Directional coupler and electronic component module
A directional coupler includes a substrate, a main line 121 , a main line 122 , and a sub-line. The main line 121 and the main line 122 each include a conductor pattern formed in the substrate, and are connected in parallel to each other. The sub-line includes a conductor pattern formed in the substrate. The sub-line is disposed at a position at least partially overlapping with the main line 121 in a plan view of the substrate.
1. A directional coupler comprising:
a substrate having a first principal surface and a second principal surface opposing each other;
a first main line and a second main line each including a conductor pattern provided in or on the substrate, and connected in parallel to each other; and
a first sub-line including a conductor pattern provided in or on the substrate,
wherein the first sub-line is disposed at a position at least partially overlapping with the first main line in a plan view when seen in a thickness direction orthogonal to the first principal surface and the second principal surface,
the first principal surface is a connection surface to another substrate to which a high frequency signal detected by the directional coupler is transmitted, and
the first main line is disposed closer to a side of the first principal surface than the first sub-line.
2. The directional coupler according to claim 1 ,
wherein the second main line and the first sub-line are disposed at an identical position in the thickness direction.
3. The directional coupler according to claim 2 ,
wherein the first principal surface is a connection surface to another substrate to which a high frequency signal detected by the directional coupler is transmitted, and
the first main line is disposed closer to a side of the first principal surface than the first sub-line.
4. The directional coupler according to claim 2 ,
wherein the first main line and the second main line are disposed at different positions in the plan view.
5. The directional coupler according to claim 2 ,
wherein at least a part of the first main line and at least a part of the second main line overlap with each other in the plan view.
6. The directional coupler according to claim 2 , further comprising:
a second sub-line comprised of a conductor pattern provided in or on the substrate,
wherein the second sub-line is disposed at a position different from the position of the first sub-line in the thickness direction.
7. The directional coupler according to claim 1 ,
wherein the first main line and the second main line are disposed at different positions in the plan view.
8. The directional coupler according to claim 7 ,
wherein at least a part of the first main line and at least a part of the second main line overlap with each other in the plan view.
9. The directional coupler according to claim 1 ,
wherein at least a part of the first main line and at least a part of the second main line overlap with each other in the plan view.
10. The directional coupler according to claim 9 ,
wherein at least a part of the first sub-line is electromagnetically coupled to the first main line and the second main line in the plan view.
11. The directional coupler according to claim 1 , further comprising:
a second sub-line comprised of a conductor pattern provided in or on the substrate,
wherein the second sub-line is disposed at a position different from the position of the first sub-line in the thickness direction.
12. The directional coupler according to claim 11 ,
wherein at least a part of the second sub-line is disposed at a position overlapping at least a part of the second main line in the plan view.
13. The directional coupler according to claim 12 ,
wherein, in the thickness direction, the first main line and the second sub-line are disposed at an identical position in the thickness direction.
14. The directional coupler according to claim 11 ,
wherein the first sub-line and the second sub-line are connected in parallel to each other.
15. The directional coupler according to claim 1 ,
wherein the first sub-line is comprised of a plurality of conductor patterns disposed at a plurality of different positions in the thickness direction.
16. A directional coupler comprising:
a substrate having a first principal surface and a second principal surface opposing each other;
a main line comprised of a conductor pattern provided in or on the substrate; and
a first sub-line and a second sub-line each comprised of a conductor pattern provided in or on the substrate, and connected in parallel to each other,
wherein the main line is disposed at a position at least partially overlapping with the first sub-line or the second sub-line in a plan view when seen in a thickness direction orthogonal to the first principal surface and the second principal surface,
the first principal surface is a connection surface to another substrate to which a high frequency signal detected by the directional coupler is transmitted, and
the first main line is disposed closer to a side of the first principal surface than the first sub-line.
17. An electronic component module comprising:
the directional coupler according to claim 1 ; and
an integrated circuit mounted on the second principal surface and including a circuit connected to the first sub-line and configured to generate a measurement signal from a high frequency signal flowing through the first sub-line.