IP Library Granted Patent US 11,610,986
Granted Patent B2
US 11,610,986 · App. 17/350,505 · Granted Mar 21, 2023

Power semiconductor switch having a cross-trench structure

Inventors: Matteo Dainese (Munich, DE); Alexander Philippou (Munich, DE); Markus Beninger-Bina (Grosshelfendorf, DE); Ingo Dirnstorfer (Dresden, DE); Erich Griebl (Dorfen, DE); Christian Jaeger (Munich, DE); Johannes Georg Laven (Taufkirchen, DE); Caspar Leendertz (Munich, DE); Frank Dieter Pfirsch (Munich, DE)
Assignees: Infineon Technologies AG; Infineon Technologies Dresden GmbH & Co. KG
H01L29/7397H01L29/0619H01L29/0649H01L29/0657H01L29/0696H01L29/1095H01L29/404H01L29/407H01L29/4236H01L29/66348H01L29/7396H01L29/0638
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Quick Facts
Patent No.
US 11,610,986
App. No.
17/350,505
Granted
Mar 21, 2023
Kind
B2
Abstract

A power semiconductor switch includes an active cell region with a drift region, an edge termination region, and IGBT cells within the active cell region. Each IGBT cell includes trenches that extend into the drift region and laterally confine mesas. At least one control trench has a control electrode for controlling the load current. At least one dummy trench has a dummy electrode electrically coupled to the control electrode. At least one further trench has a further trench electrode. At least one active mesa is electrically connected to a first load terminal within the active cell region. Each control trench is arranged adjacent to no more than one active mesa. At least one inactive mesa is adjacent to the dummy trench. A cross-trench structure merges each control trench, dummy trench and further trench to each other. The cross-trench structure overlaps at least partially along a vertical direction with the trenches.

Claims (28)

1. A power semiconductor switch, comprising:

a first load terminal and a second load terminal, the power semiconductor switch being configured to conduct a load current along a vertical direction between the first and the second load terminals;

an active cell region with a drift region of a first conductivity type;

an edge termination region having a well region of a second conductivity type electrically connected to the first load terminal; and

a plurality of IGBT cells arranged within the active cell region, each of the IGBT cells comprising a plurality of trenches that extend into the drift region along the vertical direction and that laterally confine a plurality of mesas,

wherein the plurality of trenches comprises:

at least one control trench having a control electrode for controlling the load current;

at least one dummy trench having a dummy electrode electrically coupled to the control electrode; and

at least one further trench having a further trench electrode, the at least one further trench being one of a further control trench and a further dummy trench;

wherein the plurality of mesas comprises:

at least one active mesa electrically connected to the first load terminal within the active cell region and being configured to conduct at least a part of the load current, each of the number of control trenches that are included in the respective IGBT cell being arranged adjacent to no more than one active mesa; and

at least one inactive mesa arranged adjacent to the at least one dummy trench and not electrically connected to the first load terminal; and

a cross-trench structure associated with at least one of the IGBT cells, the cross-trench structure merging each of the at least one control trench, the at least one dummy trench and the at least one further trench of the at least one IGBT cell to each other, the cross-trench structure overlapping at least partially along the vertical direction with the plurality of the trenches of the at least one IGBT cell.

2. The power semiconductor switch of claim 1 , further comprising at least one source trench having a source electrode electrically connected with the first load terminal.

3. The power semiconductor switch of claim 1 , wherein the cross-trench structure separates the at least one active mesa and the at least one inactive mesa each into a first section in the active cell region and a second section formed in the edge termination region which surrounds the active cell region.

4. The power semiconductor switch of claim 3 , wherein the cross-trench structure is arranged within a transition region between the active cell region and the edge termination region.

5. The power semiconductor switch of claim 3 , wherein the first section of the at least one active mesa and the first section of the at least one inactive mesa are connected to each other by a cross-mesa section adjacent to the cross-trench structure.

6. The power semiconductor switch of claim 5 , wherein the cross-mesa section is formed by a portion of a semiconductor body that includes the active cell region and the edge termination region.

7. The power semiconductor switch of claim 5 , wherein the cross-mesa section is interrupted by a portion of a decoupling structure of the cross-trench structure, and/or by one or more spacer trench sections, and/or one by or more columnar trenches.

8. The power semiconductor switch of claim 7 , wherein the decoupling structure decouples the at least one active mesa from the at least one inactive mesa.

9. The power semiconductor switch of claim 3 , wherein the cross-trench structure comprises a decoupling structure having spacer trench sections formed by local trench widenings, and wherein the local trench widenings are configured and positioned so as to electrically decouple the first section of the at least one active mesa and first section of the at least one inactive mesa from each other.

10. The power semiconductor switch of claim 3 , wherein the first section of the at least one inactive mesa is electrically floating, and wherein the first section of the at least one active mesa has a same electrical potential as the first load terminal.

11. The power semiconductor switch of claim 1 , wherein the cross-trench structure forms a T junction with the at least one control trench and the at least one dummy trench.

12. The power semiconductor switch of claim 1 , wherein the cross-trench structure comprises an insulating material that extends between sidewalls and down to a bottom of the at least one control trench and the at least one dummy trench.

13. The power semiconductor switch of claim 1 , wherein the cross-trench arrangement comprises a cross-trench electrode.

14. The power semiconductor switch of claim 13 , wherein the cross-trench electrode is electrically connected to the control electrode of the at least one control trench.

15. The power semiconductor switch of claim 13 , wherein the cross-trench electrode is electrically insulated from the dummy electrode of the at least one dummy trench.

16. The power semiconductor switch of claim 1 , wherein the cross-trench structure extends through the at least one active mesa along a lateral direction.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT WAS TO BOTH INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG AND INFINEON TECHNOLOGIES AG. PREVIOUSLY RECORDED AT REEL: 061491 FRAME: 0416. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Nov 23, 2022
From: DAINESE, MATTEO; PHILIPPOU, ALEXANDER; BENINGER-BINA, MARKUS; DIRNSTORFER, INGO; GRIEBL, ERICH; JAEGER, CHRISTIAN; LAVEN, JOHANNES GEORG; LEENDERTZ, CASPAR; PFIRSCH, FRANK DIETER
To: INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG; INFINEON TECHNOLOGIES AG
Reel/Frame 061994/0093 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2022
From: DAINESE, MATTEO; PHILIPPOU, ALEXANDER; BENINGER-BINA, MARKUS; DIRNSTORFER, INGO; GRIEBL, ERICH; JAEGER, CHRISTIAN; LAVEN, JOHANNES GEORG; LEENDERTZ, CASPAR; PFIRSCH, FRANK DIETER
To: INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG
Reel/Frame 061491/0416 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2021
From: DAINESE, MATTEO; PHILIPPOU, ALEXANDER; BINA, MARKUS; DIRNSTORFER, INGO; GRIEBL, ERICH; JAEGER, CHRISTIAN; LAVEN, JOHANNES GEORG; LEENDERTZ, CASPAR; PFIRSCH, FRANK DIETER
To: INFINEON TECHNOLOGIES AG; INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG
Reel/Frame 056576/0416 →
Priority Claims (1)
DE 102017111595.1 · May 29, 2017 · national
Continuity (3)
Division 16409454 · May 10, 2019
Continuation 15989778 · May 25, 2018
Related Publication 20210313460A1 · Oct 7, 2021