Opening in the pad for bonding integrated passive device in InFO package
A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.
1. A package comprising:
a dielectric layer;
a plurality of conductive pads in the dielectric layer;
an Under-Bump Metallurgy (UBM) comprising:
a plurality of via portions extending into the dielectric layer, wherein each of the plurality of via portions lands on one of the plurality of conductive pads; and
a pad portion higher than the dielectric layer, wherein the pad portion is continuously joined with the plurality of via portions;
a solder region over and contacting the pad portion of the UBM; and
an integrated passive device, wherein the solder region bonds the UBM to the integrated passive device.
2. The package of claim 1 , wherein no distinguishable interface is formed between the pad portion and the plurality of via portions.
3. The package of claim 1 , wherein the dielectric layer extends into one of the plurality of conductive pads to form a plurality of dielectric plugs.
4. The package of claim 3 , wherein the plurality of dielectric plugs penetrate through the one of the plurality of conductive pads.
5. The package of claim 3 , wherein the plurality of dielectric plugs are arranged as an array.
6. The package of claim 3 , wherein in a top view of the package, the plurality of dielectric plugs are aligned to a plurality of rings, each encircling one of the plurality of via portions.
7. The package of claim 1 further comprising:
a plurality of redistribution lines underlying the plurality of conductive pads;
a molding compound underlying the plurality of redistribution lines; and
a device die molded in the molding compound.
8. The package of claim 1 , wherein the integrated passive device comprises a terminal joined to the solder region.
9. The package of claim 1 , wherein the UBM has an elongated top view shape, with the plurality of via portions being aligned to a straight line.
10. The package of claim 1 , wherein each of plurality of conductive pads extends laterally beyond a respective edge of the UBM.
11. A package comprising:
a two-terminal passive device die comprising:
a first terminal; and
a second terminal;
a solder region underlying and joined to the first terminal; and
a conductive feature underlying and joined to the solder region, the conductive feature comprising:
a pad portion underlying and electrically coupling to the first terminal; and
a plurality of via portions underlying and physically joined to the pad portion; and
a plurality of metal pads, each being underlying and contacting one of the plurality of via portions, wherein each of the plurality of metal pads extends laterally beyond a corresponding edge of the pad portion.
12. The package of claim 11 further comprising a dielectric layer comprising:
a first portion encircling the plurality of via portions and the plurality of metal pads; and
second portions extending into the plurality of metal pads.
13. The package of claim 12 , wherein each of the second portions penetrates through a respective one of the plurality of metal pads.
14. The package of claim 12 , wherein the dielectric layer comprises a polymer.
15. The package of claim 12 , wherein the second portions of the dielectric layer are arranged as an array comprising a plurality of rows and a plurality of columns.
16. The package of claim 12 , wherein the two-terminal passive device die extends laterally beyond edges of the conductive feature.
17. A package comprising:
a dielectric layer;
a plurality of metal pads in the dielectric layer;
an Under-Bump Metallurgy (UBM) comprising a plurality of via portions in the dielectric layer, wherein each of the plurality of via portions is over and contacting one of the plurality of metal pads;
a solder region over and contacting the UBM, wherein each of the plurality of metal pads comprises a portion extending laterally beyond corresponding edges of the solder region and the UBM; and
a passive device comprising a terminal, wherein the terminal is over and joined to the solder region.
18. The package of claim 17 , wherein the UBM further comprises a pad portion over the dielectric layer, and wherein the solder region is joined to the pad portion.
19. The package of claim 17 , wherein the dielectric layer comprises portions extending into, and penetrating through, the plurality of metal pads.
20. The package of claim 17 , wherein the passive device comprises a capacitor.