Optically transparent antennas on transparent substrates
Examples are disclosed related to optically transparent antennas. One example provides a device, comprising an electrically insulating substrate that is at least partially optically transparent, one or more antennas disposed on the electrically insulating substrate, each antenna comprising a film of a conductive material that is at least partially optically transparent, the one or more antennas comprising a communication antenna, and processing circuitry electrically coupled to the communication antenna, the processing circuitry configured to one or more of send or receive signals via the communication antenna.
1. A device, comprising:
an electrically insulating substrate that is at least partially optically transparent;
one or more antennas disposed on the electrically insulating substrate, each antenna comprising a film of a conductive material that is at least partially optically transparent, the one or more antennas comprising a communication antenna and a proximity sensing antenna; and
processing circuitry electrically coupled to the communication antenna, the processing circuitry configured to one or more of send or receive signals via the communication antenna, the processing circuitry including a resonant circuit coupled to the proximity sensing antenna, and wherein the communication antenna is configured to utilize a first frequency band for communication and the proximity sensing antenna is configured to utilize a second frequency band for facial motion tracking, the second frequency band being different from the first frequency band.
2. The device of claim 1 , wherein the electrically insulating substrate comprises one or more of glass, polymethyl methacrylate, polystyrene, polyethylene terephthalate, cyclic olefin polymer, or polycarbonate.
3. The device of claim 1 , wherein the conductive material comprises one or more of indium tin oxide, silver nanowires, or carbon nanotubes.
4. The device of claim 1 , wherein the device comprises a head-mounted display device.
5. The device of claim 1 , wherein the one or more antennas includes a plurality of thin film segments, and further comprising a conductive trace formed in a trench region between a first thin film segment and a second thin film segment.
6. The device of claim 1 , further comprising an insulating layer located over the film.
7. The device of claim 1 , wherein the processing circuitry is electrically coupled to the communication antenna via one or more of a gold plate, a silver plate, a copper plate, or a metalized bonding pad.
8. A device, comprising:
an electrically insulating substrate that is at least partially optically transparent;
one or more antennas disposed on the electrically insulating substrate, each antenna comprising a film of a conductive material that is at least partially optically transparent, the one or more antennas comprising a communication antenna, the one or more antennas including a plurality of thin film segments;
a conductive trace formed in a trench region between a first thin film segment and a second thin film segment; and
processing circuitry electrically coupled to the communication antenna, the processing circuitry configured to one or more of send or receive signals via the communication antenna.
9. The device of claim 8 , wherein the electrically insulating substrate comprises one or more of glass, polymethyl methacrylate, polystyrene, polyethylene terephthalate, cyclic olefin polymer, or polycarbonate.
10. The device of claim 8 , wherein the conductive material comprises one or more of indium tin oxide, silver nanowires, or carbon nanotubes.
11. The device of claim 8 , wherein the device comprises a head-mounted display device.
12. The device of claim 8 , wherein the one or more antennas further comprises a proximity sensing antenna, and wherein the processing circuitry includes a resonant circuit coupled to the proximity sensing antenna.
13. The device of claim 8 , further comprising an insulating layer located over the film.
14. The device of claim 8 , wherein the processing circuitry is electrically coupled to the communication antenna via one or more of a gold plate, a silver plate, a copper plate, or a metalized bonding pad.