Semiconductor package having liquid-cooling lid
A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.
1. A semiconductor package, comprising:
a substrate;
a die mounted on a top surface of the substrate in a flip-chip fashion;
a lid mounted on the die and on a perimeter of the substrate, wherein the lid comprises a cover plate and four walls formed integral with the cover plate, wherein the lid comprises half-etched trenches recessed into a lower surface of the cover plate; and
a liquid-cooling channel situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.
2. The semiconductor package according to claim 1 , wherein the cover plate is directly secured to the rear surface of the die with an adhesive layer.
3. The semiconductor package according to claim 1 , wherein the liquid-cooling channel is constructed by combining the trenched feature and the rear surface of the die.
4. The semiconductor package according to claim 1 , wherein the coolant in the liquid-cooling channel is in direct contact with the rear surface of the die during operation.
5. The semiconductor package according to claim 1 , wherein the liquid-cooling channel is buried within the cover plate of the lid.
6. The semiconductor package according to claim 5 , wherein the coolant in the liquid-cooling channel is not in direct contact with the rear surface of the die during operation.
7. The semiconductor package according to claim 1 , wherein a liquid inlet and a liquid outlet are provided in the lid, which communicate with the liquid-cooling channel.
8. The semiconductor package according to claim 7 , wherein the liquid inlet and the liquid outlet are disposed in an upper surface of the cover plate.
9. The semiconductor package according to claim 7 , wherein the liquid inlet and the liquid outlet are disposed in at least one of the four walls.
10. The semiconductor package according to claim 7 , wherein the liquid inlet and the liquid outlet are through holes with threaded inner surface.
11. The semiconductor package according to claim 1 , wherein the die is underfilled with an encapsulant material.
12. The semiconductor package according to claim 1 , wherein a plurality of solder balls is disposed on a bottom surface of the substrate.
13. The semiconductor package according to claim 1 , wherein the substrate comprises a packaging substrate.
14. The semiconductor package according to claim 1 , wherein the lid comprises aluminum, copper or an alloy thereof.