Direct filter hybridization for an optical sensor and filter assembly

1. An optical sensor and filter assembly, comprising:

an optical sensor comprising a detector layer having first and second opposed faces and a read-out integrated circuit (ROIC) to which the first face of the detector layer is hybridized;

a filter that permits passage of one or more wavelength bands of interest of incident light toward the optical sensor; and

a mounting structure by which the filter is directly hybridized to the second face of the detector layer,

wherein the mounting structure comprises Indium strips disposed along each of the sides of the filter and Indium spheres disposed in each of the corners of the filter.

2. The optical sensor and filter assembly according to claim 1 , wherein:

the optical sensor is planar and the filter comprises a planar spectral filter, and

the optical sensor and filter assembly further comprises cold-welded interconnects by which the first face of the detector layer is hybridized to the ROIC.

3. The optical sensor and filter assembly according to claim 1 , wherein the filter comprises one or more of Germanium (Ge), sapphire and diamond.

4. The optical sensor and filter assembly according to claim 1 , wherein a gap between the filter and the second face of the detector layer is 0.005″.

5. The optical sensor and filter assembly according to claim 1 , wherein in-plane dimensions of the filter are substantially similar to in-plane dimensions of the detector layer.

6. The optical sensor and filter assembly according to claim 1 , further comprising:

a base on which the ROIC is disposed; and

a lid affixed to the base to define an interior in which the ROIC, the detector layer, the filter and the mounting structure are disposed.

7. An optical sensor and filter assembly, comprising:

an optical sensor comprising a detector layer having first and second opposed faces and a read-out integrated circuit (ROIC) to which the first face of the detector layer is hybridized;

a filter that has substantially similar in-plane dimensions as the detector layer and that permits passage of one or more wavelength bands of interest of incident light toward the optical sensor; and

a mounting structure by which the filter is directly hybridized and precisely mapped to the second face of the detector layer,

wherein the mounting structure comprises Indium strips disposed along each of the sides of the filter and Indium spheres disposed in each of the corners of the filter.

8. The optical sensor and filter assembly according to claim 7 , wherein the optical sensor is planar and the filter comprises a planar spectral filter.

9. The optical sensor and filter assembly according to claim 8 , further comprising cold-welded interconnects by which the first face of the detector layer is hybridized to the ROIC.

10. The optical sensor and filter assembly according to claim 7 , wherein the filter comprises one or more of Germanium (Ge), sapphire and diamond.

11. The optical sensor and filter assembly according to claim 7 , wherein a gap between the filter and the second face of the detector layer is 0.005″.

12. The optical sensor and filter assembly according to claim 7 , further comprising:

a base on which the ROIC is disposed; and

a lid affixed to the base to define an interior in which the ROIC, the detector layer, the filter and the mounting structure are disposed.

13. A method of assembling an optical sensor and filter assembly, comprising:

hybridizing a first face of a detector layer to a read-out integrated circuit (ROIC); and

directly hybridizing and precisely mapping a filter that has substantially similar in-plane dimensions as the detector layer and that permits passage of one or more wavelength bands of interest of incident light toward the optical sensor, to a second face of the detector layer, which is opposite the first face,

wherein the direct hybridizing and precise mapping of the filter to the second face of the detector layer comprises:

depositing Indium strips along sides of the filter and Indium spheres in corners of the filter; and

pressing the filter onto the second face of the detector layer with the Indium strips and the Indium spheres between the filter and the detector layer.

14. The method according to claim 13 , wherein the hybridizing of the first face of the detector layer to the ROIC comprises cold-welding.

15. The method according to claim 13 , wherein the filter comprises one or more of Germanium (Ge), sapphire and diamond.

16. The method according to claim 13 , wherein the pressing is conducted such that a gap between the filter and the second face of the detector layer is about 0.005″.

17. The optical sensor and filter assembly according to claim 1 , wherein:

each corner of the filter is chamfered,

each of the Indium strips has opposite ends that respectively terminate at chamfering of a corresponding one of the corners, and

each of the Indium spheres is interposed diagonally between a pair of ends of the Indium strips along the chamfering of the corresponding one of the corners.

18. The optical sensor and filter assembly according to claim 7 , wherein:

each corner of the filter is chamfered,

each of the Indium strips has opposite ends that respectively terminate at chamfering of a corresponding one of the corners, and

each of the Indium spheres is interposed diagonally between a pair of ends of the Indium strips along the chamfering of the corresponding one of the corners.

19. The method according to claim 13 , further comprising:

chamfering each corner of the filter;

positioning each of the Indium strips such that opposite ends thereof respectively terminate at chamfering of a corresponding one of the corners, and

diagonally interposing each of the Indium spheres between a pair of ends of the Indium strips along the chamfering of the corresponding one of the corners.