Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same
A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.
1. A system for transfer of a plurality of die from a die source to a receive substrate, the system comprising:
a die source including a plurality of die, the plurality of die being carried by a tape, the tape being coupled to a die release material on a carrier, at least a portion of the die release material being reusable;
a receive substrate to receive the plurality of die from the die source; and
a laser source for providing energy to interact with the die release material to transfer the plurality of die from the die source to the receive substrate.
2. The system of claim 1 wherein the tape is a wafer tape.
3. The system of claim 1 wherein the plurality of die are LEDs.
4. The system of claim 1 wherein the transfer of the plurality of die from the die source to the receive substrate is configured to occur multiple die at a time.
5. The system of claim 1 wherein a transfer process for transferring the plurality of die from the die source to the receive substrate includes at least one of an ablative process, a blistering process, a thermal release process, and a surface morphology change process for a surface of the die release material.
6. The system of claim 1 wherein the carrier includes a laser transmissive substrate for supporting the die release material.
7. The system of claim 1 wherein the carrier is a flexible freestanding carrier.
8. The system of claim 1 wherein the plurality of die are mini LEDs.
9. The system of claim 1 wherein the plurality of die are micro LEDs.
10. A method of transferring a plurality of die from a die source to a receive substrate, the method comprising the steps of:
(a) coupling a plurality of die to a carrier via a die release material on the carrier, thereby assembling a die source the plurality of die being carried by a rape, wherein the tape is coupled to the die release material such that the plurality of die are coupled to the carrier, at least a portion of the die release material being reusable; and
(b) applying energy to the die release material using a laser to transfer the plurality of die from the die source to a receive substrate.
11. The method of claim 10 further comprising the step of (c) securing another die source including another plurality of die to the carrier using the die release material.
12. The method of claim 10 wherein the tape is a wafer tape.
13. The method of claim 10 wherein the plurality of die are LEDs.
14. The method of claim 10 wherein the transfer of the plurality of die from the die source to the receive substrate is configured to occur multiple die at a time.
15. The method of claim 10 wherein a transfer process for transferring the plurality of die from the die source to the receive substrate includes at least one of an ablative process, a blistering process, a thermal release process, and a surface morphology change process for a surface of the die release material.
16. The method of claim 10 wherein the carrier includes a laser transmissive substrate for supporting a reactive layer and an adhesive layer.
17. The method of claim 10 wherein the carrier is a flexible freestanding carrier.
18. The method of claim 10 wherein the plurality of die are mini LEDs.
19. The method of claim 10 wherein the plurality of die are micro LEDs.