Antenna packaged substrate and manufacturing method thereof, packaged antenna, and terminal

1. An antenna packaged substrate, comprising:

a substrate;

a first antenna radiating patch disposed on a surface of the substrate;

a second antenna radiating patch disposed over the first antenna radiating patch; and

a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch, wherein the dielectric stack comprises a first dielectric layer, a bonding layer disposed on a side of the first dielectric layer that faces the first antenna radiating patch, and a second dielectric layer disposed on a side of the first dielectric layer that faces the second antenna radiating patch, wherein

a dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer.

2. The antenna packaged substrate according to claim 1 , wherein a material of the first dielectric layer comprises a polytetrafluoroethylene material.

3. The antenna packaged substrate according to claim 2 , wherein the material of the first dielectric layer further comprises a filler added to the polytetrafluoroethylene material, and the filler is used to enhance rigidity of the first dielectric layer.

4. The antenna packaged substrate according to claim 3 , wherein the filler comprises at least one of glass powder, ceramic powder, or glass fiber cloth.

5. The antenna packaged substrate according to claim 1 , wherein a value range of a proportion of a thickness of the first dielectric layer to a total thickness of the dielectric stack is 80% to 90%.

6. The antenna packaged substrate according to claim 1 , wherein the second dielectric layer comprises a resin sheet containing glass fiber cloth.

7. The antenna packaged substrate according to claim 1 , wherein an expansion coefficient of the second dielectric layer ranges from 6 PPM to 10 PPM.

8. The antenna packaged substrate according to claim 1 , wherein the bonding layer comprises a resin sheet.

9. The antenna packaged substrate according to claim 1 , wherein a material of the substrate comprises a resin material.

10. The antenna packaged substrate according to claim 9 , wherein a thickness of the substrate ranges from 220 μm to 280 μm.

11. The antenna packaged substrate according to claim 1 , wherein the antenna packaged substrate further comprises a plurality of copper sheets disposed on a side of the dielectric stack that faces away from the substrate, wherein the copper sheets are suspended or grounded, and the copper sheets are electrically insulated from the second antenna radiating patch.

12. The antenna packaged substrate according to claim 1 , wherein the antenna packaged substrate further comprises:

a functional stack disposed on a side of the substrate that is opposite to a side on which the first antenna radiating patch is located, and in a direction perpendicular to and gradually away from the substrate, wherein the functional stack comprises a ground shielding layer, a first insulation layer, a feeder layer, a second insulation layer, a signal output layer, and a third insulation layer;

a first feeding structure disposed between the first antenna radiating patch and the feeder layer, wherein the first feeding structure penetrates the substrate and the first insulation layer, a first end of the first feeding structure is electrically connected to the first antenna radiating patch, a second end of the first feeding structure is electrically connected to the feeder layer, and the first feeding structure is electrically insulated from the ground shielding layer; and

a second feeding structure disposed on a side of the feeder layer that faces away from the substrate, wherein the second feeding structure penetrates the second insulation layer and the third insulation layer, one end of the second feeding structure close to the feeder layer is electrically connected to the feeder layer, and the second feeding structure is electrically insulated from the signal output layer.

13. A packaged antenna, comprising:

a radio frequency integrated circuit;

a substrate;

a first antenna radiating patch disposed on a surface of the substrate;

a second antenna radiating patch disposed over the first antenna radiating patch; and

a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch, wherein the dielectric stack comprises a first dielectric layer, a bonding layer disposed on a side of the first dielectric layer that faces the first antenna radiating patch, and a second dielectric layer disposed on a side of the first dielectric layer that faces the second antenna radiating patch, wherein

a dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer, and the radio frequency integrated circuit is mounted on a side that is opposite to a side on which the second antenna radiating patch is located.

14. A terminal, comprising:

a circuit board, wherein the terminal further comprises a packaged antenna mounted on the circuit board, the packaged antenna comprising:

a radio frequency integrated circuit;

a substrate;

a first antenna radiating patch disposed on a surface of the substrate;

a second antenna radiating patch disposed over the first antenna radiating patch; and

a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch, wherein the dielectric stack comprises a first dielectric layer, a bonding layer disposed on a side of the first dielectric layer that faces the first antenna radiating patch, and a second dielectric layer disposed on a side of the first dielectric layer that faces the second antenna radiating patch, wherein

a dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer, and the radio frequency integrated circuit is mounted on a side that is opposite to a side on which the second antenna radiating patch is located and faces the circuit board.

15. The terminal of claim 14 , wherein a material of the first dielectric layer comprises a polytetrafluoroethylene material.

16. The terminal of claim 15 , wherein the material of the first dielectric layer further comprises a filler added to the polytetrafluoroethylene material, and the filler is used to enhance rigidity of the first dielectric layer.

17. The terminal of claim 16 , wherein the filler comprises at least one of glass powder, ceramic powder, or glass fiber cloth.

18. The terminal of claim 14 , wherein a value range of a proportion of a thickness of the first dielectric layer to a total thickness of the dielectric stack is 80% to 90%.

19. The terminal of claim 14 , wherein the second dielectric layer comprises a resin sheet containing glass fiber cloth.

20. A method of manufacturing an antenna packaged substrate, comprising:

providing a substrate, and manufacturing a first antenna radiating patch on a surface of the substrate;

forming a dielectric stack on the first antenna radiating patch, wherein in a direction perpendicular to and gradually away from the substrate, the dielectric stack comprises a bonding layer, a first dielectric layer, and a second dielectric layer, wherein a dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer; and

manufacturing a second antenna radiating patch on a surface that is of the dielectric stack and faces away from the substrate.