IP Library Granted Patent US 11,618,943
Granted Patent B2
US 11,618,943 · App. 17/078,383 · Granted Apr 4, 2023

PVD target having self-retained low friction pads

Inventors: Ilya Lavitsky (San Francisco, CA); Keith A. Miller (Mountain View, CA)
Assignee: APPLIED MATERIALS, INC.
C23C14/3414
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Quick Facts
Patent No.
US 11,618,943
App. No.
17/078,383
Granted
Apr 4, 2023
Kind
B2
Abstract

Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion, a target disposed on the central portion, a plurality of recesses formed in the support portion; and a plurality of self-retained low-friction pads partially disposed in the plurality of recesses, wherein each of the plurality of low-friction pads includes a solid body portion, and a self-retaining stem that extends outward from a bottom of the solid body portion, wherein the self-retaining stem includes a first stem portion disposed in the first through-hole portion, and a second stem portion disposed within the second through-hole portion.

Claims (31)

1. A target assembly for a substrate processing chamber, comprising:

a plate comprising a first side including a central portion and a support portion, wherein the central portion is configured to support target source material; a plurality of recesses formed in the support portion, wherein each of the plurality of recesses includes a first through-hole portion having a first diameter, and a second through-hole portion having a second diameter that is larger than the first diameter of the first through-hole; and

a plurality of low-friction pads partially disposed in the plurality of recesses, wherein each of the plurality of low-friction pads includes:

a solid body portion; and

a self-retaining stem that extends outward from a bottom of the solid body portion, wherein the self-retaining stem includes a first stem portion disposed in the first through-hole portion, and a second stem portion disposed within the second through-hole portion.

2. The target assembly of claim 1 , wherein the plurality of recesses are circumferentially spaced around the plate.

3. The target assembly of claim 1 , wherein the plurality of recesses are similarly sized.

4. The target assembly of claim 1 , wherein the second stem portion includes a claw portion that is wider than the first diameter of the first stem portion along a first direction.

5. The target assembly of claim 4 , wherein the claw portion is flat on two sides in a second direction perpendicular to the first direction, such that a width of the flat sides is narrower than the first diameter of the of the first stem portion.

6. The target assembly of claim 4 , wherein the self-retaining stem includes at least two slots configured to allow the self-retaining stem to be compressed to allow the second stem portion to fit though the second through-hole portion.

7. The target assembly of claim 6 , wherein the claw portion comes in contact with a retaining surface withing the second through-hole portion configured to retain the pad within the recess.

8. The target assembly of claim 1 , wherein each of the plurality of low-friction pads includes a bearing surface.

9. The target assembly of claim 8 , wherein a surface area of the bearing surface of each of the plurality of low-friction pads is about 0.20 square inches to about 0.35 square inches.

10. The target assembly of claim 1 , wherein each of the plurality of low-friction pads are chamfered at the corners of the solid body portion.

11. The target assembly of claim 1 , wherein each of the plurality of low-friction pads comprise a seating surface and a bearing surface, wherein, when the seating surface is supported on a bottom surface of a recess, the bearing surface is spaced above the first side of the plate.

12. The target assembly of claim 11 , wherein the bearing surface is spaced about 0.05 mm to about 1 mm above the first side.

13. The target assembly of claim 1 , wherein the plate includes a groove separating the support portion into an atmospheric side radially outward from the groove and a vacuum side radially inward from the groove.

14. The target assembly of claim 13 , wherein the plurality of recesses are formed in the atmospheric side.

15. The target assembly of claim 1 , wherein the plurality of low-friction pads are replaceable low-friction pads.

16. The target assembly of claim 1 , wherein the plurality of low-friction pads are formed from one or more of ultra-high-molecular-weight polyethylene or polyether ether ketone.

17. A substrate processing apparatus, comprising:

a chamber body;

a lid disposed atop the chamber body;

a target assembly coupled to the lid, the target assembly including

a backing plate having a first side and an opposing second side, wherein the first side of the backing plate is configured to support target source material;

a plurality of recesses formed in the backing plate, wherein each of the plurality of recesses includes a first through-hole portion having a first diameter, and a second through-hole portion having a second diameter; and

a plurality of self-retained low-friction pads partially disposed in the plurality of recesses, wherein each of the plurality of self-retained low-friction pads includes:

a solid body portion; and

a self-retaining stem that extends outward from a bottom of the solid body portion, wherein the self-retaining stem includes a first stem portion disposed in the first through-hole portion, and a second stem portion disposed within the second through-hole portion;

a support member coupled to the lid proximate an outer end of the support member and extending radially inward; and

a seal ring disposed between the backing plate and the support member wherein the seal ring is supported by the support member along a bottom surface of the seal ring, and wherein a top surface of the seal ring contacts the target assembly along the bearing surfaces of the plurality of self-retained low-friction pads.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2020
From: LAVITSKY, ILYA; MILLER, KEITH A.
To: APPLIED MATERIALS, INC.
Reel/Frame 054174/0989 →
Continuity (1)
Related Publication 20220127714A1 · Apr 28, 2022