IP Library Granted Patent US 11,637,383
Granted Patent B2
US 11,637,383 · App. 17/269,251 · Granted Apr 25, 2023

Structure, antenna, wireless communication module, and wireless communication device

Inventors: Nobuki Hiramatsu (Yokohama, JP); Hiroshi Uchimura (Kagoshima, JP); Masamichi Yonehara (Yokohama, JP); Sunao Hashimoto (Yokohama, JP)
Assignee: KYOCERA CORPORATION
H01Q21/065H01Q1/48H01Q3/2617H01Q19/005
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Quick Facts
Patent No.
US 11,637,383
App. No.
17/269,251
Granted
Apr 25, 2023
Kind
B2
Abstract

A structure includes first to fourth conductors. The first conductor extends along a second plane including a second direction and a third direction intersecting with the second direction. The second conductor faces the first conductor along a first direction intersecting with the second plane and extends along the second plane. The third conductor capacitively connects the first conductor and the second conductor. The fourth conductor is electrically connected to the first conductor and the second conductor, and extends along a first plane including the first direction and the third direction. The third conductor includes a first conductive layer and a second conductive layer capacitively connected to the first conductive layer. The second conductive layer is positioned between the first conductive layer and the fourth conductor in the second direction. The first conductive layer has more thickness in the second direction as compared to thickness of the second conductive layer.

Claims (50)

1. A structure comprising:

a first conductor that extends along a second plane, the second plane including a second direction and a third direction, the third direction intersecting with the second direction;

a second conductor that faces the first conductor along a first direction intersecting with the second plane, and that extends along the second plane;

a third conductor that is configured to capacitively connect the first conductor and the second conductor; and

a fourth conductor that is electrically connected to the first conductor and the second conductor, and that extends along a first plane, the first plane including the first direction and the third direction, wherein

the third conductor includes

a first conductive layer, and

a second conductive layer that is configured to be capacitively connected to the first conductive layer,

the second conductive layer is positioned between the first conductive layer and the fourth conductor in the second direction, and

the first conductive layer has more thickness in the second direction as compared to thickness of the second conductive layer.

2. The structure according to claim 1 , further comprising a first dielectric layer that is positioned between the first conductive layer and the second conductive layer, wherein

the second conductive layer has less thickness in the second direction as compared to thickness of the first dielectric layer.

3. The structure according to claim 1 , wherein

the second conductive layer includes

a first surface that faces the first conductive layer in the second direction, and

a second surface that faces an opposite direction of the first surface in the second direction, and

asperity of the first surface is lower than asperity of the second surface.

4. The structure according to claim 1 , wherein

the first conductive layer includes

a third surface that faces the second conductive layer in the second direction, and

a fourth surface that faces an opposite direction of the third surface in the second direction, and

asperity of the third surface is higher than asperity of the fourth surface.

5. The structure according to claim 4 , wherein

the first conductive layer includes a plurality of first patches arranged along the first plane, and

in each of the plurality of first patches, an area of the third surface is greater than an area of the fourth surface.

6. The structure according to claim 5 , wherein

the second conductive layer includes at least one second patch, and

the second patch is configured to be capacitively coupled with a plurality of first patches arranged in the third direction from among the plurality of first patches.

7. The structure according to claim 1 , wherein

the first conductive layer includes a plurality of first patches arranged along the first plane, and

in each of the plurality of first patches, an area of a third surface that faces the second conductive layer in the second direction is greater than an area of a fourth surface that faces an opposite direction of the second conductive layer in the second direction.

8. The structure according to claim 7 , wherein, in each of the plurality of first patches, at least one of lateral faces when viewed from the second direction has shape of an arc.

9. The structure according to claim 5 , wherein

the second conductive layer includes at least one second patch, and

the second patch is configured to be capacitively coupled with a plurality of first patches arranged in the third direction from among the plurality of first patches.

10. The structure according to claim 1 , wherein

the first conductive layer includes a plurality of first patches arranged along the first plane, and

in each of the plurality of first patches, at least one of lateral faces when viewed from the second direction has shape of an arc.

11. The structure according to claim 10 , wherein

the second conductive layer includes at least one second patch, and

the second patch is configured to be capacitively coupled with a plurality of first patches arranged in the third direction from among the plurality of first patches.

12. An antenna comprising:

the structure according to claim 1 ; and

a feeding line that is configured to electromagnetically feed electric power to the third conductor.

13. A wireless communication module comprising:

the antenna according to claim 12 ; and

an RF module that is connected to the feeding line.

14. A wireless communication device comprising:

the wireless communication module according to claim 13 ; and

a battery that is configured to supply electric power to the wireless communication module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2021
From: HIRAMATSU, NOBUKI; UCHIMURA, HIROSHI; YONEHARA, MASAMICHI; HASHIMOTO, SUNAO
To: KYOCERA CORPORATION
Reel/Frame 055327/0410 →
Priority Claims (1)
JP JP2018-157861 · Aug 24, 2018 · national
Continuity (1)
Related Publication 20210336353A1 · Oct 28, 2021