IP Library Granted Patent US 11,767,409
Granted Patent B2
US 11,767,409 · App. 17/226,282 · Granted Sep 26, 2023

Reduced density hollow glass microsphere polymer composite

Inventors: Kurt Heikkila (Marine on the St. Croix, MN); Rodney Williams (Stacy, MN); John Kroll (Blaine, MN)
Assignee: Tundra Composites, LLC
C08K3/22B60C1/00C08J5/04C08K7/28C08K9/00C08K9/04C08L21/00C08J2327/16C08J2327/18C08J2327/20C08K2003/2227C08K2201/005Y10T428/249974
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,767,409
App. No.
17/226,282
Granted
Sep 26, 2023
Kind
B2
Abstract

The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.

Claims (19)

1. A melt processing method of manufacturing a hollow glass microsphere and polymer composite from a mixture, said method comprising:

(a) pre-treating a hollow glass microsphere with an effective composite forming amount of an interfacial modifier coating; wherein the interfacial modifier is free of a coupling agent; and wherein the hollow glass microsphere has a particle size of at least about 5 microns;

(b) combining a thermoplastic polymer phase with about 30 to 95 volume % of the pre-treated interfacial modifier coated hollow glass microsphere, in an amount that can substantially occupy excluded volume of a hollow glass microsphere particle distribution in the composite; and

(c) melt process compounding the mixture to form the composite comprising the pre-treated hollow glass microspheres within the thermoplastic polymer phase;

wherein the hollow glass microsphere exhibits a circularity greater than 13 and an aspect ratio less than 1:3; and wherein the interfacial modifier coating allows for greater freedom of movement between the pre-treated hollow glass microsphere within the polymer phase compared to the same composite without the interfacial modifier coating on the hollow glass microsphere, when measured under the same conditions.

2. The method according to claim 1 , wherein about 40 to 70 volume % of the hollow glass microsphere composite comprises the thermoplastic polymer phase.

3. The method according to claim 1 , wherein the composite comprises about 0.02 to 3 wt.-% of the interfacial modifier.

4. The method of claim 1 wherein the thermoplastic polymer phase has a density of about 0.86 gm-cm −3 .

5. The method of claim 1 , wherein the composite has a density of about 0.4 to 5 gm-cm −3 .

6. The method of claim 1 wherein the composite additionally comprises a solid particulate or a fiber, the particulate having a particle size (P s ) of about 5 to 1000 microns and the fiber having an aspect ratio of greater than 10.

7. The method of claim 1 wherein after compounding, the method includes extruding the composite.

8. The method of claim 1 wherein the thermoplastic polymer phase comprises a polyamide, poly (ethylene-co-vinyl acetate), a synthetic rubber, a polyvinyl chloride, a fluoropolymer, a polyolefin, a thermoset polymer.

9. The method according to claim 1 , wherein said melt processing comprises injection molding the composite.

10. The method according to claim 1 , wherein said melt processing comprises compression molding the composite.

11. The composite of claim 1 wherein the composite has a tensile strength of about 0.1 to 10 times that of the thermoplastic polymer phase.

12. The composite of claim 1 wherein the composite has a tensile elongation of about 15% to 90% of the thermoplastic polymer phase.

13. The composite of claim 1 wherein the composite has a thermoplastic shear at least about 5 sec −1 .

14. The composite formulation of claim 1 wherein the composite has a tensile strength of at least 0.2 MPa and a thermoplastic shear of at least 5 sec −1 .

15. The composite of claim 1 wherein the hollow glass microsphere has a particle size P S of about 5 to 300 microns.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2024
From: WILLIAMS, RODNEY S
To: MORGAN, FRED
Reel/Frame 066102/0346 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2024
From: KROLL, JOHN S
To: MORGAN, FRED
Reel/Frame 066102/0401 →
Continuity (6)
Continuation 16546831 · Aug 21, 2019
Continuation 15680835 · Aug 18, 2017
Continuation 14965997 · Dec 11, 2015
Continuation 12769553 · Apr 28, 2010
Provisional Application 61173791 · Apr 29, 2009
Related Publication 20210301100A1 · Sep 30, 2021