Same level MRAM stacks having different configurations
A semiconductor device is provided. The semiconductor device includes a base layer, a first MRAM device formed on the base layer, and a second MRAM device formed on the base layer. The first MRAM device has a different performance characteristic than the second MRAM device.
1. A semiconductor device comprising:
a base layer selected from the group consisting of a back end of line (BBOL) layer, a middle of line (MOL) layer and a front end of line (FEOL) layer;
a plurality of bottom contacts formed in the base layer,
a first MRAM device that is a cache bit formed on the base layer in contact with one of the plurality of bottom contacts in a first area; and
a plurality of second MRAM devices that are storage bit devices formed on the base layer in contact with one of the plurality of bottom contacts in a second area that surrounds the first area, the plurality of second MRAM devices being formed at a same level as the first MRAM device on the base layer,
wherein the first MRAM device has a smaller critical dimension than the plurality of second MRAM devices,
wherein the first MRAM device has a lower data retention characteristic and a lower switching current than the plurality of second MRAM devices, and
wherein the plurality of second MRAM devices have a lower programming speed and a lower response time than the first MRAM device, and
wherein a height of the first MRAM device is higher than a height of the plurality of second MRAM devices.
2. The semiconductor device of claim 1 ,
wherein the first MRAM device includes a first bottom electrode, a first MRAM stack, and a first top electrode, and
wherein each of the plurality of second MRAM devices include a second bottom electrode, a second MRAM stack, and a second top electrode.
3. The semiconductor device of claim 2 , wherein a thickness of the first bottom electrode is different than a thickness of the second bottom electrode.
4. The semiconductor device of claim 2 , wherein a thickness of the first top electrode is different than a thickness of the second top electrode.
5. The semiconductor device of claim 2 ,
wherein the first MRAM device includes a spacer layer formed on sidewalls of the first bottom electrode, the first MRAM stack, and the first top electrode, and
wherein each of the plurality of second MRAM devices includes a second spacer layer formed on sidewalls of the second bottom electrode, the second MRAM stack, and the second top electrode.
6. The semiconductor device of claim 1 , wherein the first MRAM device and the plurality of second MRAM devices each include a fixed magnetization layer, an insulating barrier layer, and a free magnetization layer.
7. A method of manufacturing a semiconductor device, the method comprising:
forming a base layer selected from the group consisting of a back end of line (BEOL) layer a middle of line (MOL) layer and a front end of line (FEOL) layer;
forming a plurality of bottom contacts in the base layer;
forming a first MRAM device that is a cache bit on the base layer in contact with one of the plurality f bottom contacts in a first area; and
forming a plurality of second MRAM devices that are storage bit devices on the base layer in contact with one of the plurality of bottom contacts in a second area, the second area surrounding the first area, the plurality of second MRAM devices being formed at a same level as the first MRAM device on the base layer,
wherein the first MRAM device has a smaller critical dimension than the plurality of second MRAM devices,
wherein the first MRAM device has a lower data retention characteristic and a lower switching current than the plurality of second MRAM devices, and
wherein the plurality of second MRAM devices have a lower programming speed and a lower response time than the first MRAM device, and
wherein a height of the first MRAM device is higher than a height of the plurality of second MRAM devices.
8. The method of claim 7 ,
wherein forming the first MRAM device includes forming a first bottom electrode, forming a first MRAM stack on the first bottom electrode, and forming a first top electrode on the first MRAM stack, and
wherein forming each of the plurality of second MRAM devices includes forming a second bottom electrode, forming a second MRAM stack on the second bottom electrode, and forming a second top electrode on the second MRAM stack.
9. The method of claim 8 , wherein a thickness of the first bottom electrode is different than a thickness of the second bottom electrode.
10. The method of claim 8 , wherein a thickness of the first top electrode is different than a thickness of the second top electrode.
11. The method of claim 8 ,
wherein the first MRAM device includes a spacer layer formed on sidewalls of the first bottom electrode, the first MRAM stack, and the first top electrode, and
wherein the plurality of second MRAM devices include a second spacer layer formed on sidewalls of the second bottom electrode, the second MRAM stack, and the second top electrode.
12. The method of claim 7 , wherein the first MRAM device and the plurality of second MRAM devices each include a fixed magnetization layer, an insulating barrier layer, and a free magnetization layer.