Ball grid array for a semiconductor integrated circuit device
An electronic apparatus includes an integrated circuit board on, over, or in which a USB circuit block is provided; a first USB interface; a second USB interface; a printed circuit board on which a source clock circuit configured to output a source clock is provided; and a ball grid array that includes first, second, and third ball grids for electric coupling between the integrated circuit board and the printed circuit board. The first ball grid electrically couples the USB circuit block and the first USB interface to each other. The second ball grid electrically couples the USB circuit block and the second USB interface to each other. The third ball grid electrically couples the source clock circuit and the USB circuit block to each other. The third ball grid is located between the first ball grid and the second ball grid.
1. An electronic apparatus, comprising:
an integrated circuit board on, over, or in which a universal serial bus (USB) circuit block is provided;
a first USB interface;
a second USB interface;
a printed circuit board on which first connection wiring electrically coupled to the first USB interface, second connection wiring electrically coupled to the second USB interface, and a source clock circuit configured to output a source clock are provided; and
a ball grid array that includes a first ball grid, a second ball grid, and a third ball grid for electric coupling between the integrated circuit board and the printed circuit board; wherein
the first ball grid electrically couples the USB circuit block and the first USB interface to each other via the first connection wiring,
the second ball grid electrically couples the USB circuit block and the second USB interface to each other via the second connection wiring,
the third ball grid electrically couples the source clock circuit and the USB circuit block to each other, and
the third ball grid is located between the first ball grid and the second ball grid.
2. The electronic apparatus according to claim 1 , wherein
the ball grid array further includes a fourth ball grid and a fifth ball grid,
one of a pair of first differential signals supplied via the first USB interface flows through the first ball grid,
one of a pair of second differential signals supplied via the second USB interface flows through the second ball grid,
an other of the pair of first differential signals flows through the fourth ball grid,
an other of the pair of second differential signals flows through the fifth ball grid,
the fourth ball grid is located between the first ball grid and the third ball grid, and
the fifth ball grid is located between the second ball grid and the third ball grid.
3. The electronic apparatus according to claim 1 , wherein
the ball grid array further includes a sixth ball grid,
a source generation signal for generating the source clock flows through the sixth ball grid, and
the sixth ball grid is located between the first ball grid and the second ball grid.
4. The electronic apparatus according to claim 1 , wherein
the ball grid array further includes a seventh ball grid and an eighth ball grid,
signals for reference potential of the USB circuit block flow through the seventh ball grid and the eighth ball grid,
the seventh ball grid is located between the first ball grid and the third ball grid, and
the eighth ball grid is located between the second ball grid and the third ball grid.
5. The electronic apparatus according to claim 1 , wherein
the ball grid array further includes a ninth ball grid and a tenth ball grid,
signals for reference potential of the USB circuit block flow through the ninth ball grid and the tenth ball grid,
the first ball grid is located between the ninth ball grid and the third ball grid, and
the second ball grid is located between the tenth ball grid and the third ball grid.
6. The electronic apparatus according to claim 1 , wherein
the USB circuit block supports a communication speed of 5 Gbps or faster.
7. A semiconductor integrated circuit device configured to be electrically coupled to a printed circuit board, the semiconductor integrated circuit device comprising:
an integrated circuit board on, over, or in which a universal serial bus (USB) circuit block is provided; and
a ball grid array for electric coupling between the integrated circuit board and the printed circuit board; wherein
the ball grid array includes a first ball grid, a second ball grid, and a third ball grid,
the first ball grid is electrically coupled to the USB circuit block,
the second ball grid is electrically coupled to the USB circuit block,
a source clock supplied to the USB circuit block flows through the third ball grid, and
the third ball grid is located between the first ball grid and the second ball grid.
8. The semiconductor integrated circuit device according to claim 7 , wherein
the ball grid array further includes a fourth ball grid and a fifth ball grid,
one of a pair of first differential signals supplied to the USB circuit block flows through the first ball grid,
one of a pair of second differential signals supplied to the USB circuit block flows through the second ball grid,
an other of the pair of first differential signals flows through the fourth ball grid,
an other of the pair of second differential signals flows through the fifth ball grid,
the fourth ball grid is located between the first ball grid and the third ball grid, and
the fifth ball grid is located between the second ball grid and the third ball grid.
9. The semiconductor integrated circuit device according to claim 7 , wherein
the ball grid array further includes a sixth ball grid,
a source generation signal for generating the source clock flows through the sixth ball grid, and
the sixth ball grid is located between the first ball grid and the second ball grid.
10. The semiconductor integrated circuit device according to claim 7 , wherein
the ball grid array further includes a seventh ball grid and an eighth ball grid,
signals for reference potential of the USB circuit block flow through the seventh ball grid and the eighth ball grid,
the seventh ball grid is located between the first ball grid and the third ball grid, and
the eighth ball grid is located between the second ball grid and the third ball grid.
11. The semiconductor integrated circuit device according to claim 7 , wherein
the ball grid array further includes a ninth ball grid and a tenth ball grid,
signals for reference potential of the USB circuit block flow through the ninth ball grid and the tenth ball grid,
the first ball grid is located between the ninth ball grid and the third ball grid, and
the second ball grid is located between the tenth ball grid and the third ball grid.
12. The semiconductor integrated circuit device according to claim 7 , wherein
the USB circuit block supports a communication speed of 5 Gbps or faster.