IP Library Granted Patent US 12,021,097
Granted Patent B2
US 12,021,097 · App. 17/847,569 · Granted Jun 25, 2024

Camera module, and photosensitive component thereof and manufacturing method therefor

Inventors: Mingzhu Wang (Ningbo, CN); Bojie Zhao (Ningbo, CN); Takehiko Tanaka (Ningbo, CN); Zhongyu Luan (Ningbo, CN); Zhenyu Chen (Ningbo, CN); Zhen Huang (Ningbo, CN)
Assignee: NINGBO SUNNY OPOTECH CO., LTD.
H01L27/14618H01L23/10H01L27/14621H01L27/14698H04N23/55H05K1/0274H05K1/118H01L2224/83101H01L2224/83192H01L2224/92247H01L2924/16195
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Quick Facts
Patent No.
US 12,021,097
App. No.
17/847,569
Granted
Jun 25, 2024
Kind
B2
Abstract

A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

Claims (13)

1. An array camera module, comprising:

at least two camera modules, wherein each of the camera modules is independent from others, and the at least two camera modules coordinate with each other to conduct the image capturing of the array camera module, wherein each of the camera modules comprises:

a photosensitive unit, comprising:

an encapsulation portion;

a photosensitive portion, including a main circuit board and a photosensitive sensor, wherein the encapsulation portion is encapsulated to form on the main circuit board and the photosensitive sensor and has a window defined by an inclined inner wall of the encapsulation portion and positioned above the photosensitive sensor to provide a light path of the photosensitive sensor; and

a protective layer arranged on the main circuit board around an area of the photosensitive sensor; and

a camera lens, located in the photosensitive path of the photosensitive sensor of the photosensitive unit;

wherein the encapsulation portions of the at least two camera modules are integrally connected, so as to form a conjoined encapsulation portion.

2. The array camera module, as recited in claim 1 , wherein the at least two camera modules are integrally assembled through an external frame.

3. The array camera module, as recited in claim 2 , wherein the at least two camera modules are connected to each other.

4. The array camera module, as recited in claim 2 , wherein the at least two camera modules are not connected to each other.

5. The array camera module, as recited in claim 1 , wherein the main circuit boards of the at least two camera modules are interconnected, so as to form an integral main circuit board.

6. The array camera module, as recited in claim 1 , wherein the frames of the at least two camera modules are integrally connected, so as to form a conjoined frame.

Priority Claims (10)
CN 201610142925.9 · Mar 12, 2016 · national
CN 201610143457.7 · Mar 12, 2016 · national
CN 201620191631.0 · Mar 12, 2016 · national
CN 201620191969.6 · Mar 12, 2016 · national
CN 201610202500.2 · Apr 1, 2016 · national
CN 201620269534.9 · Apr 1, 2016 · national
CN 201610278035.0 · Apr 28, 2016 · national
CN 201620373323.X · Apr 28, 2016 · national
CN 201610430615.7 · Jun 16, 2016 · national
CN 201620590779.1 · Jun 16, 2016 · national
Continuity (2)
Division 16082533
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