Co-packaged optics switch solution based on analog optical engines

1. A co-packaged optics (CPO) switch assembly, comprising:

a switch integrated circuit (IC) chip and a number of optical modules coupled to the switch IC chip;

wherein the switch IC chip comprises a switch logic and a digital signal processing (DSP) unit; and

wherein a respective optical module comprises: a photonic integrated chip (PIC), a first amplifier module, and a second amplifier module;

wherein the switch IC chip and the optical modules are separate circuit modules co-packaged within a same physical enclosure such that the DSP unit within the switch IC chip and the amplifier modules within the respective optical module are on different chips.

2. The co-packaged optics (CPO) switch assembly of claim 1 , further comprising a micro-controller unit (MCU) coupled to the switch IC chip and the optical module, wherein the micro-controller is external to the optical module and is configured to set operating parameters of components within the DSP unit and the optical module.

3. The co-packaged optics (CPO) switch assembly of claim 2 , wherein the MCU is configured to:

optimize operating parameters of a component within the optical module based on output signals of the DSP unit; and

optimize operating parameters of a component within the DSP unit based on output signals of the optical module.

4. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the DSP unit comprises one or more digital equalizers for equalizing signals transmitted to and/or received from the optical module.

5. The co-packaged optics (CPO) switch assembly of claim 4 , wherein the digital equalizers comprise one or more of: a feed-forward equalizer (FFE), a decision-feedback equalizer (DFE), a maximum-likelihood sequence estimation (MLSE) equalizer, and a reflection canceller.

6. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the optical module further comprises a continuous-time linear equalizer (CTLE) for equalizing an analog signal received by the optical module and/or a pre-emphasis equalizer for equalizing an analog signal transmitted by the optical module.

7. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the PIC comprises a set of optical modulators for transmitting optical signals and a set of photodetectors for receiving optical signals.

8. The co-packaged optics (CPO) switch assembly of claim 7 , wherein the first amplifier module comprises a set of modulator drivers respectively coupled to the modulators, and wherein the second amplifier module comprises a set of transimpedance amplifiers (TIAs) respectively coupled to the photodetectors.

9. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the switch IC chip further comprises a digital-to-analog converter (DAC) configured to convert digital signals outputted by the switch logic to analog domain and an analog-to-digital converter (ADC) configured to convert analog signals received from an optical module to digital domain.

10. A switch integrated circuit (IC) chip to be co-packaged with a plurality of optical modules to form a CPO switch assembly, the switch IC chip comprising:

a switch logic; and

a digital signal processing (DSP) unit comprising one or more digital equalizers for equalizing signals transmitted to and/or received from the optical modules;

wherein the switch IC chip and the optical modules are separate circuit modules co-packaged within a same physical enclosure such that the DSP unit within the switch IC chip and one or more amplifier modules within a respective optical module are on different chips.

11. The switch IC chip of claim 10 , wherein the digital equalizers comprise one or more of: a feed-forward equalizer (FFE), a decision-feedback equalizer (DFE), a maximum-likelihood sequence estimation (MLSE) equalizer, and a reflection canceller.

12. The switch IC chip of claim 10 , further comprising a digital-to-analog converter (DAC) configured to convert digital signals outputted by the switch logic to analog domain and an analog-to-digital converter (ADC) configured to convert analog signals received from an optical module to digital domain.

13. The switch IC chip of claim 10 , wherein the switch IC chip is coupled to a micro-controller unit (MCU) configured to set operating parameters of the digital equalizers.

14. The switch IC chip of claim 13 , wherein the MCU is configured to optimize the operating parameters of the digital equalizers based on output signals of the optical modules.

15. An optical module to be co-packaged with a switch integrated circuit (IC) chip to form a CPO switch assembly, the optical module comprising:

a photonic integrated chip (PIC);

a first amplifier module; and

a second amplifier module;

wherein the optical module and the switch IC chip are separate circuit modules co-packaged within a same physical enclosure such that the first and second amplifier modules within the optical module and a digital signal processing (DSP) unit within the switch IC chip are on different chips.

16. The optical module of claim 15 , further comprising a continuous-time linear equalizer (CTLE) for equalizing an analog signal received by the optical module and/or a pre-emphasis equalizer for equalizing an analog signal transmitted by the optical module.

17. The optical module of claim 15 , wherein the PIC comprises a set of optical modulators for transmitting optical signals and a set of photodetectors for receiving optical signals.

18. The optical module of claim 17 , wherein the first amplifier module comprises a set of modulator drivers respectively coupled to the modulators, and wherein the second amplifier module comprises a set of transimpedance amplifiers (TIAs) respectively coupled to the photodetectors.

19. The optical module of claim 15 , wherein the optical module is coupled to a micro-controller unit (MCU) configured to set operating parameters of the amplifiers.

20. The optical module of claim 19 , wherein the MCU is configured to optimize the operating parameters of the amplifiers based on output signals of the DSP unit located within the switch IC chip.