IP Library Granted Patent US 12,207,402
Granted Patent B2
US 12,207,402 · App. 17/573,807 · Granted Jan 21, 2025

Printed circuit board for transmitting electrical energy and for signal transmission and system having such a printed circuit board

Inventors: Stephan Friedl (Taufkirchen, DE); Florian Kapaun (Taufkirchen, DE)
Assignee: Airbus Defence and Space GmbH
H05K1/09H05K1/0298H05K1/11H10N60/80H05K1/0263H05K1/18
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Quick Facts
Patent No.
US 12,207,402
App. No.
17/573,807
Granted
Jan 21, 2025
Kind
B2
Abstract

A printed circuit board for transmitting electrical energy and for signal transmission includes electrical conductor tracks coupled to the printed circuit board wherein the electrical conductor tracks include a first electrical conductor track with a superconducting material. The first electrical conductor track is designed to provide electrical energy directly to a power electronics system. The electrical conductor tracks include a second electrical conductor track which is designed to provide a signal transmission to a signal electronics system. A system is disclosed having such a printed circuit board.

Claims (29)

1. A printed circuit board for transmitting electrical energy and for signal transmission, the printed circuit board comprising:

a plurality of electrical conductor tracks coupled to the printed circuit board;

the plurality of electrical conductor tracks comprising a first electrical conductor track which comprises a superconducting material;

wherein the first electrical conductor track is configured to provide electrical energy directly to a power electronics system;

wherein the plurality of electrical conductor tracks includes a second electrical conductor track having non-superconducting material properties configured to provide a signal transmission to a signal electronics system;

wherein the plurality of electrical conductor tracks includes a further electrical conductor track which comprises a superconducting material and is configured in a form of a strip; and

wherein the first electrical conductor track comprising superconducting material and the further electrical conductor track comprising superconducting material are in a stacked arrangement in or on a frame of the printed circuit board.

2. The printed circuit board of claim 1 , wherein:

the power electronics system is integrated into the printed circuit board; and/or

the signal electronics system is integrated into the printed circuit board.

3. The printed circuit board of claim 1 , wherein the first electrical conductor track comprising superconducting material is configured to transmit electric current of at least 400 A.

4. The printed circuit board of claim 1 , comprising:

an electrical terminal connection configured to connect the first electrical conductor track to the power electronics system or to an energy source;

wherein the electrical terminal connection is formed at a first end in a manner of a connection screw which projects out of a surface of the printed circuit board and can be connected to the power electronics system or to the energy source; and

wherein the electrical terminal connection is soldered at a second end to the first electrical conductor track.

5. The printed circuit board of claim 4 , wherein:

the electrical terminal connection has, at the second end thereof, an interface region for connecting the electrical terminal connection to the first electrical conductor track; and

the interface region has an electrically conductive contact surface of at least 140 mm 2 .

6. The printed circuit board of claim 1 , wherein the first electrical conductor track comprising superconducting material and the further electrical conductor track comprising superconducting material mutually cross one another and are soldered to one another in a region of the mutual crossing.

7. The printed circuit board of claim 1 , wherein the first electrical conductor track is constructed of a plurality of materials or layers.

8. The printed circuit board of claim 7 , wherein the plurality of materials or layers include a ceramic layer.

9. The printed circuit board of claim 7 , wherein the plurality of materials or layers include a silver contact layer.

10. The printed circuit board of claim 7 , wherein the plurality of materials or layers include a copper sheath.

11. The printed circuit board of claim 1 , wherein the first electrical conductor track comprising superconducting material is in a form of a strip which is integrated in a frame of the printed circuit board.

12. The printed circuit board of claim 11 , wherein the strip of the first electrical conductor track has a width of at least 10 mm and a height of at most 0.08 mm.

13. The printed circuit board of claim 1 , wherein the first electrical conductor track is provided in a form of a strip having a width of at least 10 mm and a height of at most 0.08 mm.

14. A system, comprising:

the printed circuit board of claim 1 ,

wherein the printed circuit board is arranged together with the power electronics system in a region of the system, the region having cryogenic temperature properties.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2022
From: FRIEDL, STEPHAN; KAPAUN, FLORIAN
To: AIRBUS DEFENCE AND SPACE GMBH
Reel/Frame 059031/0941 →
Priority Claims (1)
DE 10 2021 100 398.9 · Jan 12, 2021 · national
Continuity (1)
Related Publication 20220225499A1 · Jul 14, 2022
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