Temperature-reporting oscillator
In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.
1. An integrated circuit device comprising:
one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits;
a microelectromechanical-system (MEMS) resonator, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
circuitry, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
storage for polynomial coefficients that describe a temperature-dependent adjustment curve to be applied to the clock signal;
wherein the circuitry is further to
generate a digital signal representing a sensed temperature of operation of the MEMS resonator, and
provide each of the digital signal and the polynomial coefficients, each via a contact of the one or more external electrical contacts, to the one or more other integrated circuits; and
wherein the digital signal is also output as a serial binary signal, via a single contact of the one or more external electrical contacts.
2. The integrated circuit device of claim 1 wherein:
the temperature-dependent adjustment curve corresponds to the temperature-dependent variation; and
the circuitry is to output the digital signal and the polynomial coefficients via a same contact of the one or more external electrical contacts.
3. The integrated circuit device of claim 1 wherein the storage is programmable via a contact of the one or more external electrical contacts.
4. The integrated circuit device of claim 1 wherein the circuitry is further to output the polynomial coefficients, via the one or more external electrical contacts, as a serial binary signal.
5. The integrated circuit device of claim 4 wherein the circuitry is to output the serial binary signal representing the sensed temperature and the serial binary signal representing the polynomial coefficients via a same one of the one or more electrical contacts.
6. The integrated circuit device of claim 1 wherein the circuitry is further to output the digital signal representing the sensed temperature, via a contact of the one or more external electrical contacts, on demand.
7. The integrated circuit device of claim 1 wherein the integrated circuit device is to receive an externally-supplied, run-time control signal, and wherein the circuitry is to control operation of the integrated circuit device in response to the externally-supplied, run-time control signal.
8. An integrated circuit device comprising:
one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits;
a microelectromechanical-system (MEMS) resonator, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
circuitry, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
storage for polynomial coefficients that describe a temperature-dependent adjustment curve to be applied to the clock signal;
wherein the circuitry is further to
generate a digital signal representing a sensed temperature of operation of the MEMS resonator, and
provide each of the digital signal and the polynomial coefficients, each via a contact of the one or more external electrical contacts, to the one or more other integrated circuits; and
wherein
the MEMS resonator is a first MEMS resonator, the resonant frequency is a first resonant frequency, and the temperature-dependent variation is a first temperature-dependent variation,
the integrated circuit device further comprises a second MEMS resonator, wherein the second MEMS resonator is to exhibit a second resonant frequency which has a second temperature-dependent variation, and
the circuitry is to generate the digital signal dependent on a relationship between the first resonant frequency and the second resonant frequency.
9. An integrated circuit device comprising:
one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits;
a microelectromechanical-system (MEMS) resonator, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
circuitry, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
storage for polynomial coefficients that describe a temperature-dependent adjustment curve to be applied to the clock signal;
wherein the circuitry is further to
generate a digital signal representing a sensed temperature of operation of the MEMS resonator, and
provide each of the digital signal and the polynomial coefficients, each via a contact of the one or more external electrical contacts, to the one or more other integrated circuits; and
wherein
the integrated circuit device comprises a first die, a second die and a thermally-conductive fill material directly connecting a surface of the first die with a surface of the second die,
the MEMS resonator is on the first die, and
the circuitry is on the second die.
10. An integrated circuit device comprising:
one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits, wherein a contact of the one or more contacts is to receive an externally-supplied, run-time control signal;
a microelectromechanical-system (MEMS) resonator, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
circuitry, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
storage for polynomial coefficients that describe a temperature-dependent adjustment curve to be applied to the clock signal;
wherein the circuitry is further to
generate a digital signal representing a sensed temperature of operation of the MEMS resonator,
provide the digital signal via a contact of the one or more external electrical contacts to the one or more other integrated circuits, and
provide the polynomial coefficients, via a contact of the one or more external electrical contacts, to the one or more other integrated circuits, as a function of the externally-supplied, run-time control signal; and
wherein the digital signal is also output as a serial binary signal, via a single contact of the one or more external electrical contacts.
11. The integrated circuit device of claim 10 wherein:
the temperature-dependent adjustment curve corresponds to the temperature-dependent variation; and
the circuitry is to output the digital signal and the polynomial coefficients via a same contact of the one or more external electrical contacts.
12. The integrated circuit device of claim 10 wherein:
the MEMS resonator is a first MEMS resonator, the resonant frequency is a first resonant frequency, and the temperature-dependent variation is a first temperature-dependent variation;
the integrated circuit device further comprises a second MEMS resonator, wherein the second MEMS resonator is to exhibit a second resonant frequency which has a second temperature-dependent variation;
the circuitry is to generate the digital signal dependent on a relationship between the first resonant frequency and the second resonant frequency.
13. The integrated circuit device of claim 10 wherein:
the integrated circuit device comprises a first die, a second die and a thermally-conductive fill material directly connecting a surface of the first die with a surface of the second die;
the MEMS resonator is on the first die; and
the circuitry is on the second die.
14. The integrated circuit device of claim 10 wherein the storage is programmable via a contact of the one or more external electrical contacts.
15. The integrated circuit device of claim 10 wherein the circuitry is further to output at least part of the digital signal representing the sensed temperature, via the one or more external electrical contacts, as a serial binary signal, and wherein the circuitry is to further output at least part of the polynomial coefficients, via the one or more external electrical contacts, as a serial binary signal.
16. An integrated circuit device comprising:
one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits;
a first die and a second die;
a microelectromechanical-system (MEMS) resonator on the first die, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
a fill material coupling a surface of the first die with a surface of the second die;
circuitry, on the second die, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
programmable storage, on the second die, for polynomial coefficients that describe an empirically-measured temperature-dependent adjustment curve to be applied to the clock signal;
wherein the circuitry is further to
generate a digital signal representing a sensed temperature of operation of the MEMS resonator, and
provide each of the digital signal and the polynomial coefficients, each via a contact of the one or more external electrical contacts, to the one or more other integrated circuits.
17. The integrated circuit device of claim 16 wherein:
the temperature-dependent adjustment curve corresponds to the temperature-dependent variation; and
the circuitry is to output the digital signal and the polynomial coefficients via a same contact of the one or more external electrical contacts.
18. The integrated circuit device of claim 16 wherein:
the MEMS resonator is a first MEMS resonator, the resonant frequency is a first resonant frequency, and the temperature-dependent variation is a first temperature-dependent variation;
the integrated circuit device further comprises a second MEMS resonator, also on the first die, wherein the second MEMS resonator is to exhibit a second resonant frequency which has a second temperature-dependent variation;
the circuitry is to generate the digital signal dependent on a relationship between the first resonant frequency and the second resonant frequency.
19. The integrated circuit device of claim 16 wherein the circuitry is further to output at least part of the digital signal representing the sensed temperature via the one or more external electrical contacts as a serial binary signal, and wherein the circuitry is to further output at least part of the polynomial coefficients, via the one or more external electrical contacts, as a serial binary signal.
20. The integrated circuit device of claim 16 wherein the circuitry is further to output the digital signal representing the sensed temperature via a contact of the one or more external electrical contacts, on demand.