Bridge pick-up head for transferring semiconductor devices
A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second bridge leg portions each including a top surface and side surfaces, the top surfaces of the first and second bridge leg portions extending above the bridge center portion; a bridge base portion on the bridge center portion, the bridge base portion including a bottom side on the bridge center portion, a top side that is smaller than the bottom side, and one or more sloped surfaces defined between the top and bottom sides; and a tip configured to attach with a semiconductor device on the top side of the bridge base portion.
1. A system, comprising:
a target substrate; and
a pick-up tool (PUT), including:
a first leg portion and a second leg portion;
a bridge base portion between the first leg portion and the second leg portion, the bridge base portion compressed when a force is applied on a semiconductor device; and
a tip protruding away from the bridge base portion, the tip configured to attach with the semiconductor device and place the semiconductor device on the target substrate, the first and second leg portions contacting the target substrate when the semiconductor device is placed on the target substrate, the bridge base portion and the tip apply the force on the semiconductor device toward the target substrate, the first and second leg portions extend below the tip when the bridge base portion is compressed to adhere with the target substrate and hold the semiconductor device to a target location on the target substrate, the tip extending below the first and second leg portions when the bridge base portion is uncompressed.
2. The system of claim 1 , wherein the PUT includes a conformable material.
3. The system of claim 1 , wherein first space is provided between the bridge base portion and the first leg portion, second space is provided between the bridge base portion and the second leg portion, and another semiconductor device previously placed on the target substrate fits within the first space or the second space when the first and second leg portions contact the target substrate.
4. The system of claim 1 , wherein the PUT includes:
a substrate;
a backing layer on the substrate; and
a bridge pick-up head including the first and second leg portions, the bridge base portion, and tip, the bridge pick-up head being on the backing layer.
5. The system of claim 4 , wherein the substrate is formed from a fused silica wafer, the backing layer is formed from polydimethylsiloxane (PDMS), and the bridge pick-up head is formed from PDMS.
6. The system of claim 1 , wherein the PUT is transparent to light.
7. The system of claim 6 , further comprising an imaging device configured to generate an image using light transmitted through the PUT to align the semiconductor device attached with the PUT with a target location on the target substrate.
8. The system of claim 1 , wherein at least one of the first and second bridge leg portions include an alignment marker.
9. The system of claim 1 , wherein at least one of the first and second bridge leg portions include a displacement feature that deforms to indicate an amount of pressure applied by the PUT.
10. The system of claim 1 , further comprising a target stage that holds the target substrate, the target stage configured to apply heat to the target substrate when the first and second leg portions contact the target substrate to bond contacts of the semiconductor device with contacts of the target substrate.
11. The system of claim 1 , further comprising carrier substrate, and wherein the PUT is configured to pick up the semiconductor device from the carrier substrate.
12. The system of claim 11 , wherein the bridge base portion is uncompressed and the tip extends below the first and second leg portions when the tip contacts and attaches with the semiconductor device on the carrier substrate.
13. A method, comprising:
attaching a semiconductor device to a tip of a pick-up tool (PUT), the PUT including:
a first leg portion and a second leg portion extending below the tip when a bridge base portion is compressed to adhere with a target substrate and hold the semiconductor device to a target location on the target substrate;
the bridge base portion between the first leg portion and the second leg portion, the bridge base portion and the tip apply a force on the semiconductor device toward the target substrate, and the bridge base portion is compressed when the force is applied on the semiconductor device; and
the tip protruding away from the bridge base portion, the tip extending below the first and second leg portions when the bridge base portion is uncompressed; and
placing, by the PUT, the semiconductor device on the target substrate, the first and second leg portions contacting the target substrate when the semiconductor device is placed on the target substrate.
14. The method of claim 13 , wherein the PUT includes a conformable material.
15. The method of claim 13 , wherein first space is provided between the bridge base portion and the first leg portion, second space is provided between the bridge base portion and the second leg portion, and another semiconductor device previously placed on the target substrate fits within the first space or the second space when the first and second leg portions contact the target substrate.
16. The method of claim 13 , wherein:
the PUT is transparent to light; and
the method further includes generating an image using light transmitted through the PUT to align the semiconductor device attached with the PUT with a target location on the target substrate.