Electrostatic discharge circuit and method of forming the same
A semiconductor device includes a device wafer having a first side and a second side. The first and second sides are opposite to each other. The semiconductor device includes a plurality of first interconnect structures disposed on the first side of the device wafer. The semiconductor device includes a plurality of second interconnect structures disposed on the second side of the device wafer. The plurality of second interconnect structures comprise a first power rail and a second power rail. The semiconductor device includes a carrier wafer disposed over the plurality of first interconnect structures. The semiconductor device includes an electrostatic discharge (ESD) protection circuit formed over a side of the carrier wafer. The ESD protection circuit is operatively coupled to the first and second power rails.
1. A semiconductor device, comprising:
a device wafer having a first side and a second side, wherein the first and second sides are opposite to each other;
a plurality of first interconnect structures disposed on the first side of the device wafer;
a plurality of second interconnect structures disposed on the second side of the device wafer, wherein the plurality of second interconnect structures comprise a first power rail and a second power rail having opposite potentials; and
a carrier wafer disposed over the plurality of first interconnect structures and including an electrostatic discharge (ESD) protection circuit comprising a first diode and a second diode formed therein;
wherein the device wafer has a higher grade than the carrier wafer, wherein the ESD protection circuit is formed over a side of the carrier wafer, and wherein the first diode is operatively coupled to the first power rail and the second diode is operatively coupled to the second power rail through at least one or more of the plurality of first interconnect structures.
2. The semiconductor device of claim 1 , wherein the first diode has a first terminal connected to the first power rail that is configured to carry VDD, and the second diode has a first terminal connected to the second power rail that is configured to carry VSS.
3. The semiconductor device of claim 2 , wherein the first terminal of the first diode is connected to the first power rail through the plurality of first interconnect structures and the first terminal of the second diode is connected to the second power rail through the plurality of first interconnect structures.
4. The semiconductor device of claim 2 , wherein the first diode has a second terminal and the second diode has a second terminal, and wherein the respective second terminals of the first and second diodes are connected to one or more devices formed on the first side of the device wafer.
5. The semiconductor device of claim 4 , wherein the first terminal of the first diode is formed as a first region over the side of the carrier wafer, the second terminal of the first diode is formed as a second region over the side of the carrier wafer, the first terminal of the second diode is formed as a third region over the side of the carrier wafer, and the second terminal of the second diode is formed as a fourth region over the side of the carrier wafer, and wherein the first and fourth regions are in a first conductive type, and the second and third regions are in a second conductive type, the first conductive type being different from the second conductive type.
6. The semiconductor device of claim 5 , wherein the first and second regions are disposed in a well over the side of the carrier wafer, and wherein the well is in the first conductive type and the carrier wafer is in the second conductive type.
7. The semiconductor device of claim 1 , wherein the side of the carrier wafer faces the first side of the device wafer.
8. The semiconductor device of claim 1 , further comprising a plurality of passive devices formed over the side of the carrier wafer.
9. A semiconductor device, comprising:
a first wafer having a first side and a second side that are opposite to each other;
a second wafer having a first side and a second side that are opposite to each other, wherein the first side of the first wafer faces the first side of the second wafer, wherein the second wafer includes an electrostatic discharge (ESD) protection circuit comprising a first diode and a second diode formed within the second wafer and on the first side of the second wafer, and wherein the first wafer has a higher grade than the second wafer;
a plurality of first interconnect structures that are disposed between the first side of the first wafer and the first side of the second wafer; and
a plurality of second interconnect structures that are disposed on the second side of the first wafer,
wherein the first diode is operatively coupled to a first power rail and the second diode is operatively coupled to a second power rail, the first power rail and the second power rail having opposite potentials.
10. The semiconductor device of claim 9 , wherein the plurality of second interconnect structures include a first power rail and a second power rail, the ESD protection circuit electrically connected to the first and second power rails through the plurality of first interconnect structures.
11. The semiconductor device of claim 9 , wherein the ESD protection circuit includes a first diode and a second diode connected in series.
12. The semiconductor device of claim 11 , wherein the first diode has a first terminal connected to a first one of the plurality of second interconnect structures that is configured to carry VDD, and the second diode has a first terminal connected to a second one of the plurality of second interconnect structures that is configured to carry VSS.
13. The semiconductor device of claim 11 , wherein the first diode has a second terminal and the second diode has a second terminal, and wherein the respective second terminals of the first and second diodes are connected to one or more devices formed on the first side of the first wafer.
14. The semiconductor device of claim 9 , further comprising a plurality of passive devices formed on the first side of the second wafer.
15. A method for making a semiconductor device, comprising:
forming a plurality of interconnect structures over a first side of a first wafer;
forming an electrostatic discharge (ESD) protection circuit within a second wafer and over a first side of the second wafer, the ESD protection circuit comprising a first diode and a second diode formed therein, wherein the first wafer has a higher grade than the second wafer;
coupling the first side of the first wafer to the first side of the second wafer;
polishing the first wafer from a second side of the first wafer, wherein the second side of the first wafer is opposite to the first side of the first wafer; and
forming a first power rail and a second power rail over the second side of the first wafer,
wherein the first diode is operatively coupled to the first power rail and the second diode is operatively coupled to the second power rail, the first power rail and the second power rail having opposite potentials.
16. The method of claim 15 , wherein the first and second power rails are operatively coupled to the ESD protection circuit through the plurality of interconnect structures.
17. The method of claim 15 , wherein the first diode has a first terminal connected to the first power rail that is configured to carry VDD, and the second diode has a first terminal connected to the second power rail that is configured to carry VSS.
18. The method of claim 15 , wherein the first wafer has a higher grade than the second wafer.