IP Library Granted Patent US 12,097,754
Granted Patent B2
US 12,097,754 · App. 17/615,917 · Granted Sep 24, 2024

Thermal management system

Inventors: In-Guk Hwang (Daejeon, KR); Seong Hun Kim (Daejeon, KR); Hae-Jun Lee (Daejeon, KR)
Assignee: Hanon Systems
B60H1/3227B60H1/00278B60H1/00921B60H1/3213B60H2001/00307B60H2001/00949
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Quick Facts
Patent No.
US 12,097,754
App. No.
17/615,917
Granted
Sep 24, 2024
Kind
B2
Abstract

A thermal management system and, more specifically, to a refrigerant system comprising: a compressor, a first heat exchanger, an expansion valve, a second heat exchanger, and an accumulator which are connected in sequence to form a closed loop; and a connection block which connects a heat exchange medium outlet of the expansion valve to a heat exchange medium inlet of the second heat exchanger, and connects a heat exchange medium outlet of the second heat exchanger to a heat exchange medium inlet of the accumulator.

Claims (36)

1. A thermal management system comprising:

a first heat exchanger heat-exchanging a heat exchange medium introduced from a compressor;

an expansion valve expanding the heat exchange medium introduced from the first heat exchanger;

a second heat exchanger exchanging heat between the heat exchange medium introduced from the expansion valve and a heating component;

an accumulator storing the heat exchange medium introduced from the second heat exchanger and supplying the heat exchange medium to the compressor;

a connection block connecting a heat exchange medium outlet of the expansion valve and a heat exchange medium inlet of the second heat exchanger to each other and connecting a heat exchange medium outlet of the second heat exchanger and a heat exchange medium inlet of the accumulator to each other;

another expansion valve expanding the heat exchange medium introduced from the first heat exchanger; and

an evaporator heat-exchanging the heat exchange medium introduced from another expansion valve with air supplied to an interior and sending the heat exchange medium to the accumulator.

2. The thermal management system of claim 1 , wherein

the heating component includes a battery or an electronic component, and

the second heat exchanger cools or heats the heating component.

3. The thermal management system of claim 1 , wherein

the connection block connects and communicates three or more components to and with each other.

4. The thermal management system of claim 1 , wherein

the first heat exchanger, the expansion valve, the second heat exchanger, the accumulator, and the connection block are modularized and formed integrally with each other.

5. The thermal management system of claim 1 , wherein

an inlet through which the heat exchange medium is introduced and an outlet through which the heat exchange medium is discharged are formed on a lower side of the second heat exchanger in a height direction.

6. The thermal management system of claim 1 , wherein

the connection block is disposed below the expansion valve in a height direction.

7. The thermal management system of claim 1 , wherein

the accumulator is disposed below the second heat exchanger and the connection block in a height direction.

8. The thermal management system of claim 1 , further comprising

another connection block connecting a heat exchange medium outlet of the first heat exchanger and an inlet of the expansion valve to each other.

9. The thermal management system of claim 1 , wherein a refrigerant flow path penetrating an interior of the connection block is formed,

a sensor mounting part connected to the refrigerant flow path is formed in the connection block,

a sensor can be installed in the sensor mounting part.

10. The thermal management system of claim 1 , further comprising

another connection block connecting a heat exchange medium outlet of the first heat exchanger to an inlet of the first expansion valve and an inlet of a second expansion valve.

11. The thermal management system of claim 10 , wherein

the first heat exchanger includes:

a water-cooled condenser primarily heat-exchanging the heat exchange medium discharged from the compressor with a coolant; and

an air-cooled condenser secondarily heat-exchanging the heat exchange medium firstly heat-exchanged while passing through the water-cooled condenser with external air.

12. The thermal management system of claim 11 , further comprising

the second expansion valve connected between the water-cooled condenser and the air-cooled condenser, expanding the heat exchange medium discharged from the water-cooled condenser, and sending the expanded heat exchange medium to the air-cooled condenser.

13. The thermal management system of claim 10 , further comprising

an internal heat exchanger exchanging heat between the heat exchange medium flowing from another connection block to the second expansion valve and the heat exchange medium flowing from the evaporator to the accumulator.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2021
From: HWANG, IN-GUK; KIM, SEONG HUN; LEE, HAE-JUN
To: HANON SYSTEMS
Reel/Frame 058461/0144 →
Priority Claims (2)
KR 10-2019-0065385 · Jun 3, 2019 · national
KR 10-2020-0065950 · Jun 1, 2020 · national
Continuity (1)
Related Publication 20220288998A1 · Sep 15, 2022
Cited By (2)
US 12,508,873 US 12,629,985