Placing table and substrate processing apparatus
A placing table, on which a substrate is placed, includes a base. The base includes a first path configured to allow a heat transfer medium having a first temperature to flow therein; a first heat insulating layer disposed under the first path; and a seal member disposed under the first heat insulating layer.
1. A placing table, comprising:
a insulating support;
a base integrally formed and disposed on the insulating support;
a first path disposed within the base and configured to allow a heat transfer medium having a first temperature to flow therein;
a second path disposed within the base and configured to allow a heat transfer medium having a second temperature to flow therein and not communicating with the first path,
wherein the base comprises therein a first hollow space surrounding a side portion of the first path and formed between the first path and the second path, and a second hollow space surrounding a side portion of the second path and formed at a lower portion of the second path.
2. The placing table of claim 1 , further comprising:
a gas supply line connected to a bottom surface of the base;
a first O-ring disposed between the bottom surface of the base and a top surface of the insulating support; and
a second O-ring disposed between the bottom surface of the base and a joint portion of the gas supply line.
3. The placing table of claim 2 ,
wherein the first path has a fin structure or a lattice structure.
4. The placing table of claim 3 ,
wherein the second path has a fin structure or a lattice structure.
5. The placing table of claim 4 ,
the first hollow space is controlled to have a pressure lower than an atmospheric pressure.
6. The placing table of claim 5 ,
the second hollow space is controlled to have a pressure lower than an atmospheric pressure.
7. The placing table of claim 1 ,
wherein the second temperature is higher than the first temperature.
8. The placing table of claim 6 ,
wherein the base is formed by a 3D printer technology or an additive manufacturing technology.
9. A substrate processing apparatus comprising:
a processing vessel;
a insulating support within the processing vessel;
a base integrally formed and disposed on the insulating support;
a first path disposed within the base and configured to allow a heat transfer medium having a first temperature to flow therein;
a second path disposed within the base and configured to allow a heat transfer medium having a second temperature to flow therein and not communicating with the first path;
a gas supply line connected to a bottom surface of the base;
a first O-ring disposed between the bottom surface of the base and a top surface of the insulating support; and
a second O-ring disposed between the bottom surface of the base and a joint portion of the gas supply line,
wherein the base comprises therein a first hollow space surrounding a side portion of the first path and formed between the first path and the second path, and a second hollow space surrounding a side portion of the second path and formed at a lower portion of the second path.
10. The placing table of claim 1 ,
wherein the first temperature is equal to or lower than −100° C., and
wherein the second temperature is equal to or larger than 0° C.
11. The substrate processing apparatus of claim 9 ,
wherein the first temperature is equal to or lower than −100° C., and
wherein the second temperature is equal to or larger than 0° C.