Radio frequency front-end structures
Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
1. A radio frequency (RF) communication assembly, comprising:
an RF package substrate including an embedded passive circuit element;
a processing device coupled to the RF package substrate;
a mold compound over the processing device; and
a conformal metal layer over the mold compound, wherein the conformal metal layer is conductively coupled to a metal layer in the RF package substrate.
2. The RF communication assembly of claim 1 , wherein the RF package substrate does not include a ground plane.
3. The RF communication assembly of claim 1 , wherein the embedded passive circuit element includes a capacitor, an inductor, or a balun.
4. The RF communication assembly of claim 1 , wherein the RF package substrate includes no more than four metal layers.
5. The RF communication assembly of claim 1 , further comprising a circuit board coupled to the RF package substrate.
6. The RF communication assembly of claim 5 , wherein the conformal metal layer is conductively coupled to a ground of the circuit board.
7. The RF communication assembly of claim 5 , wherein the circuit board is coupled to the RF package substrate at least in part by a plurality of solder balls.
8. The RF communication assembly of claim 1 , wherein the processing device includes one or more passive circuit elements in its metallization stack.
9. The RF communication assembly of claim 1 , wherein the embedded passive circuit element includes at least one wall via.
10. The RF communication assembly of claim 1 , wherein the embedded passive circuit element is part of a harmonic filter.
11. The RF communication assembly of claim 1 , wherein the embedded passive circuit element is part of a matching filter.
12. The RF communication assembly of claim 1 , further comprising an antenna communicatively coupled to the RF package substrate.
13. The RF communication assembly of claim 1 , wherein the RF communication assembly is a handheld computing device, a tablet computing device, or a wearable computing device.
14. The RF communication assembly of claim 1 , wherein the RF communication assembly is configured for Wi-Fi communication.
15. The RF communication assembly of claim 1 , wherein a footprint of the RF package substrate has an area that is less than 10 square millimeters.
16. A radio frequency (RF) communication assembly, comprising:
an RF package substrate including an embedded passive circuit element, wherein at least a portion of the embedded passive circuit element is included in a metal layer of the RF package substrate; and
a circuit board coupled to the RF package substrate, wherein the circuit board includes a first plate of a capacitor and the metal layer of the RF package substrate includes a second plate of the capacitor.
17. The RF communication assembly of claim 16 , wherein the embedded passive circuit element is part of a harmonic filter or a matching filter.
18. The RF communication assembly of claim 16 , wherein the RF package substrate further includes a ground plane, and wherein the ground plane is non-rectangular.
19. A radio frequency (RF) communication assembly, comprising:
an RF package substrate including an embedded passive circuit element;
a processing device coupled to the RF package substrate;
a mold compound over the processing device; and
a conformal metal layer over the mold compound, wherein the RF package substrate does not include a ground plane.
20. The RF communication assembly of claim 19 , wherein the embedded passive circuit element includes a capacitor, an inductor, or a balun.