IP Library › Granted Patent US 11,632,618
Granted Patent B1
US 11,632,618 · App. 17/668,390 · Granted Apr 18, 2023

Earphone module

Inventor: Jui-Hsien Chien (Taichung, TW)
Assignee: Merry Electronics Co., Ltd.
H04R1/1041G06F3/041H01Q1/273H01Q1/48H01Q13/10H04R1/1016H04R1/1058H04R3/04H04R2420/07
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Quick Facts
Patent No.
US 11,632,618
App. No.
17/668,390
Granted
Apr 18, 2023
Kind
B1
Abstract

An earphone module, including a housing, a circuit board, a feeding conductor, a first grounding conductor, and a second grounding conductor, is provided. The housing includes an insulating housing and a metal ring connected thereto. The metal ring serves as an antenna and includes a feeding end, a first ground end, a second ground end, and a slit that splits the metal ring. The slit is located between the feeding end and the first ground end. The second ground end is located between the feeding end and the slit. The circuit board is located in the insulating housing. A slot is formed between the circuit board and the metal ring. The feeding conductor is connected to the feeding end and the circuit board. The first grounding conductor is connected to the first ground end and the circuit board. The second grounding conductor is connected to the second ground end and the circuit board.

Claims (17)

1. An earphone module, comprising:

a housing, comprising an insulating housing and a metal ring connected to the insulating housing, wherein the metal ring serves as an antenna and the metal ring comprises a feeding end, a first ground end, a second ground end, and a slit that splits the metal ring, the slit is located between the feeding end and the first ground end, and the second ground end is located between the feeding end and the slit;

a circuit board, located in the insulating housing, wherein a slot is formed between the circuit board and the metal ring;

a feeding conductor, connected to the feeding end and the circuit board;

a first grounding conductor, connected to the first ground end and the circuit board; and

a second grounding conductor, connected to the second ground end and the circuit board.

2. The earphone module according to claim 1 , wherein a segment from the feeding end to the first ground end along the metal ring serves as a resonant path of the antenna, the resonant path enables the slot to be coupled to form a frequency band, and a length of the resonant path is 0.5 times a wavelength of the frequency band.

3. The earphone module according to claim 2 , further comprising a flexible circuit board located in the insulating housing and connected to the circuit board, wherein a projection of the flexible circuit board on the metal ring overlaps with a portion at half of the resonant path from the feeding end along the metal ring.

4. The earphone module according to claim 1 , further comprising a third grounding conductor, wherein the metal ring further comprises a third ground end located between the first ground end and the slit and close to the slit, and the third grounding conductor is connected to the third ground end and the circuit board.

5. The earphone module according to claim 4 , wherein a segment from the feeding end to the first ground end along the metal ring serves as a low pass filter, and a segment from the feeding end to the second ground end along the metal ring serves as a high pass filter.

6. The earphone module according to claim 1 , wherein the second grounding conductor is away from the feeding end and the slit.

7. The earphone module according to claim 1 , wherein a width of the slit ranges from 0.2 mm to 0.5 mm.

8. The earphone module according to claim 1 , wherein the metal ring is located above the circuit board.

9. The earphone module according to claim 1 , further comprising a flexible circuit board located in the insulating housing and connected to the circuit board, wherein a distance between the metal ring and the flexible circuit board is at least greater than 1 mm.

10. The earphone module according to claim 1 , further comprising a touch panel exposed on the housing, wherein the metal ring is located below the touch panel or is flush with the touch panel.

11. The earphone module according to claim 1 , wherein when the earphone module is placed in a human ear, the feeding end is close to an antihelix of the human ear and is away from an earlobe, and the first ground end is close to a tragus of the human ear.

12. The earphone module according to claim 1 , wherein when the earphone module is placed in a human ear, the circuit board is located between the metal ring and an external ear canal of the human ear, so that the antenna generates an antenna polarization direction directed into the external ear canal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2022
From: CHIEN, JUI-HSIEN
To: MERRY ELECTRONICS CO., LTD.
Reel/Frame 059139/0812 →
Priority Claims (1)
TW 110147294 · Dec 16, 2021 · national
Cited By (8)
US 1,072,792 US 1,073,649 US 1,074,645 US 1,075,720 US 1,075,721 US 1,076,869 US 1,146,885 US 12,456,800