IP Library Granted Patent US 11,626,520
Granted Patent B2
US 11,626,520 · App. 16/779,680 · Granted Apr 11, 2023

Semiconductor substrate and display device

Inventors: Masataka Ikeda (Tokyo, JP); Hirotaka Hayashi (Tokyo, JP); Hitoshi Tanaka (Tokyo, JP)
Assignee: JAPAN DISPLAY INC.
H01L29/78696G02F1/167G02F1/16766H01L27/124H01L27/1225H01L27/1255H01L28/60H01L29/7869H01L29/78648
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Quick Facts
Patent No.
US 11,626,520
App. No.
16/779,680
Granted
Apr 11, 2023
Kind
B2
Abstract

According to one embodiment, a semiconductor substrate includes a first basement, a gate line, a source line, an insulating film, a first pixel electrode, and a first transistor and a second transistor connected parallel at positions between the source line and the first pixel electrode. Each of a first semiconductor layer of the first transistor and a second semiconductor layer of the second transistor includes a first region, a second region, and a channel region. The first semiconductor layer and the second semiconductor layer are in contact with a first surface that is a surface of the insulating film on the source line side. The channel region of each of the first semiconductor layer and the second semiconductor layer wholly overlaps the gate line.

Claims (88)

1. A semiconductor substrate, comprising:

a first basement;

a gate line located above the first basement;

a source line located above the first basement;

an insulating film located above the gate line and below the source line;

a first pixel electrode located above the first basement, the gate line, and the source line; and

a first transistor and a second transistor located above the first basement and electrically connected parallel at positions between the source line and the first pixel electrode,

wherein

each of a first semiconductor layer of the first transistor and a second semiconductor layer of the second transistor includes a first region electrically connected to the source line, a second region electrically connected to the first pixel electrode, and a channel region between the first region and the second region,

the first semiconductor layer and the second semiconductor layer are in contact with a first surface serving as a surface of the insulating film on the source line side, and

the channel region of each of the first semiconductor layer and the second semiconductor layer wholly overlaps the gate line.

2. The semiconductor substrate of claim 1 , wherein

each of the first semiconductor layer and the second semiconductor layer has a longer axis in a direction in which the gate line extends, and

the first semiconductor layer and the second semiconductor layer wholly overlap the gate line.

3. The semiconductor substrate of claim 2 , wherein

a width of the gate line is larger than a sum of a length of a shorter axis of the first semiconductor layer and a length of a shorter axis of the second semiconductor layer.

4. The semiconductor substrate of claim 3 , wherein

the first semiconductor layer and the second semiconductor layer are arranged in a width direction of the gate line.

5. The semiconductor substrate of claim 1 , further comprising:

a second pixel electrode located between the first basement and the first pixel electrode and electrically connected to the first pixel electrode; and

a capacitive electrode located between the first pixel electrode and the second pixel electrode and capacitively coupled to each of the first pixel electrode and the second pixel electrode,

wherein

the capacitive electrode is wholly located inside the first pixel electrode and inside the second pixel electrode, in planar view.

6. The semiconductor substrate of claim 5 , further comprising:

another capacitive electrode; and

a connection line connecting the capacitive electrode and the other capacitive electrode,

wherein

the gate line is located between the capacitive electrode and the other capacitive electrode,

the source line crosses the gate line, and

the connection line crosses the gate line and does not cross the source line.

7. The semiconductor substrate of claim 6 , wherein

the gate line and the second pixel electrode are formed of the same material, in the same layer,

the source line, the capacitive electrode, the other capacitive electrode, and the connection line are formed of the same material and located in the same layer, and

the capacitive electrode, the other capacitive electrode, and the connection line are formed integrally.

8. The semiconductor substrate of claim 5 , further comprising:

another capacitive electrode; and

a connection line connecting the capacitive electrode and the other capacitive electrode,

wherein

the source line is located between the capacitive electrode and the other capacitive electrode,

the source line crosses the gate line, and

the connection line crosses the source line and does not cross the gate line.

9. The semiconductor substrate of claim 1 , further comprising:

a second pixel electrode located between the first basement and the first pixel electrode; and

a capacitive electrode,

wherein

the source line crosses the gate line and is located on a boundary between a first domain and a second domain,

the second region and the channel region of the first semiconductor layer are located in the first domain,

the second region and the channel region of the second semiconductor layer are located in the second domain,

the second pixel electrode includes:

a first segment located in the first domain and electrically connected to the first pixel electrode; and

a second segment located in the second domain and electrically connected to the first pixel electrode, and

the capacitive electrode includes:

a first capacitive electrode located between the first pixel electrode and the first segment in the first domain, and capacitively coupled to each of the first pixel electrode and the first segment;

a second capacitive electrode located between the first pixel electrode and the second segment in the second domain, and capacitively coupled to each of the first pixel electrode and the second segment; and

a crossed electrode crossing the source line and electrically connecting the first capacitive electrode and the second capacitive electrode.

10. The semiconductor substrate of claim 9 , further comprising:

another capacitive electrode adjacent to the first capacitive electrode;

a third capacitive electrode adjacent to the second capacitive electrode;

a connection line connecting the first capacitive electrode and the other capacitive electrode; and

another connection line connecting the second capacitive electrode and the third capacitive electrode,

wherein

the capacitive electrode is located between the other capacitive electrode and the third capacitive electrode, and

each of the connection line and the other connection line does not cross the gate line or the source line.

11. The semiconductor substrate of claim 1 , wherein

when a channel length and a channel width in the channel region of each of the first semiconductor layer and the second semiconductor layer are referred to as L and W, respectively, W/L≤0.75.

12. The semiconductor substrate of claim 11 , wherein

each of the first semiconductor layer and the second semiconductor layer is formed of an oxide semiconductor.

13. The semiconductor substrate of claim 1 , further comprising:

an auxiliary gate electrode electrically connected to the gate line,

wherein

the first semiconductor layer and the second semiconductor layer are sandwiched between the gate line and the auxiliary gate electrode, and

the auxiliary gate electrode overlaps at least the whole channel regions of both the first semiconductor layer and the second semiconductor layer, in planar view.

14. A display device comprising:

a semiconductor substrate, comprising

a first basement,

a gate line located above the first basement,

a source line located above the first basement,

an insulating film located above the gate line and below the source line,

a first pixel electrode located above the first basement, the gate line, and the source line, and

a first transistor and a second transistor located above the first basement and electrically connected parallel at positions between the source line and the first pixel electrode;

a counter-substrate including a second basement opposed to the first pixel electrode, and a counter-electrode located between the second basement and the first pixel electrode and opposed to the first pixel electrode; and

a display function layer located between the first pixel electrode and the counter-electrode with a voltage to be applied between the first pixel electrode and the counter-electrode applied to the display function layer,

wherein

each of a first semiconductor layer of the first transistor and a second semiconductor layer of the second transistor includes a first region electrically connected to the source line, a second region electrically connected to the first pixel electrode, and a channel region between the first region and the second region,

the first semiconductor layer and the second semiconductor layer are in contact with a first surface serving as a surface of the insulating film on the source line side, and

the channel region of each of the first semiconductor layer and the second semiconductor layer wholly overlaps the gate line.

15. The display device of claim 14 , wherein

the display function layer is an electrophoretic layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2025
From: JAPAN DISPLAY INC.
To: MAGNOLIA WHITE CORPORATION
Reel/Frame 072130/0313 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2020
From: IKEDA, MASATAKA; HAYASHI, HIROTAKA; TANAKA, HITOSHI
To: JAPAN DISPLAY INC.
Reel/Frame 051695/0304 →
Priority Claims (2)
JP JP2019-019792 · Feb 6, 2019 · national
JP JP2019-119960 · Jun 27, 2019 · national
Continuity (1)
Related Publication 20200251597A1 · Aug 6, 2020