Reduced ESR in trench capacitor
A method of fabricating an integrated circuit includes etching trenches in a first surface of a semiconductor layer. A trench dielectric layer is formed over the first surface and over bottoms and sidewalls of the trenches and a doped polysilicon layer is formed over the trench dielectric layer and within the trenches. The doped polysilicon layer is patterned to form a polysilicon bridge that connects to the polysilicon within the filled trenches and a blanket implant of a first dopant is directed to the polysilicon bridge and to the first surface. The blanket implant forms a contact region extending from the first surface into the semiconductor layer.
1. A method of fabricating an integrated circuit, the method comprising:
etching trenches in a first surface of a semiconductor layer;
forming a trench dielectric layer over the first surface and over bottoms and sidewalls of the trenches;
forming a doped polysilicon layer over the trench dielectric layer and within the trenches;
patterning the doped polysilicon layer to form a polysilicon bridge that connects to the polysilicon within the trenches; and
directing a blanket implant of a first dopant to the polysilicon bridge and to the first surface, the blanket implant forming a contact region extending from the first surface into the semiconductor layer.
2. The method as recited in claim 1 including:
forming an interconnect dielectric layer over the contact region and over the polysilicon bridge;
forming first and second vias through the interconnect dielectric layer, the first via electrically connecting to the contact region and the second via electrically connecting to the polysilicon bridge; and
forming first and second metal layer segments over the interconnect dielectric layer, the first metal layer segment electrically connected to the first via and the second metal layer connected to the second via.
3. The method as recited in claim 1 in which the trenches are formed in an epitaxial layer over a handle substrate, the epitaxial layer having a first dopant concentration that is less than a second dopant concentration of the handle substrate.
4. The method as recited in claim 3 in which each of the handle substrate, the epitaxial layer, the doped polysilicon layer, and the first dopant has a same conductivity type.
5. The method as recited in claim 4 in which forming the doped polysilicon layer includes a low pressure chemical vapor deposition process that provides a silane flow rate of about 1200 sccm and a phosphine flow rate of about 95 sccm.
6. The method as recited in claim 4 in which the conductivity type is N-type.
7. The method as recited in claim 5 in which the first dopant includes phosphorus.
8. The method as recited in claim 1 in which forming the trench dielectric layer includes growing a thermal oxide.
9. The method as recited in claim 8 in which the thermal oxide is grown to a depth of about 100 nm.
10. The method as recited in claim 1 in which forming the trench dielectric layer includes forming an oxide-nitride-oxide layer.
11. A method of fabricating an integrated trench capacitor, the method comprising:
forming plurality of trenches extending from a top surface of a semiconductor substrate into the semiconductor substrate;
forming a trench dielectric layer on bottoms and sidewalls of the trenches;
filling the trenches with doped polysilicon and forming a polysilicon bridge that connects to the polysilicon within the filled trenches; and
directing a blanket implant of a first dopant to the polysilicon bridge and to the top surface, the blanket implant forming a contact region extending from the top surface into the semiconductor substrate.
12. The method as recited in claim 11 in which the blanket implant includes an N-type dopant.
13. The method as recited in claim 12 in which the first dopant includes phosphorus.
14. The method as recited in claim 11 in which the doped polysilicon is formed by a low pressure chemical vapor deposition process that provides a silane flow rate of about 1200 sccm and a phosphine flow rate of about 95 sccm.
15. The method as recited in claim 11 in which forming the trench dielectric layer includes growing a thermal oxide.
16. The method as recited in claim 15 in which the thermal oxide is grown to a thickness of about 100 nm.
17. The method as recited in claim 11 in which the trench dielectric layer includes an oxide-nitride-oxide (ONO) layer.
18. The method as recited in claim 11 , further comprising forming an interconnect dielectric layer over the top surface and the polysilicon bridge, and a first terminal through the interconnect dielectric layer to the contact region and a second terminal through the interconnect dielectric layer to the polysilicon bridge.