Optical module having laser chips illuminating a light transmitting member with a parallel incident surface and a non-parallel exit surface
An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The laser assembly and the silicon optical chip are located on the base. The laser assembly includes an upper box, conductive substrates, laser chips and a light transmitting member. The upper box and the base are combined to provide a cavity. The cavity has an opening and a slot. The laser chips are located on the conductive substrates which are at least partially located in the cavity. The light transmitting member is disposed between the upper box and the base, and is configured to enclose the opening. Light exit surfaces of the laser chips are parallel to a light incident surface of the light transmitting member, and the light incident surface and a light exit surface of the light transmitting member are not parallel.
1. An optical module, comprising:
a shell, wherein the shell includes an upper shell and a lower shell;
a circuit board, wherein the circuit board is disposed between the upper shell and the lower shell;
a base, wherein the base is located on the circuit board or in a through hole of the circuit board;
a laser assembly, wherein the laser assembly is located on the base and electrically connected to the circuit board, and is configured to provide first light; and
a silicon optical chip, wherein the silicon optical chip is located on the base, electrically connected to the circuit board and optically connected to the laser assembly, and is configured to receive the first light, and modulate the first light to form a first optical signal;
wherein the laser assembly including:
an upper box, the upper box and the base being combined to provide a cavity;
conductive substrates, the conductive substrates being at least partially located in the cavity and being electrically connected to the circuit board;
laser chips, the laser chips being located on the conductive substrates and being configured to provide the first light for the silicon optical chip; and
a light transmitting member, the light transmitting member being disposed between the upper box and the base, light exit surfaces of the laser chips being parallel to a light incident surface of the light transmitting member, the light incident surface and a light exit surface of the light transmitting member being not parallel, and the light exit surface of the light transmitting member constituting a light exit surface of the laser assembly, wherein
the cavity has an opening and a slot, the opening is located in an optical path where light emitted by the laser chips is emitted to the silicon optical chip, and the slot allows the conductive substrates or wires for electrically connecting the conductive substrates to the circuit board to extend out of the cavity; and
the light transmitting member is configured to enclose the opening.
2. The optical module according to claim 1 , wherein light exit directions of the laser chips are parallel to an axial direction of the laser assembly.
3. The optical module according to claim 1 , wherein light exit directions of the laser chips are not parallel to an axial direction of the laser assembly.
4. The optical module according to claim 1 , wherein a refractive index of the light transmitting member is equal to a refractive index of the silicon optical chip.
5. The optical module according to claim 1 , wherein angle between light exit directions of second laser chips and a normal line of the light exit surface of the light transmitting member is equal to 8°.
6. The optical module according to claim 1 , wherein the light transmitting member is a hexahedron and includes two non-parallel but opposite side faces, and the two side faces of the light transmitting member are the light incident surface and the light exit surface of the light transmitting member, respectively.
7. The optical module according to claim 1 , wherein the light exit surface of the light transmitting member is parallel to a side surface of the silicon optical chip.
8. The optical module according to claim 7 , further comprising an optical glue, wherein the optical glue fills a gap between the light exit surface of the light transmitting member and the side surface of the silicon optical chip.
9. The optical module according to claim 8 , wherein a refractive index of the optical glue is greater than or equal to a refractive index of the silicon optical chip, and is less than or equal to a refractive index of the light transmitting member.
10. The optical module according to claim 9 , wherein the refractive index of the optical glue is greater than or equal to 1.46 and less than or equal to 1.53.
11. The optical module according to claim 8 , wherein a material of the optical glue is epoxy resin.
12. The optical module of claim 1 , wherein the conductive substrates include a first conductive substrate and a second conductive substrate, the laser chips include a first laser chip and a second laser chip, the first laser chip is disposed on the first conductive substrate, the second laser chip is disposed on the second conductive substrate, and light emitted by the first laser chip and light emitted by the second laser chip have a same wavelength.
13. The optical module according to claim 12 , wherein the laser assembly further includes a first focusing lens, a second focusing lens, and an isolator;
the first focusing lens, the isolator and the light transmitting member are sequentially arranged in a light exit direction of the first laser chip, and light emitted by the first laser chip enters the isolator after being converged by the first focusing lens, the isolator allows the light to propagate from the first focusing lens to the light transmitting member and prevents the light from propagating from the light transmitting member to the first focusing lens, and the light transmitting member allows the light to enter the silicon optical chip; and
the second focusing lens, the isolator and the light transmitting member are sequentially arranged in a light exit direction of the second laser chip, and light emitted by the second laser chip enters the isolator after being converged by the second focusing lens, the isolator allows the light to propagate from the second focusing lens to the light transmitting member and prevents the light from propagating from the light transmitting member to the second focusing lens, and the light transmitting member allows the light to enter the silicon optical chip.
14. The optical module according to claim 12 , wherein the laser assembly further includes a first collimating lens, a second collimating lens, a first focusing lens, a second focusing lens, and an isolator;
the first collimating lens, the first focusing lens, the isolator and the light transmitting member are sequentially arranged in a light exit direction of the first laser chip, and light emitted by the first laser chip is directed toward the first focusing lens after being collimated by the first collimating lens and enters the isolator after being converged by the first focusing lens, the isolator allows the light to propagate from the first focusing lens to the light transmitting member and prevents the light from propagating from the light transmitting member to the first focusing lens, and the light transmitting member allows the light to enter the silicon optical chip; and
the second collimating lens, the second focusing lens, the isolator and the light transmitting member are sequentially arranged in a light exit direction of the second laser chip, and light emitted by the second laser chip is directed toward the second focusing lens after being collimated by the first collimating lens and enters the isolator after being converged by the second focusing lens, the isolator allows the light to propagate from the second focusing lens to the light transmitting member and prevents the light from propagating from the light transmitting member to the second focusing lens, and the light transmitting member allows the light to enter the silicon optical chip.
15. The optical module according to claim 1 , wherein the silicon optical chip is further configured to receive a second optical signal from an outside of the optical module, and a side surface of the silicon optical chip has a first optical waveguide end facet, a second optical waveguide end facet and a third optical waveguide end facet;
the second optical waveguide end facet is optically coupled to the laser assembly, and is configured to receive the first light emitted by the laser assembly;
the first optical waveguide end facet is configured to transmit the first optical signal obtained after the modulation by the silicon optical chip to the outside of the optical module; and
the third optical waveguide end facet is configured to receive the second optical signal from the outside of the optical module.
16. The optical module according to claim 15 , further comprising a first optical fiber array, a first optical fiber ribbon, a second optical fiber array, a second optical fiber ribbon, and an optical fiber socket;
one end of the first optical fiber array is optically coupled to the first optical waveguide end facet, and another end of the first optical fiber array is connected to the optical fiber socket through the first optical fiber ribbon;
one end of the second optical fiber array is optically coupled to the third optical waveguide end facet, and another end of the second optical fiber array is connected to the optical fiber socket through the second optical fiber ribbon; and
the optical fiber socket provides an optical port of the optical module.
17. The optical module according to claim 1 , wherein the silicon optical chip is further configured to receive a second optical signal from an outside of the optical module;
the optical module further comprises a transimpedance amplifier, the transimpedance amplifier is disposed on the silicon optical chip, and is configured to convert a current signal generated by the silicon optical chip based on the second optical signal into a differential voltage and transmit the differential voltage to the circuit board, so as to extract data in the second optical signal from the outside of the optical module.
18. The optical module according to claim 1 , further comprising a modulator driver, wherein the modulator driver is disposed on the silicon optical chip, and is configured to amplify a first electrical signal from the circuit board and transmit the first electrical signal to the silicon optical chip, so as to covert the first electrical signal into the first optical signal.
19. An optical module, comprising:
a shell, wherein the shell includes an upper shell and a lower shell;
a circuit board, wherein the circuit board is disposed between the upper shell and the lower shell;
a base, wherein the base is located on the circuit board or in a through hole of the circuit board;
a laser assembly, wherein the laser assembly is located on the base and electrically connected to the circuit board, and is configured to provide first light; and
a silicon optical chip, wherein the silicon optical chip is located on the base, electrically connected to the circuit board and optically connected to the laser assembly, and is configured to receive the first light, and modulate the first light to form a first optical signal;
wherein the laser assembly including:
laser chips, the laser chips being configured to provide the first light with the silicon optical chip; and
a light transmitting member, the light transmitting member being disposed between the laser chips and the silicon optical chip and being located in an optical path where light emitted by the laser chips is directed toward the silicon optical chip, light exit surfaces of the laser chips being parallel to a light incident surface of the light transmitting member, the light incident surface and a light exit surface of the light transmitting member being not parallel, and the light exit surface of the light transmitting member constituting a light exit surface of the laser assembly.