Method of manufacturing display device including positioned light emitting elements and display device manufactured thereby
A method of manufacturing a display device includes forming an uncut electrode on a substrate, at least a portion of the uncut electrode being formed in a non-emission area; disposing a first insulating layer to overlap the uncut electrode; removing at least a portion of the first insulating layer in the non-emission area; cutting the at least a portion of the uncut electrode in the non-emission area; disposing light emitting elements including a first light emitting element in an emission area and a second light emitting element in the non-emission area; and disposing a second insulating layer to overlap the emission area and the non-emission area. The second light emitting element is disposed in the non-emission area where the uncut electrode is not disposed. Also provided is a display device manufactured by the method.
1. A method of manufacturing a display device including an emission area and a non-emission area, wherein the non-emission area includes a first area and a second area, the method comprising:
forming an uncut electrode on a substrate, wherein at least a portion of the uncut electrode is formed in the non-emission area;
disposing a first insulating laver to overlap the uncut electrode;
removing at least a portion of the first insulating layer in the non-emission area, wherein the removing of the at least a portion of the first insulating layer includes:
removing the first insulating layer disposed in the first area; and
removing the first insulating layer disposed in the second area;
cutting the at least a portion of the uncut electrode in the non-emission area;
disposing light emitting elements including a first light emitting element and a second light emitting element, wherein the first light emitting element is disposed in the emission area and the second light emitting element is disposed in an open area, and the disposing of the light emitting elements is performed after the removing of the first insulating layer disposed in the second area; and
disposing a second insulating laver to overlap the emission area and the non-emission area wherein the second light emitting element is disposed where the uncut electrode is not disposed.
2. The method of claim 1 , wherein
each of the first area and the second area is an area in which the first insulating layer is removed in the removing of the at least a portion of the first insulating layer.
3. The method of claim 2 , wherein
the first area is an area in which the at least a portion of the uncut electrode is cut in the cutting of the at least a portion of the uncut electrode, and
the second area does not overlap the first area in a plan view.
4. The method of claim 3 , wherein the disposing of the light emitting elements includes:
disposing a first quantity of the second light emitting element in the first area; and
disposing a second quantity of the second light emitting element in the second area,
wherein the second quantity of the second light emitting element is greater than the first quantity of the second light emitting element.
5. The method of claim 3 , wherein, in the disposing of the second insulating layer, the second light emitting element disposed in the second area is overlapped by the second insulating layer.
6. The method of claim 3 , wherein the cutting of the at least a portion of the uncut electrode includes:
removing at least a portion of the uncut electrode disposed in the first area; and
forming a first electrode and a second electrode that are physically separated from each other.
7. The method of claim 6 , wherein, in the cutting of the at least a portion of the uncut electrode,
at least a portion of each of the first electrode and the second electrode is exposed, and
the second area is opened with respect to the at least a portion of each of the first electrode and the second electrode.
8. The method of claim 3 , further comprising disposing a bank defining the emission area,
wherein the bank is not disposed in the second area.
9. The method of claim 3 , wherein
the first light emitting element is disposed in a first direction, and
the first area overlaps an area in which the first light emitting element is disposed along the first direction.
10. The method of claim 9 , wherein the first area and the second area are disposed along a second direction intersecting the first direction.
11. The method of claim 10 , wherein the first area and the second area are adjacent to each other along the second direction.
12. The method of claim 10 , wherein the non-emission area is disposed in an area adjacent to the second area along the second direction.
13. The method of claim 3 , further comprising disposing a transistor on the substrate,
wherein a position of the transistor disposed in the disposing of the transistor does not overlap the first area in a plan view.
14. The method of claim 13 , wherein the transistor overlaps the second area in a plan view.