Flexible transparent conductive composite film and manufacturing method thereof
The invention discloses a flexible transparent conductive composite film and the manufacturing method thereof. The aforementioned flexible transparent conductive composite film is formed by depositing the first target material and the second target material in an alternating manner by HiPIMS. Therefore, the post-anneal step of the traditional method can be omitted, and the manufacturing efficiency of the flexible transparent conductive composite films is significantly improved.
1. A flexible transparent conductive composite film, forming by HiPIMS and sputtering and depositing a multilayer structure on a transparent substrate;
wherein the multilayer structure is deposited by a conductive layer and a metal layer in an alternating manner, and first layer and last layer of the multilayer structure are the conductive layer;
wherein the HiPIMS supplies peak power density during the sputtering process is at least 250 W/cm 2 ;
wherein a critical radius of curvature of the flexible transparent conductive composite film is 4 mm and lower than 4 mm.
2. The flexible transparent conductive composite film as claimed in claim 1 , wherein total layer number of the metal layer and the conductive layer is odd number.
3. The flexible transparent conductive composite film as claimed in claim 1 , wherein thickness of the conductive layer is equal to or thicker than the metal layer.
4. The flexible transparent conductive composite film as claimed in claim 1 , wherein material of the conductive layer comprises ITO, AZO, GZO, IGZO or IZO.
5. The flexible transparent conductive composite film as claimed in claim 1 , wherein material of the metal layer comprises Au, Ag, Cu, Al or/and combination compounds thereof.
6. The flexible transparent conductive composite film as claimed in claim 2 , wherein the total layer number is at least three.