Display substrate and method for forming the same and display device

1. A display substrate, comprising:

a first conductive pattern located on a base substrate, wherein a ring-shaped conductive protection structure is arranged at an edge of a preset region of the first conductive pattern and surrounds the preset region, and the conductive protection structure is made of an anti-dry-etching material;

an insulation layer covering the first conductive pattern, wherein the insulation layer comprises a via-hole corresponding to the preset region, and an orthographic projection of the via-hole onto the base substrate is surrounded by an orthographic projection of the conductive protection structure onto the base substrate, and the orthographic projection of the via-hole onto the base substrate partially overlaps the orthographic projection of the conductive protection structure onto the base substrate; and

a second conductive pattern located on a side of the insulation layer away from the first conductive pattern, wherein the second conductive pattern is electrically connected to the first conductive pattern through the via-hole,

wherein the first conductive pattern further comprises a ring-shaped protrusion surrounding the preset region, and the conductive protection structure is configured to cover the protrusion.

2. The display substrate according to claim 1 , wherein the first conductive pattern is made of Mo or an alloy of Mo, and the conductive protection structure is made of Cu, ITO or IGZO.

3. The display substrate according to claim 1 , wherein a height of the protrusion ranges from 0.05 μm to 0.10 μm, and a thickness of the conductive protection structure ranges from 0.015 μm to 0.02 μm.

4. The display substrate according to claim 1 , wherein a diameter of an outer contour of the orthographic projection of the conductive protection structure onto the base substrate is D, a diameter of an outer contour of an orthographic projection of the protrusion onto the base substrate is d, and D is larger than d by 2 μm to 3 μm.

5. The display substrate according to claim 1 , wherein the second conductive pattern is in contact with the preset region of the first conductive pattern through the via-hole, to enable the second conductive pattern to electrically connect to the first conductive pattern.

6. The display substrate according to claim 1 , wherein a cross-section of the via-hole is of a circular or square shape.

7. The display substrate according to claim 1 , wherein the conductive protection structure is connected to the protrusion in parallel.

8. A display device comprising the display substrate according to claim 1 .

9. The display substrate according to claim 1 , wherein the first conductive pattern is a pattern of a light-shielding metal layer, and the second conductive pattern is a pattern of a source-drain metal layer.

10. The display substrate according to claim 9 , further comprising:

the pattern of the light-shielding metal layer located on the base substrate;

the conductive protection structure located on a side of the pattern of the light-shielding metal layer away from the base substrate;

a buffer layer located on a side of the pattern of the light-shielding metal and the conductive protection structure away from the base substrate;

an active layer located on a side of the buffer layer away from the base substrate;

a gate insulation layer located on a side of the active layer away from the base substrate;

a pattern of a gate metal layer located on a side of the gate insulation layer away from the base substrate;

an interlayer insulation layer located on a side of the pattern of the gate metal layer away from the base substrate, wherein the buffer layer and the interlayer insulation layer constitute the insulation layer;

the pattern of the source-drain metal layer located on a side of the interlayer insulation layer away from the base substrate, wherein the pattern of the source-drain metal layer is electrically connected to the pattern of the light-shielding metal layer through the via-hole penetrating the buffer layer and the interlayer insulation layer; and

a passivation layer located on a side of the pattern of the source-drain metal layer away from the base substrate.

11. A method for forming a display substrate, comprising:

forming a first conductive pattern on a base substrate;

forming a ring-shaped conductive protection structure at an edge of a preset region of the first conductive pattern and surrounding the preset region, wherein the conductive protection structure is made of an anti-dry-etching material;

forming an insulation layer covering the first conductive pattern;

performing a dry-etching on the insulation layer to form a via-hole penetrating the insulation layer, wherein an orthographic projection of the via-hole onto the base substrate is surrounded by an orthographic projection of the conductive protection structure onto the base substrate, and the orthographic projection of the via-hole onto the base substrate partially overlaps the orthographic projection of the conductive protection structure onto the base substrate; and

forming a second conductive pattern on the insulation layer, wherein the second conductive pattern is electrically connected to the first conductive pattern through the via-hole,

wherein the forming the first conductive pattern on the base substrate comprises:

forming a ring-shaped protrusion surrounding the preset region on a surface of the first conductive pattern facing the insulation layer;

the forming the conductive protection structure comprises: forming the conductive protection structure covering the protrusion.

12. The method according to claim 11 , wherein the first conductive pattern is made of Mo or an alloy of Mo, and the conductive protection structure is made of Cu, ITO or IGZO.

13. The method according to claim 11 , wherein the first conductive pattern is a pattern of a light-shielding metal layer, and the second conductive pattern is a pattern of a source-drain metal layer.

14. The method according to claim 13 , further comprising:

forming the pattern of the light-shielding metal layer on the base substrate;

forming the conductive protection structure on a side of the pattern of the light-shielding metal layer away from the base substrate;

forming a buffer layer on a side of the pattern of the light-shielding metal and the conductive protection structure away from the base substrate;

forming an active layer on a side of the buffer layer away from the base substrate;

forming a gate insulation layer on a side of the active layer away from the base substrate;

forming a pattern of a gate metal layer on a side of the gate insulation layer away from the base substrate;

forming an interlayer insulation layer on a side of the pattern of the gate metal layer away from the base substrate, wherein the buffer layer and the interlayer insulation layer constitute the insulation layer;

forming the pattern of the source-drain metal layer on a side of the interlayer insulation layer away from the base substrate, wherein the pattern of the source-drain metal layer is electrically connected to the pattern of the light-shielding metal layer through the via-hole penetrating the buffer layer and the interlayer insulation layer; and

forming a passivation layer on a side of the pattern of the source-drain metal layer away from the base substrate.

15. The method according to claim 11 , wherein the first conductive pattern further comprises a ring-shaped protrusion surrounding the preset region, and the conductive protection structure is configured to cover the protrusion.

16. The method according to claim 15 , wherein a height of the protrusion ranges from 0.05 μm to 0.10 μm, and a thickness of the conductive protection structure ranges from 0.015 μm to 0.02 μm.

17. The method according to claim 15 , wherein a diameter of an outer contour of the orthographic projection of the conductive protection structure onto the base substrate is D, a diameter of an outer contour of an orthographic projection of the protrusion onto the base substrate is d, and D is larger than d by 2 μm to 3 μm.

18. The method according to claim 15 , wherein the second conductive pattern is in contact with the preset region of the first conductive pattern through the via-hole, to enable the second conductive pattern to electrically connect to the first conductive pattern.

19. A method for forming a display substrate, comprising:

forming a first conductive pattern on a base substrate;

forming a ring-shaped conductive protection structure at an edge of a preset region of the first conductive pattern and surrounding the preset region, wherein the conductive protection structure is made of an anti-dry-etching material;

forming an insulation layer covering the first conductive pattern;

performing a dry-etching on the insulation layer to form a via-hole penetrating the insulation layer, wherein an orthographic projection of the via-hole onto the base substrate is surrounded by an orthographic projection of the conductive protection structure onto the base substrate, and the orthographic projection of the via-hole onto the base substrate partially overlaps the orthographic projection of the conductive protection structure onto the base substrate; and

forming a second conductive pattern on the insulation layer, wherein the second conductive pattern is electrically connected to the first conductive pattern through the via-hole,

wherein the first conductive pattern further comprises a ring-shaped protrusion surrounding the preset region, and the conductive protection structure is configured to cover the protrusion.