IP Library Granted Patent US 12,151,313
Granted Patent B2
US 12,151,313 · App. 17/387,950 · Granted Nov 26, 2024

Device and method of cutting polarizing plate

Inventors: Kuhyun Kang (Yongin-si, KR); Ilyoung Jeong (Yongin-si, KR); Gyoowan Han (Yongin-si, KR)
Assignee: Samsung Display Co., Ltd.
B23K26/38B23K26/0622B23K26/0648B23K26/082B23K2103/42G02B5/30
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Quick Facts
Patent No.
US 12,151,313
App. No.
17/387,950
Granted
Nov 26, 2024
Kind
B2
Abstract

A polarizing plate-cutting device including a laser beam generator configured to emit a laser beam, a scanner including a rotating mirror configured to reflect the laser beam emitted from the laser beam generator, and a housing accommodating the rotating mirror, a condenser lens configured to condense the laser beam reflected from the rotating mirror, and a mounting block onto which the laser beam condensed by the condenser lens is irradiated and to which a polarizing plate is mounted, wherein the mounting block is fixed with respect to the scanner while the polarizing plate is being cut, and wherein the polarizing plate includes a stacking of a base substrate and a polarizing layer, the base substrate being closer to the condenser lens than the polarizing layer, and a heat resistance of the polarizing layer being lower than that of the base substrate.

Claims (20)

1. A method of cutting a polarizing plate comprising a stacking of a base substrate and a polarizing layer, the method comprising:

irradiating a first laser beam having a first optical power in a direction from the base substrate to the polarizing layer to cut the base substrate; and

cutting the polarizing layer by irradiating a second laser beam having a second optical power in the direction after the base substrate is cut, the second optical power being less than the first optical power,

wherein a heat resistance of the base substrate is higher than that of the polarizing layer,

wherein the method is performed by a polarizing plate-cutting device comprising:

a laser beam generator configured to sequentially emit the first and the second laser beam;

a scanner comprising a rotating mirror configured to reflect the first and second laser beams emitted from the laser beam generator, and a housing accommodating the rotating mirror;

a condenser lens configured to condense the first and second laser beams reflected from the rotating mirror; and

a mounting block onto which the first and second laser beams condensed by the condenser lens are irradiated and to which a polarizing plate is mounted,

wherein the mounting block is fixed with respect to the scanner while the polarizing plate is being cut, and

wherein an intensity of the first optical power is 15 J/cm 2 to 20 J/cm 2 and an intensity of the second optical power is 3 J/cm 2 to about 7 J/cm 2 .

2. The method of claim 1 ,

wherein a pulse repetition frequency (PRF) of the first and second laser beams is about 1 MHz to about 5 MHz.

3. The method of claim 1 ,

wherein a scanning speed at which the first laser beam is irradiated along a cutting line of the base substrate is 3 m/sec to 6 m/sec, and

wherein a scanning speed at which the second laser beam is irradiated along a cutting line of the polarizing layer is 3 m/sec to 6 m/sec.

4. The method of claim 1 ,

wherein the base substrate comprises a stacking of a polyethylene terephthalate (PET) film and a polyimide (PI) film.

5. The method of claim 1 ,

wherein the polarizing layer comprises polyvinyl alcohol (PVA).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2024
From: KANG, KUHYUN; JEONG, ILYOUNG; HAN, GYOOWAN
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 068129/0599 →
Priority Claims (1)
KR 10-2016-0164385 · Dec 5, 2016 · national
Continuity (2)
Division 15828241 · Nov 30, 2017
Related Publication 20210354245A1 · Nov 18, 2021