Power electronics unit having integrated current sensor for forming a module; and drive train
A power electronics unit ( 1 ) for an electric drive unit, having an electrically conductive carrier element ( 2 ) and a power semiconductor module ( 3 ) arranged on the carrier element ( 2 ). The power semiconductor module ( 3 ) is designed to convert a direct current into a three-phase alternating current, and a current sensor ( 4 ) used to determine the alternating current is integrated such that it forms a main module ( 5 ) with the carrier element ( 2 ) and the power semiconductor module ( 3 ). A drive train for a motor vehicle having such a power electronics unit ( 1 ) is also provided.
1. A power electronics unit for an electric drive unit, the power electronics unit comprising:
an electrically conductive carrier element;
a power semiconductor module arranged on and directly fastened to the carrier element, the power semiconductor module is configured to convert a direct current into a three-phase alternating current; and
a current sensor configured to measure the alternating current integrated with and directly connected on the carrier element and the power semiconductor module to form a main module, wherein the carrier element is a lead frame.
2. The power electronics unit according to claim 1 , wherein the current sensor is arranged inside a substantially rectangular outer contour of the carrier element or partially overlapping with said outer contour.
3. The power electronics unit according to claim 1 , wherein the power semiconductor module is enclosed by a module housing.
4. The power electronics unit according to claim 3 , wherein the current sensor is arranged in the module housing or in a sensor housing formed separately from the module housing.
5. A drive train for a motor vehicle, comprising the power electronics unit according to claim 1 electrically connected to an electric motor.
6. A power electronics unit for an electric drive of a motor vehicle, the power electronics unit comprising:
a main module including:
an electrically conductive carrier element;
a power semiconductor module arranged on and directly fastened to the carrier element, the power semiconductor module is configured to convert a direct current into a three-phase alternating current; and
a current sensor configured to measure the alternating current integrated with the carrier element and the power semiconductor module and directly connected on the carrier element, wherein the carrier element is a lead frame; and
wherein the main module is preassembled as a single unit.
7. The power electronics unit of claim 6 , wherein the power semiconductor module is enclosed by a module housing.
8. The power electronics unit of claim 7 , wherein the current sensor is arranged in the module housing.
9. The power electronics unit of claim 7 , wherein the current sensor is arranged in a sensor housing formed separately from the module housing.