Circuit module and interposer

1. An interposer used in a circuit module including a circuit board including a main surface, a first external element, and a second external element, the interposer comprising:

an element body including a first surface;

a first interposer terminal and a third interposer terminal provided on the first surface and connected to the first external element;

a second interposer terminal and a fourth interposer terminal provided on the first surface and connected to the second external element;

both of a first wiring and a second wiring, the first wiring being provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the circuit board with each other, and the second wiring being provided in the element body and/or on the surface of the element body, and electrically connecting the second interposer terminal and the circuit board with each other; and

a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the third interposer terminal and the fourth interposer terminal with each other; wherein

no second bypass wiring is provided in or on the element body and electrically connecting a ground conductor of the first external element and a ground conductor of the second external element with each other;

the third interposer terminal and the fourth interposer terminal do not electrically connect to the circuit board by wiring located in the element body;

the third interposer terminal is electrically connected to a signal line of the first external element and is not electrically connected to a ground terminal of the first external element;

the third interposer terminal is not connected to a ground terminal of the interposer;

the element body includes a mounting surface and a top surface defining the first surface, the mounting surface and the top surface being opposite to each other;

the mounting surface opposes the main surface of the circuit board, and is located closer to the main surface than to the top surface in a direction in which the mounting surface opposes the main surface; and

the first external element and the second external element include a ground conductor not connected to the bypass wiring and connected to the circuit board.

2. A circuit module comprising:

a circuit board including a main surface; and

an interposer mounted on the main surface of the circuit board; wherein

the interposer includes:

an element body including a first surface;

a first interposer terminal and a third interposer terminal provided on the first surface of the element body and connected to a first external element;

a second interposer terminal and a fourth interposer terminal provided on the first surface of the element body and connected to a second external element;

both of a first wiring and a second wiring, the first wiring being provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the circuit board with each other, and the second wiring being provided in the element body and/or on the surface of the element body, and electrically connecting the second interposer terminal and the circuit board with each other; and

a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the third interposer terminal and the fourth interposer terminal with each other;

no second bypass wiring is provided in or on the element body and electrically connecting a ground conductor of the first external element and a ground conductor of the second external element with each other;

the third interposer terminal and the fourth interposer terminal do not electrically connect to the circuit board by wiring located in the element body;

the third interposer terminal is electrically connected to a signal line of the first external element and is not electrically connected to a ground terminal of the first external element;

the third interposer terminal is not connected to a ground terminal of the interposer;

the element body includes a mounting surface and a top surface defining the first surface, the mounting surface and the top surface being opposite to each other;

the mounting surface opposes the main surface of the circuit board, and is located closer to the main surface than to the top surface in a direction in which the mounting surface opposes the main surface; and

the first external element and the second external element include a ground conductor not connected to the bypass wiring and connected to the circuit board.

3. An interposer used in a circuit module including a circuit board including a main surface, a first external element, and a second external element, the interposer comprising:

an element body including a first surface;

a first interposer terminal and a third interposer terminal provided on the first surface and connected to the first external element;

a second interposer terminal and a fourth interposer terminal provided on the first surface and connected to the second external element;

at least one of a first wiring and a second wiring, the first wiring being provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the circuit board with each other, and the second wiring being provided in the element body and/or on the surface of the element body, and electrically connecting the second interposer terminal and the circuit board with each other; and

a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the third interposer terminal and the fourth interposer terminal with each other; wherein

no second bypass wiring is provided in or on the element body and electrically connecting a ground conductor of the first external element and a ground conductor of the second external element with each other;

a first ground terminal is disposed so as to surround the first and third interposer terminals and a second ground terminal is disposed so as to surround the second and fourth interposer terminals;

the third interposer terminal is electrically connected to a signal line of the first external element and is not electrically connected to a ground terminal of the first external element;—

the third interposer terminal is not connected to a ground terminal of the interposer;

the element body includes a mounting surface and a top surface defining the first surface, the mounting surface and the top surface being opposite to each other;

the mounting surface opposes the main surface of the circuit board, and is located closer to the main surface than to the top surface in a direction in which the mounting surface opposes the main surface; and

the first external element and the second external element include a ground conductor not connected to the bypass wiring and connected to the circuit board.

4. A circuit module comprising:

a circuit board including a main surface; and

an interposer mounted on the main surface of the circuit board; wherein

the interposer includes:

an element body including a first surface;

a first interposer terminal and a third interposer terminal provided on the first surface of the element body and connected to a first external element;

a second interposer terminal and a fourth interposer terminal provided on the first surface of the element body and connected to a second external element;

at least one of a first wiring and a second wiring, the first wiring being provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the circuit board with each other, and the second wiring being provided in the element body and/or on the surface of the element body, and electrically connecting the second interposer terminal and the circuit board with each other; and

a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the third interposer terminal and the fourth interposer terminal with each other;

no second bypass wiring is provided in or on the element body and electrically connecting a ground conductor of the first external element and a ground conductor of the second external element with each other;

a first ground terminal is disposed so as to surround the first and third interposer terminals and a second ground terminal is disposed so as to surround the second and fourth interposer terminals;

the third interposer terminal is electrically connected to a signal line of the first external element and is not electrically connected to a ground terminal of the first external element;—

the third interposer terminal is not connected to a ground terminal of the interposer;

the element body includes a mounting surface and a top surface defining the first surface, the mounting surface and the top surface being opposite to each other;

the mounting surface opposes the main surface of the circuit board, and is located closer to the main surface than to the top surface in a direction in which the mounting surface opposes the main surface; and

the first external element and the second external element include a ground conductor not connected to the bypass wiring and connected to the circuit board.