IP Library Granted Patent US 11,980,971
Granted Patent B2
US 11,980,971 · App. 17/132,987 · Granted May 14, 2024

Laser processing apparatus and laser processing method

Inventor: Yuki Saeki (Kanagawa, JP)
Assignee: VIA MECHANICS, LTD.
B23K26/382B23K26/0006B23K26/043B23K26/046B23K26/0622B23K26/064B23K26/082
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Quick Facts
Patent No.
US 11,980,971
App. No.
17/132,987
Granted
May 14, 2024
Kind
B2
Abstract

A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser deflector, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector.

Claims (17)

1. A laser processing apparatus comprising:

a laser oscillator configured to output a laser pulse;

a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and

a controller configured to control the laser oscillator and the laser deflector,

the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece,

wherein an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector, and

wherein the controller changes the focal point of the laser pulse stepwise in one direction by applying a stepwise voltage to the electrooptic device.

2. The laser processing apparatus according to claim 1 ,

wherein, when the laser pulse is repeatedly emitted to the same processing target position of the workpiece, the controller controls the electrooptic device so as to change the focal point made by the electrooptic device.

3. A laser processing method comprising the steps of:

inputting a laser pulse, that is output from a laser oscillator, to a laser deflector configured to deflect the laser pulse in a two-dimensional direction;

controlling the laser oscillator and the laser deflector; and

emitting the laser pulse to a workpiece for processing the workpiece,

wherein a focal point of the laser pulse to be input to the laser deflector is electrically changed by an electrooptic device, and

wherein, when the focal point of the laser pulse is changed, the focal point of the laser pulse is changed stepwise in one direction by applying a stepwise voltage to the electrooptic device.

4. The laser processing method according to claim 3 ,

wherein, when the laser pulse is repeatedly emitted to the same processing target position of the workpiece, the focal point made by the electrooptic device is changed.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2021
From: SAEKI, YUKI
To: VIA MECHANICS, LTD.
Reel/Frame 055234/0803 →
Priority Claims (1)
JP 2019-232313 · Dec 24, 2019 · national
Continuity (1)
Related Publication 20210187667A1 · Jun 24, 2021