IP Library Granted Patent US 11,684,253
Granted Patent B2
US 11,684,253 · App. 16/855,393 · Granted Jun 27, 2023

2D multi-layer thickness measurement with reconstructed spectrum

Inventors: Zaixing Mao (Tokyo, JP); Zhenguo Wang (Ridgewood, NJ); Bin Cao (Wayne, NJ); Kinpui Chan (Ridgewood, NJ)
Assignee: TOPCON CORPORATION
A61B3/101A61B3/0025A61B3/14G01B9/02041G01B9/02083G01B11/06G01J3/45
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Quick Facts
Patent No.
US 11,684,253
App. No.
16/855,393
Granted
Jun 27, 2023
Kind
B2
Abstract

A method for determining thickness of layers of the tear film includes reconstructing a full- or hyper-spectral interference pattern from an imaged multi-spectral pattern. Tear film thickness can then be estimated from the full- or hyper-spectral interference pattern. Using a full- or hyper-spectral interference pattern provides a greater number of frequency sampling points for increased tear film thickness estimation accuracy, without traditional time consuming techniques.

Claims (15)

1. A method for measuring layer thickness of a structure comprising:

acquiring a multi-spectral interference pattern of the structure;

performing a hyperspectral reconstruction on the multi-spectral interference pattern, thereby generating a reconstructed full- or hyper-spectral interference pattern; and

estimating the layer thickness based on the reconstructed full- or hyper-spectral interference pattern.

2. The method of claim 1 , wherein the structure is a tear film of an eye.

3. The method of claim 1 , wherein the multi-spectral interference pattern is acquired by capturing a reflected light from the structure with an RGB camera.

4. The method of claim 1 , wherein the multi-spectral interference pattern is acquired by capturing a reflected light from the structure with a dual color camera.

5. The method of claim 1 , wherein the multi-spectral interference pattern is acquired by capturing a reflected light from the structure with a narrow-band multi-spectral camera.

6. The method of claim 1 , wherein the hyperspectral reconstruction on the multi-spectral interference pattern is performed by a machine learning system trained to output the full- or hyper-spectral interference pattern based on an input multi-spectral interference pattern.

7. The method of claim 1 , wherein the layer thickness is estimated by comparing the full- or hyper-spectral interference pattern with a look-up table.

8. The method of claim 1 , wherein the layer thickness is estimated by performing a curve-fitting to the full- or hyper-spectral interference pattern.

9. The method of claim 1 , wherein the layer thickness is estimated by supplying the full- or hyper-spectral interference pattern to a machine learning system trained to output a layer thickness based on the input full- or hyper-spectral interference pattern.

10. The method of claim 1 , further comprising displaying the estimated layer thickness.

11. The method of claim 1 , wherein the acquired multi-spectral interference pattern is out of focus, and the method further comprises focusing the out-of-focus multi-spectral interference pattern prior to performing the hyperspectral reconstruction.

12. The method of claim 11 , wherein the focusing is performed by a machine learning system trained to output an in-focus multi-spectral interference pattern based on an input out-of-focus multi-spectral interference pattern.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2020
From: MAO, ZAIXING; WANG, ZHENGUO; CAO, BIN; CHAN, KINPUI
To: TOPCON CORPORATION
Reel/Frame 052486/0672 →
Continuity (2)
Provisional Application 62837785 · Apr 24, 2019
Related Publication 20200337553A1 · Oct 29, 2020