Method of fabricating transversely-excited film bulk acoustic resonator
Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes an interdigital transducer with interleaved fingers on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly bonded to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the acoustic resonator chip and a perimeter of the interposer.
1. A method of fabricating a transversely-excited film bulk acoustic resonator device, the method comprising:
fabricating an acoustic resonator chip by:
attaching a back surface of a piezoelectric layer to a substrate either directly or via one or more intermediate material layers, the piezoelectric layer having a portion that forms a diaphragm over a cavity; and
forming a first conductor pattern on only one surface of the piezoelectric layer, the first conductor pattern comprising:
an interdigital transducer (IDT) including interleaved fingers on the diaphragm,
a first conductor about a perimeter of the piezoelectric layer, and
a first plurality of contact pads;
forming a second conductor pattern on a back surface of an interposer, the second conductor pattern comprising a second plurality of contact pads and a second conductor about a perimeter of the interposer;
forming a recess in the back surface of the interposer, such that the recess is located in an area of the back surface of the interposer that faces the diaphragm when the back surface of the interposer is attached to the piezoelectric layer;
attaching the back surface of the interposer to the one surface of the piezoelectric layer by bonding each contact pad of the first plurality of contact pads to a respective contact pad of the second plurality of contact pads, such that the recess in the back surface of the interposer faces the diaphragm; and
forming a seal between a perimeter of the acoustic resonator chip and the perimeter of the interposer.
2. The method of claim 1 , wherein
the cavity is a hole passing through a thickness of the substrate, and
the method further comprises bonding a cap to a back surface of the substrate.
3. The method of claim 1 , wherein: forming the seal comprises directly bonding the first conductor to the second conductor.
4. The method of claim 1 , wherein forming the seal further comprises:
applying an adhesive material around one or both of the perimeter of the acoustic resonator chip and the perimeter of the interposer; and
curing the adhesive material after or concurrently with directly bonding the first plurality of contact pads to the second plurality of contact pads.
5. The method of claim 1 , further comprising forming conductive vias to connect the second plurality of contact pads to a third plurality of contact pads formed on a front surface of the interposer that is opposite the back surface of the interposer.
6. The method of claim 5 , wherein
the interposer comprises a silicon base, and
the conductive vias are through silicon vias.
7. The method of claim 5 , wherein the interposer is a printed circuit board (PCB).
8. The method of claim 5 , wherein the interposer is a low temperature cofired ceramic (LTCC) circuit card.
9. A method of fabricating an acoustic resonator device, the method comprising,
fabricating an acoustic resonator chip by:
attaching a piezoelectric layer to a substrate either directly or via one or more intermediate material layers, the piezoelectric layer having a portion that forms a diaphragm over a cavity; and
forming a first conductor pattern on the piezoelectric layer, the first conductor pattern comprising an interdigital transducer (IDT) including interleaved fingers on the diaphragm, a first conductor about a perimeter of the piezoelectric layer, and a first plurality of contact pads;
forming a second conductor pattern on a back surface of an interposer, the second conductor pattern comprising a second plurality of contact pads and a second conductor about a perimeter of the interposer;
forming a recess in the back surface of the interposer, the recess located in an area of the back surface of the interposer facing the diaphragm;
after forming the recess in the back surface of the interposer, attaching the back surface of the interposer to the piezoelectric layer by directly bonding each contact pad of the first plurality of contact pads to a respective contact pad of the second plurality of contact pads; and
forming a seal between a perimeter of the acoustic resonator chip and the perimeter of the interposer.
10. The method of claim 9 , wherein forming the recess in the back surface of the interposer further comprises forming the recess having a depth such that, after attaching the interposer to the acoustic resonator chip, a distance from a bottom of the recess to the diaphragm is greater than or equal to 15 microns and less than or equal to 100 microns.
11. The method of claim 1 , wherein
the acoustic resonator device is a bandpass filter; and
the first conductor pattern comprises a plurality of IDTs, interleaved fingers of each IDT disposed on a respective diaphragm spanning a respective cavity in the substrate.
12. The method of claim 1 , wherein the IDT and the piezoelectric layer are configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode having a bulk shear acoustic wave in the diaphragm where acoustic energy propagates along a direction substantially orthogonal to the one surface of the piezoelectric layer and transverse to a direction of electric field created by the IDT.
13. A method of fabricating a filter device including a plurality of transversely-excited film bulk acoustic resonators, the method comprising:
fabricating an acoustic resonator chip by:
attaching at least one piezoelectric layer to a substrate either directly or via one or more intermediate material layers, the at least one piezoelectric layer having portions that form a plurality of diaphragms over respective cavities; and
forming a first conductor pattern on only one surface of the at least one piezoelectric layer, the first conductor pattern comprising:
a plurality of interdigital transducer (IDT) of a corresponding plurality of acoustic resonators, interleaved fingers of each IDT on a respective diaphragm of the plurality of diaphragms, a first conductor about a perimeter of the piezoelectric layer, and
a first plurality of contact pads;
forming a second conductor pattern on a back surface of an interposer, the second conductor pattern comprising a second plurality of contact pads and a second conductor about a perimeter of the interposer;
forming a plurality of recesses in the back surface of the interposer, such that the recesses are located in the back surface of the interposer that face the plurality of diaphragms, respectively, when the interposer is attached to the one surface of the piezoelectric layer;
attaching the back surface of the interposer to the one surface of the at least one piezoelectric layer by bonding each contact pad of the first plurality of contact pads to a respective contact pad of the second plurality of contact pads, such that the plurality of recesses in the back surface of the interposer face the plurality of diaphragms, respectively; and
forming a seal between a perimeter of the acoustic resonator chip and the perimeter of the interposer.
14. The method of claim 13 , wherein
the cavities are holes passing through a thickness of the substrate, and
the method further comprises bonding a cap to a back surface of the substrate.
15. The method of claim 13 , wherein: forming the seal comprises directly bonding the first conductor to the second conductor.
16. The method of claim 13 , wherein forming the seal further comprises:
applying an adhesive material around one or both of the perimeter of the acoustic resonator chip and the perimeter of the interposer; and
curing the adhesive material after or concurrently with directly bonding the first plurality of contact pads to the second plurality of contact pads.
17. The method of claim 13 , further comprising forming conductive vias to connect the second plurality of contact pads to a third plurality of contact pads formed on a front surface of the interposer that is opposite the back surface of the interposer.
18. The method of claim 17 , wherein
the interposer comprises a silicon base, and
the conductive vias are through silicon vias.
19. The method of claim 17 , wherein the interposer is a printed circuit board (PCB).
20. The method of claim 17 , wherein the interposer is a low temperature cofired ceramic (LTCC) circuit card.
21. The method of claim 13 , wherein forming the plurality of recesses in the back surface of the interposer further comprises forming each of the plurality of recesses having a depth such that, after attaching the interposer to the at least one piezoelectric layer, a distance from a bottom of each recess to a respective diaphragm is greater than or equal to 15 microns and less than or equal to 100 microns.
22. The method of claim 13 , wherein the plurality of IDTs and the at least one piezoelectric layer are configured such that respective radio frequency signals applied to each of the plurality of IDTs excite primary shear acoustic modes having bulk shear acoustic waves in the respective diaphragms where acoustic energy propagates along a direction substantially orthogonal to the one surface of the at least one piezoelectric layer and transverse to a direction of electric field created by the respective IDTs.