Semiconductor device
View Patent ↗A semiconductor device is provided, including a substrate, a seed layer on the substrate, an epitaxial layer on the seed layer, an electrode structure on the epitaxial layer and an electric field modulation structure. The electrode structure includes a gate structure, a source structure and a drain structure, wherein the source structure and the drain structure are positioned on opposite sides of the gate structure. The electric field modulation structure includes an electric connection structure and a conductive layer electrically connected to the electric connection structure. The conductive layer is positioned between the gate structure and the drain structure. The electric connection structure is electrically connected to the source structure and the drain structure.
1. A semiconductor device, comprising:
a substrate;
a seed layer on the substrate;
an epitaxial layer on the seed layer;
an electrode structure on the epitaxial layer, wherein the electrode structure comprises a gate structure and a source structure and a drain structure disposed on opposite sides of the gate structure; and
an electric field modulation structure comprising an electric connection structure and a conductive layer electrically connected to the electric connection structure, wherein the conductive layer is disposed between the source structure and the drain structure and above the electric connection structure and the epitaxial layer, and the electric connection structure is electrically connected to the source structure and the drain structure, wherein a lengthwise direction of the source structure is a first direction and a direction from the source structure to the drain structure is a second direction, wherein the first direction is perpendicular to the second direction,
wherein an electric potential of the conductive layer is different from both an electric potential of the source structure and an electric potential of the drain structure.
2. The semiconductor device as claimed in claim 1 , wherein an electric potential of the conductive layer is between an electric potential of the source structure and an electric potential of the drain structure.
3. The semiconductor device as claimed in claim 1 , wherein the electric field modulation structure extends in the second direction and the conductive layer extends in the first direction.
4. The semiconductor device as claimed in claim 1 , wherein the electric field modulation structure further comprises a contact electrically connected to the electric connection structure and the conductive layer.
5. The semiconductor device as claimed in claim 1 , wherein the electric field modulation structure further comprises a pair of contacts, one of the contacts electrically connected to the electric connection structure and the source structure, and the other one of the contacts electrically connected to the electric connection structure and the drain structure.
6. The semiconductor device as claimed in claim 1 , wherein the electric connection structure is a two-dimensional electron gas (2DEG) in the epitaxial layer.
7. The semiconductor device as claimed in claim 1 , wherein the gate structure and the drain structure define an access region, wherein the electric connection structure is disposed outside the access region and the conductive layer spans over the access region.
8. The semiconductor device as claimed in claim 1 , wherein a length of the electric connection structure is greater than a distance between a source electrode of the source structure and a drain electrode of the drain structure.
9. The semiconductor device as claimed in claim 1 , wherein the electric connection structure is in direct contact with the epitaxial layer.
10. The semiconductor device as claimed in claim 1 , wherein the electric connection structure is spaced apart from the epitaxial layer by a dielectric layer.
11. The semiconductor device as claimed in claim 1 , wherein a source electrode of the source structure is electrically connected to the electric connection structure by a source metal layer and a drain electrode of the drain structure is electrically connected to the electric connection structure by a drain metal layer.
12. The semiconductor device as claimed in claim 1 , wherein the electric connection structure and the source structure overlap in the first direction.
13. The semiconductor device as claimed in claim 1 , wherein the source structure completely covers the gate structure.
14. The semiconductor device as claimed in claim 1 , wherein the electric field modulation structure further comprises an another electric connection structure electrically connected to the conductive layer.
15. The semiconductor device as claimed in claim 14 , wherein both ends of the conductive layer electrically connected to the electric connection structures have a same electric potential.
16. The semiconductor device as claimed in claim 14 , wherein both ends of the electric connection structure and the another electric connection structure are electrically connected to the source structure and the drain structure.
17. The semiconductor device as claimed in claim 14 , wherein the electric field modulation structure further comprises an another conductive layer electrically connected to the electric connection structures.
18. The semiconductor device as claimed in claim 1 , wherein the electric connection structure comprises a material of metal or semiconductor.
19. The semiconductor device as claimed in claim 1 , wherein a resistivity of the electric connection structure is between 10 6 Ω and 10 8 Ω.