recess; and
a second output pipe, communicated with the second recess;
a first impeller, disposed in the first recess;
a second impeller, disposed in the second recess; and
two driving modules, driving the first impeller and the second impeller respectively.
2. The pump mechanism as claimed in claim 1 , wherein each of the driving modules has a stator winding and a circuit board.
3. The pump mechanism as claimed in claim 2 , wherein the first impeller has a magnetic ring, and the second impeller has an additional magnetic ring.
4. The pump mechanism as claimed in claim 3 , wherein the housing further comprises a first cover and a second cover.
5. The pump mechanism as claimed in claim 4 , wherein the first cover is disposed between the first impeller and one of the driving modules.
6. The pump mechanism as claimed in claim 4 , wherein the first cover has a depression portion, and the stator winding is disposed in the depression portion.
7. The pump mechanism as claimed in claim 4 , wherein the first cover has an accommodating portion on its side, which is configured to accommodate an electronic component of the circuit board.
8. The pump mechanism as claimed in claim 1 , wherein the first impeller and the second impeller are arranged in opposite directions.
9. The pump mechanism as claimed in claim 1 , wherein the first impeller has a plurality of blades formed on a surface of the first impeller, and the surface faces the plate.
10. A pump system, comprising:
a pump mechanism, comprising:
a housing, comprising:
a first space;
a second space;
a plate, disposed between the first space and the second space;
a channel, passing through the plate and communicated with the first space and the second space;
an input pipe, connected to the channel and passing through the housing and the plate;
a first output pipe, communicated with the first space; and
a second output pipe, communicated with the second space;
a first impeller, disposed in the first space;
a second impeller, disposed in the second space; and
two driving modules, driving the first impeller and the second impeller respectively;
a first tube, connected to the first output pipe;
a second tube, connected to the second output pipe; and
a first electronic member, contacting the first tube.
11. The pump system as claimed in claim 10 , wherein each of the driving modules has a stator winding and a circuit board.
12. The pump system as claimed in claim 11 , wherein the first impeller has a magnetic ring, and the second impeller has an additional magnetic ring.
13. The pump system as claimed in claim 12 , wherein the housing further comprises a first cover and a second cover.
14. The pump system as claimed in claim 13 , wherein the first cover is disposed between the first impeller and one of the driving modules.
15. The pump system as claimed in claim 13 , wherein the first cover has a depression portion, and the stator winding is disposed in the depression portion.
16. The pump system as claimed in claim 13 , wherein the first cover has an accommodating portion on its side, which is configured to accommodate an electronic component of the circuit board.
17. The pump system as claimed in claim 10 , wherein the first impeller and the second impeller are arranged in opposite directions.
18. The pump system as claimed in claim 10 , wherein the first impeller has a plurality of blades formed on a surface of the first impeller, and the surface faces the plate.