Vertical memory devices

1. A vertical memory device comprising:

a gate electrode structure including gate electrodes spaced apart from each other on a substrate in a first direction substantially perpendicular to an upper surface of the substrate, each of the gate electrodes extending in a second direction substantially parallel to the upper surface of the substrate;

a channel extending in the first direction through the gate electrode structure;

an insulation pattern structure extending through the gate electrode structure;

an etch stop structure extending through the gate electrode structure and surrounding at least a portion of a sidewall of the insulation pattern structure, the etch stop structure including a filling pattern and an etch stop pattern on a sidewall of the filling pattern;

a through via extending in the first direction through the insulation pattern structure;

a first division pattern at each of opposite sides of the gate electrode structure in a third direction substantially parallel to the upper surface of the substrate and crossing the second direction, each of the first division pattern extending in the second direction; and

second division patterns spaced apart from each other in the second direction between the first division patterns, each of the second division patterns extending through the gate electrode structure,

wherein an upper surface of each of the first and second division patterns is higher than an upper surface of the etch stop structure.

2. The vertical memory device as claimed in claim 1 , wherein the filling pattern includes a nitride, polysilicon or an oxide, and the etch stop pattern includes an oxide.

3. The vertical memory device as claimed in claim 1 , wherein the etch stop structure further includes a spacer between the filling pattern and the etch stop pattern.

4. The vertical memory device as claimed in claim 3 , wherein the filling pattern includes polysilicon or an oxide, and the spacer includes a nitride.

5. The vertical memory device as claimed in claim 1 , wherein the etch stop structure has a closed ring shape in a plan view.

6. The vertical memory device as claimed in claim 1 , wherein the etch stop structure includes:

first parts spaced apart from each other in the third direction substantially parallel to the upper surface of the substrate and crossing the second direction, each of the first parts extending in the second direction; and

second parts spaced apart from each other in the second direction, each of the second parts extending in the third direction.

7. The vertical memory device as claimed in claim 6 , wherein the first and second parts of the etch stop structure contact each other so that the etch stop structure has a rectangular ring shape in a plan view.

8. The vertical memory device as claimed in claim 1 , wherein the etch stop structure includes a void therein.

9. The vertical memory device as claimed in claim 1 , further comprising first insulation patterns between the gate electrodes spaced apart from each other in the first direction.

10. The vertical memory device as claimed in claim 9 , wherein the insulation pattern structure includes second and third insulation patterns alternately and repeatedly stacked in the first direction, and

wherein each of the second insulation patterns includes a nitride, and each of the third insulation patterns includes an oxide.

11. The vertical memory device as claimed in claim 10 , wherein the third insulation patterns are at the same levels as corresponding ones of the first insulation patterns, respectively.

12. The vertical memory device as claimed in claim 1 , further comprising an insulation pattern covering a sidewall of the through via.

13. A vertical memory device comprising:

a gate electrode structure including gate electrodes spaced apart from each other on a substrate in a first direction substantially perpendicular to an upper surface of the substrate, each of the gate electrodes extending in a second direction substantially parallel to the upper surface of the substrate;

a channel extending in the first direction through the gate electrode structure;

an etch stop structure extending in the first direction through the gate electrode structure, the etch stop structure having a closed ring shape in a plan view and including a plurality of patterns containing different materials from each other;

an insulation pattern structure surrounded by the etch stop structure;

a through via extending in the first direction through the insulation pattern structure;

a first division pattern at each of opposite sides of the gate electrode structure in a third direction substantially parallel to the upper surface of the substrate and crossing the second direction, each of the first division pattern extending in the second direction; and

second division patterns spaced apart from each other in the second direction between the first division patterns, each of the second division patterns extending through the gate electrode structure,

wherein an upper surface of each of the first and second division patterns is higher than an upper surface of the etch stop structure.

14. The vertical memory device as claimed in claim 13 , wherein the etch stop structure includes:

a first pattern extending in the first direction and having the closed ring shape in plan view, the first pattern including a nitride, polysilicon or an oxide; and

a second pattern covering a sidewall and a bottom of the first pattern, the second pattern including an oxide.

15. The vertical memory device as claimed in claim 14 , wherein the first pattern includes polysilicon or an oxide, and

wherein the etch stop structure further includes a third pattern between the first and second patterns.

16. A vertical memory device comprising:

a gate electrode structure including gate electrodes spaced apart from each other on a substrate in a first direction substantially perpendicular to an upper surface of the substrate, each of the gate electrodes extending in a second direction substantially parallel to the upper surface of the substrate;

a channel extending in the first direction through the gate electrode structure;

an insulation pattern structure extending through the gate electrode structure;

an etch stop structure extending through the gate electrode structure and surrounding at least a portion of a sidewall of the insulation pattern structure;

a through via extending in the first direction through the insulation pattern structure;

a first division pattern at each of opposite sides of the gate electrode structure in a third direction substantially parallel to the upper surface of the substrate and crossing the second direction, each of the first division pattern extending in the second direction;

second division patterns spaced apart from each other in the second direction between the first division patterns, each of the second division patterns extending through the gate electrode structure; and

a support layer covering an upper surface of the etch stop structure and contacting an upper sidewall of each of the first and second division patterns,

wherein each of the first division patterns is spaced apart from the etch stop structure in the third direction, and each of the second division patterns is spaced apart from the etch stop structure in the second direction, and

wherein an upper surface of each of the first and second division patterns is higher than an upper surface of the etch stop structure.

17. The vertical memory device as claimed in claim 16 , wherein a distance between the first division pattern and the etch stop structure is equal to or less than half a distance between neighboring ones of the first and second division patterns in the second direction.

18. The vertical memory device as claimed in claim 16 , wherein the etch stop structure includes:

a first pattern including a nitride, polysilicon or an oxide, the first pattern extending in the first direction; and

a second pattern including an oxide, the second pattern covering a sidewall and a bottom of the first pattern.