Spatial composites
A housing of an electronic device includes a substrate defining an external surface and internal surface of the housing, at least one sidewall extending from the substrate, and abrasion-resistant members at least partly embedded in the substrate and extending beyond the external surface. The abrasion-resistant members may be formed from metal or ceramic. The substrate comprises a moldable matrix. The abrasion-resistant members are harder than the moldable matrix.
1. A housing of an electronic device, comprising:
a monolithic substrate formed of a moldable polymer material having a uniform composition and defining:
an external surface and an internal surface of the housing;
a back panel; and
a set of sidewalls extending from the back panel and defining a curved corner portion of the monolithic substrate; and
a plurality of members bonded directly to the monolithic substrate in respective recesses defined in the monolithic substrate, the plurality of members protruding from the external surface and having a hardness greater than a hardness of the monolithic substrate, the plurality of members comprising:
a first set of members protruding from the external surface along the curved corner portion, the first set of members defining a first surface density, each member of the first set of members retained to the monolithic substrate at least in part by a respective undercut defined by the monolithic substrate and in contact with a surface of the member of the first set; and
a second set of members protruding from the external surface along the back panel, the second set of members defining a second surface density, less than the first surface density, and each member of the second set of members retained to the monolithic substrate at least in part by a respective undercut defined by the monolithic substrate and in contact with a surface of the member of the second set.
2. The housing of claim 1 , wherein an average distance between adjacent members of the first set of members is between about 10 and 100 microns.
3. The housing of claim 1 , wherein:
the members of the plurality of members each have a faceted surface; and
the members of the plurality of members are each configured to reflect light at an angle.
4. The housing of claim 1 , wherein the monolithic substrate has a Young's modulus greater than or equal to about 5 GPa.
5. The housing of claim 1 , wherein the members of the plurality of members each have a diameter between about 0.5 and about 5.0 mm.
6. A housing of an electronic device, comprising:
a unitary housing structure formed from a single moldable material and defining:
a back wall of the housing defining a flat portion of an external surface of the housing; and
at least one side wall extending from the back wall and defining a curved portion of the external surface;
a first set of members having first interlocking features and being at least partially embedded in the unitary housing structure such that the first interlocking features mechanically engage first undercuts defined in the single moldable material of the unitary housing structure, the members of the first set positioned in the at least one side wall, defining a first surface density, and each having a portion protruding above the curved portion of the external surface; and
a second set of members having second interlocking features and being at least partially embedded in the unitary housing structure such that the second interlocking features mechanically engage second undercuts defined in the single moldable material of the unitary housing structure, the members of the second set positioned in the back wall, defining a second surface density less than the first surface density, and each having a portion protruding above the flat portion of the external surface of the back wall, and each member of the first and the second sets of members having a hardness value greater than a hardness value of the single moldable material.
7. The housing of claim 6 , wherein the single moldable material has a Young's modulus greater than or equal to 2 GPa.
8. The housing of claim 7 , wherein the single moldable material is a polymer.
9. The housing of claim 7 , wherein the single moldable material is an amorphous metal.
10. The housing of claim 6 , wherein each member of the second set of members has a faceted surface, such that a region of the back wall including the second set of members produces a specular reflection.
11. The housing of claim 6 , wherein the first and the second interlocking features comprise flanges.
12. The housing of claim 6 , wherein:
the second set of members is positioned in a first region of the back wall;
a second region of the back wall is substantially free of members; and
the second region of the back wall corresponds to a location of an antenna within the housing.
13. The housing of claim 6 further comprising connecting elements joining at least a subset of the members of the second set of members to one another.
14. The housing of claim 13 , wherein the subset of the members of the second set of members and the connecting elements are a monolithic structure.
15. The housing of claim 6 , wherein the members of the second set of members are distributed in a regular pattern over the flat portion of the external surface of the back wall.