Radio frequency modules
Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.
1. A packaged radio frequency module comprising:
a radio frequency shielding structure extending above a package substrate;
a first die supported by the package substrate and in an interior of the radio frequency shielding structure, the first die including a radio frequency component;
an antenna supported by the package substrate external to the radio frequency shielding structure;
an oscillator supported by the package substrate, the oscillator disposed between the first die and the package substrate; and
an oscillator assembly including a cavity, the oscillator residing within the cavity.
2. The packaged radio frequency module of claim 1 further comprising an overmold enclosing the first die, the oscillator, and the antenna.
3. The packaged radio frequency module of claim 1 wherein the radio frequency shielding structure includes a plurality of wire bonds.
4. The packaged radio frequency module of claim 1 wherein the first die includes at least a portion of a radio frequency front end.
5. A wireless communication device including the packaged radio frequency module of claim 1 .
6. A packaged radio frequency module comprising:
a radio frequency shielding structure extending above a package substrate;
a first integrated circuit die supported by the package substrate and in an interior of the radio frequency shielding structure;
an antenna supported by the package substrate external to the radio frequency shielding structure; and
a second integrated circuit die supported by the package substrate, the package substrate disposed between the first integrated circuit die and the second integrated circuit die, the first integrated circuit die implementing at least a portion of a radio frequency front end including a radio frequency power amplifier and the second integrated circuit die implementing at least a portion of a radio frequency baseband subsystem.
7. The packaged radio frequency module of claim 6 wherein the antenna is on a same side of the package substrate as the radio frequency shielding structure and the first integrated circuit die.
8. The packaged radio frequency module of claim 7 further comprising an oscillator disposed between the package substrate and the second integrated circuit die.
9. The packaged radio frequency module of claim 6 wherein the radio frequency shielding structure includes a plurality of wire bonds.
10. The packaged radio frequency module of claim 6 further comprising an overmold enclosing the first integrated circuit die and the antenna.
11. A wireless communication device including the packaged radio frequency module of claim 6 .
12. A packaged radio frequency module for use in a wireless communication device, the packaged radio frequency module comprising:
a radio frequency shielding structure extending above a package substrate;
a first wireless device component supported by the package substrate and in an interior of the radio frequency shielding structure;
an antenna supported by the package substrate external to the radio frequency shielding structure; and
a second wireless device component supported by and spaced from the package substrate, at least a portion of the first wireless device component between an overhanging portion of the second wireless device component and the package substrate.
13. The packaged radio frequency module of claim 12 further comprising an overmold enclosing the first wireless device component, the antenna, and the second wireless device component.
14. The packaged radio frequency module of claim 12 wherein the radio frequency shielding structure includes a plurality of wire bonds.
15. A wireless communication device including the packaged radio frequency module of claim 12 .
16. A packaged radio frequency module comprising:
a radio frequency shielding structure extending above a package substrate;
a first die supported by the package substrate and in an interior of the radio frequency shielding structure, the first die including a radio frequency component;
an antenna supported by the package substrate external to the radio frequency shielding structure; and
an oscillator supported by the package substrate, the first die disposed between the oscillator and the package substrate.
17. The packaged radio frequency module of claim 16 , wherein the radio frequency shielding structure includes a plurality of wire bonds.
18. The packaged radio frequency module of claim 16 further comprising an overmold enclosing the first die, the oscillator, and the antenna.
19. A wireless communication device including the packaged radio frequency module of claim 16 .