IP Library Granted Patent US 12,208,739
Granted Patent B2
US 12,208,739 · App. 18/153,440 · Granted Jan 28, 2025

Vehicular camera assembly process with enhanced attachment of imager assembly at camera housing

Inventors: Garret F. Achenbach (Rochester Hills, MI); Martin J. Reckker (Troy, MI); Steven G. Gebauer (Oxford, MI); Jianguo Wang (Troy, MI)
Assignee: Magna Electronics Inc.
B60R1/24B60R11/04H04N23/51H04N23/55
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Quick Facts
Patent No.
US 12,208,739
App. No.
18/153,440
Granted
Jan 28, 2025
Kind
B2
Abstract

A vehicular camera module includes a housing for mounting at a vehicular windshield, a processor printed circuit board (processor PCB) disposed in the housing, and an imager assembly. The imager assembly includes (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board (imager PCB), and (iii) a flexible electrical ribbon cable that electrically connects the imager PCB to the processor PCB. An imager is disposed at a first side of the imager PCB. The imager PCB includes an imager portion at which the imager is disposed and attaching portions at respective outboard ends. At least one stress relieving portion is established at the imager PCB between the imager portion and each of the attaching portions. With the lens barrel received through an aperture of the housing, the attaching portions of the imager PCB are attached at the housing via respective fasteners.

Claims (55)

1. A vehicular camera module, the vehicular camera module comprising:

a camera housing configured for mounting at an in-cabin side of a windshield of a vehicle equipped with the vehicular camera module, wherein the vehicular camera module, with the camera housing mounted at the in-cabin side of the windshield of the vehicle, views forward of the vehicle through the windshield;

a processor printed circuit board disposed in the camera housing;

an imager assembly, the imager assembly comprising (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board and (iii) a flexible electrical ribbon cable;

wherein the imager printed circuit board is electrically connected to the processor printed circuit board via the flexible electrical ribbon cable;

wherein the camera housing has an upper housing portion and a lower housing portion, and wherein, with the camera housing mounted at the in-cabin side of the windshield of the vehicle, the upper housing portion is above the lower housing portion and attached thereto;

wherein the upper housing portion has an aperture that receives the lens barrel;

wherein the imager printed circuit board comprises a first side and a second side opposite the first side and separated from the first side by a thickness of the imager printed circuit board;

wherein the imager printed circuit board comprises (i) an imager portion and (ii) attaching portions at respective outboard ends of the imager printed circuit board;

wherein an imager is disposed at the first side of the imager portion of the imager printed circuit board;

wherein at least one stress relieving portion is established at the imager printed circuit board between the imager portion and each of the attaching portions, wherein the at least one stress relieving portion comprises at least one region of the imager printed circuit board that is more flexible than the imager portion and the attaching portions of the imager printed circuit board; and

wherein, with the lens barrel received through the aperture of the upper housing portion of the camera housing, the attaching portions of the imager printed circuit board are attached at the upper housing portion of the camera housing via respective fasteners.

2. The vehicular camera module of claim 1 , wherein the at least one stress relieving portion comprises (i) a first stress relieving portion between the imager portion and a first outboard end of the imager printed circuit board, and (ii) a second stress relieving portion between the imager portion and a second outboard end of the imager printed circuit board, the second outboard end being at an opposite side of the imaging portion from the first outboard end.

3. The vehicular camera module of claim 1 , wherein the at least one stress relieving portion comprises at least one stress relieving slot established at least partially through the imager printed circuit board.

4. The vehicular camera module of claim 3 , wherein the at least one stress relieving slot comprises (i) first and second stress relieving slots between the imager portion and a first outboard end of the imager printed circuit board, and (ii) third and fourth stress relieving slots between the imager portion and a second outboard end of the imager printed circuit board.

5. The vehicular camera module of claim 4 , wherein the first and third stress relieving slots extend through the imager printed circuit board from a first edge of the imager printed circuit board and partially between the imager portion and the respective first and second outboard ends of the imager printed circuit board, and wherein the second and fourth stress relieving slots extend through the imager printed circuit board from a second edge of the imager printed circuit board, opposite the first edge, and partially between the imager portion and the respective first and second outboard ends of the imager printed circuit board.

6. The vehicular camera module of claim 4 , wherein the second and fourth stress relieving slots are, respectively, disposed further outboard of the imager portion than the first and third stress relieving slots.

7. The vehicular camera module of claim 1 , wherein a fastener receiving portion is established at the imager printed circuit board at each of the attaching portions, and wherein, with the attaching portions attached at the upper housing portion of the camera housing, the respective fastener receiving portions receive the respective fasteners.

8. The vehicular camera module of claim 1 , wherein, with the attaching portions attached at the upper housing portion of the camera housing via the respective fasteners, the attaching portions are movable relative to the imager portion via flexing at the at least one stress relieving portion.

9. The vehicular camera module of claim 1 , wherein the at least one stress relieving portion comprises a flexible material disposed between the imager portion and each of the attaching portions.

10. A vehicular camera module, the vehicular camera module comprising:

a camera housing configured for mounting at an in-cabin side of a windshield of a vehicle equipped with the vehicular camera module, wherein the vehicular camera module, with the camera housing mounted at the in-cabin side of the windshield of the vehicle, views forward of the vehicle through the windshield;

a processor printed circuit board disposed in the camera housing;

an imager assembly, the imager assembly comprising (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board, (iii) an attaching flange attached at the lens barrel, and (iv) a flexible electrical ribbon cable;

wherein the imager printed circuit board is electrically connected to the processor printed circuit board via the flexible electrical ribbon cable;

wherein the camera housing has an upper housing portion and a lower housing portion, and wherein, with the camera housing mounted at the in-cabin side of the windshield of the vehicle, the upper housing portion is above the lower housing portion and attached thereto;

wherein the upper housing portion has an aperture that receives the lens barrel;

wherein the imager printed circuit board comprises a first side and a second side opposite the first side and separated from the first side by a thickness of the imager printed circuit board;

wherein an imager is disposed at the first side of the imager printed circuit board;

wherein a board end of the lens barrel is attached at the first side of the imager printed circuit board, and wherein the attaching flange is disposed along the lens barrel and spaced from the board end of the lens barrel and spaced from the imager printed circuit board; and

wherein, with the lens barrel received through the aperture of the upper housing portion of the camera housing, the attaching flange is attached at an inner side of the upper housing portion of the camera housing via at least one fastener.

11. The vehicular camera module of claim 10 , wherein the imager assembly further comprises an anti-warping ring attached at the second side of the imager printed circuit board.

12. The vehicular camera module of claim 11 , wherein the anti-warping ring circumscribes a region of the second side of the imager printed circuit board that is opposite from the imager disposed at the first side of the imager printed circuit board.

13. The vehicular camera module of claim 10 , wherein the board end of the lens barrel circumscribes the imager at the first side of the imager printed circuit board.

14. The vehicular camera module of claim 10 , wherein the board end of the lens barrel is attached at the first side of the imager printed circuit board via at least one of (i) an adhesive disposed between the board end of the lens barrel and the first side of the imager printed circuit board, and (ii) at least one fastener.

15. The vehicular camera module of claim 10 , wherein a spacing ring is attached at the first side of the imager printed circuit board and at least partially circumscribes the imager at the first side of the imager printed circuit board.

16. The vehicular camera module of claim 15 , wherein the spacing ring is disposed between the first side of the imager printed circuit board and the board end of the lens barrel.

17. The vehicular camera module of claim 15 , wherein the spacing ring at least partially circumscribes the board end of the lens barrel.

18. A vehicular camera module, the vehicular camera module comprising:

a camera housing configured for mounting at an in-cabin side of a windshield of a vehicle equipped with the vehicular camera module, wherein the vehicular camera module, with the camera housing mounted at the in-cabin side of the windshield of the vehicle, views forward of the vehicle through the windshield;

a processor printed circuit board disposed in the camera housing;

an imager assembly, the imager assembly comprising (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board and (iii) a flexible electrical ribbon cable;

wherein the imager printed circuit board is electrically connected to the processor printed circuit board via the flexible electrical ribbon cable;

wherein the camera housing has an upper housing portion and a lower housing portion, and wherein, with the camera housing mounted at the in-cabin side of the windshield of the vehicle, the upper housing portion is above the lower housing portion and attached thereto;

wherein the upper housing portion has an aperture that receives the lens barrel;

wherein the imager printed circuit board comprises a first side and a second side opposite the first side and separated from the first side by a thickness of the imager printed circuit board;

wherein the imager printed circuit board comprises (i) an imager portion and (ii) attaching portions at respective outboard ends of the imager printed circuit board;

wherein an imager is disposed at the first side of the imager portion of the imager printed circuit board;

wherein at least one stress relieving slot is established at least partially through the imager printed circuit board and at least partially between the imager portion and each of the attaching portions;

wherein the at least one stress relieving slot comprises (i) first and second stress relieving slots between the imager portion and a first outboard end of the imager printed circuit board, and (ii) third and fourth stress relieving slots between the imager portion and a second outboard end of the imager printed circuit board;

wherein the first and third stress relieving slots extend through the imager printed circuit board from a first edge of the imager printed circuit board and partially between the imager portion and the respective first and second outboard ends of the imager printed circuit board, and wherein the second and fourth stress relieving slots extend through the imager printed circuit board from a second edge of the imager printed circuit board, opposite the first edge, and partially between the imager portion and the respective first and second outboard ends of the imager printed circuit board; and

wherein, with the lens barrel received through the aperture of the upper housing portion of the camera housing, the attaching portions of the imager printed circuit board are attached at the upper housing portion of the camera housing via respective fasteners.

19. The vehicular camera module of claim 18 , wherein the second and fourth stress relieving slots are, respectively, disposed further outboard of the imager portion than the first and third stress relieving slots.

20. The vehicular camera module of claim 18 , wherein a fastener receiving portion is established at the imager printed circuit board at each of the attaching portions, and wherein, with the attaching portions attached at the upper housing portion of the camera housing, the respective fastener receiving portions receive the respective fasteners.

21. The vehicular camera module of claim 18 , wherein, with the attaching portions attached at the upper housing portion of the camera housing via the respective fasteners, the attaching portions are movable relative to the imager portion via flexing at the at least one stress relieving slot.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2023
From: ACHENBACH, GARRET F.; RECKKER, MARTIN J.; GEBAUER, STEVEN G.; WANG, JIANGUO
To: MAGNA ELECTRONICS INC.
Reel/Frame 062356/0364 →
Continuity (2)
Provisional Application 63266735 · Jan 13, 2022
Related Publication 20230219500A1 · Jul 13, 2023
References Cited (215)
US 4634884A · Hayashimoto et al. · 1987 [cited by applicant]
US 5096287A · Kakinami et al. · 1992 [cited by applicant]
US 5130804A · Tamura · 1992 [cited by applicant]
US 5204615A · Richards et al. · 1993 [cited by applicant]
US 5550677A · Schofield et al. · 1996 [cited by applicant]
US 5587236A · Agrawal et al. · 1996 [cited by applicant]
US 5670935A · Schofield et al. · 1997 [cited by applicant]
US 5796094A · Schofield et al. · 1998 [cited by applicant]
US 5877897A · Schofield et al. · 1999 [cited by applicant]
US 5920061A · Feng · 1999 [cited by applicant]
US 5949331A · Schofield et al. · 1999 [cited by applicant]
US 6087953A · DeLine et al. · 2000 [cited by applicant]
US 6097023A · Schofield et al. · 2000 [cited by applicant]
US 6124886A · DeLine et al. · 2000 [cited by applicant]
US 6151065A · Steed et al. · 2000 [cited by applicant]
US 6172613B1 · DeLine et al. · 2001 [cited by applicant]
US 6243003B1 · DeLine et al. · 2001 [cited by applicant]
US 6250148B1 · Lynam · 2001 [cited by applicant]
US 6259475B1 · Ramachandran et al. · 2001 [cited by applicant]
US 6278377B1 · DeLine et al. · 2001 [cited by applicant]
US 6313454B1 · Bos et al. · 2001 [cited by applicant]
US 6320176B1 · Schofield et al. · 2001 [cited by applicant]
US 6326613B1 · Heslin et al. · 2001 [cited by applicant]
US 6329925B1 · Skiver et al. · 2001 [cited by applicant]
US 6341523B2 · Lynam · 2002 [cited by applicant]
US 6353392B1 · Schofield et al. · 2002 [cited by applicant]
US 6396397B1 · Bos et al. · 2002 [cited by applicant]
US 6420975B1 · DeLine et al. · 2002 [cited by applicant]
US 6428172B1 · Hutzel et al. · 2002 [cited by applicant]
US 6445287B1 · Schofield et al. · 2002 [cited by applicant]
US 6466136B2 · DeLine et al. · 2002 [cited by applicant]
US 6498620B2 · Schofield et al. · 2002 [cited by applicant]
US 6501387B2 · Skiver et al. · 2002 [cited by applicant]
US 6559435B2 · Schofield et al. · 2003 [cited by applicant]
US 6593565B2 · Heslin et al. · 2003 [cited by applicant]
US 6690268B2 · Schofield et al. · 2004 [cited by applicant]
US 6768422B2 · Schofield et al. · 2004 [cited by applicant]
US 6774356B2 · Heslin et al. · 2004 [cited by applicant]
US 6795237B1 · Marinelli et al. · 2004 [cited by applicant]
US 6806452B2 · Bos et al. · 2004 [cited by applicant]
US 6822563B2 · Bos et al. · 2004 [cited by applicant]
US 6824281B2 · Schofield et al. · 2004 [cited by applicant]
US 6831261B2 · Schofield et al. · 2004 [cited by applicant]
US 6953253B2 · Schofield et al. · 2005 [cited by applicant]
US 6968736B2 · Lynam · 2005 [cited by applicant]
US 7004593B2 · Weller et al. · 2006 [cited by applicant]
US 7038577B2 · Pawlicki et al. · 2006 [cited by applicant]
US 7095572B2 · Lee et al. · 2006 [cited by applicant]
US 7188963B2 · Schofield et al. · 2007 [cited by applicant]
US 7205904B2 · Schofield · 2007 [cited by applicant]
US 7215479B1 · Bakin · 2007 [cited by applicant]
US 7262406B2 · Heslin et al. · 2007 [cited by applicant]
US 7265342B2 · Heslin et al. · 2007 [cited by applicant]
US 7289037B2 · Uken et al. · 2007 [cited by applicant]
US 7311406B2 · Schofield et al. · 2007 [cited by applicant]
US 7325934B2 · Schofield et al. · 2008 [cited by applicant]
US 7339149B1 · Schofield et al. · 2008 [cited by applicant]
US 7344261B2 · Schofield et al. · 2008 [cited by applicant]
US 7355524B2 · Schofield · 2008 [cited by applicant]
US 7388182B2 · Schofield et al. · 2008 [cited by applicant]
US 7402786B2 · Schofield et al. · 2008 [cited by applicant]
US 7420159B2 · Heslin et al. · 2008 [cited by applicant]
US 7423248B2 · Schofield et al. · 2008 [cited by applicant]
US 7425076B2 · Schofield et al. · 2008 [cited by applicant]
US 7480149B2 · DeWard et al. · 2009 [cited by applicant]
US 7526103B2 · Schofield et al. · 2009 [cited by applicant]
US 7533998B2 · Schofield et al. · 2009 [cited by applicant]
US 7536316B2 · Ozer et al. · 2009 [cited by applicant]
US 7538316B2 · Heslin et al. · 2009 [cited by applicant]
US 7551103B2 · Schofield · 2009 [cited by applicant]
US 7579939B2 · Schofield et al. · 2009 [cited by applicant]
US 7616781B2 · Schofield et al. · 2009 [cited by applicant]
US 7655894B2 · Schofield et al. · 2010 [cited by applicant]
US 7679498B2 · Pawlicki et al. · 2010 [cited by applicant]
US 7697027B2 · McMahon et al. · 2010 [cited by applicant]
US 7720580B2 · Higgins-Luthman · 2010 [cited by applicant]
US 7728721B2 · Schofield et al. · 2010 [cited by applicant]
US 7855755B2 · Weller et al. · 2010 [cited by applicant]
US 7877175B2 · Higgins-Luthman · 2011 [cited by applicant]
US 7888629B2 · Heslin et al. · 2011 [cited by applicant]
US 7916009B2 · Schofield et al. · 2011 [cited by applicant]
US 7918570B2 · Weller et al. · 2011 [cited by applicant]
US 7946505B2 · Lynam et al. · 2011 [cited by applicant]
US 7965336B2 · Bingle et al. · 2011 [cited by applicant]
US 7972045B2 · Schofield · 2011 [cited by applicant]
US 7994462B2 · Schofield et al. · 2011 [cited by applicant]
US 8063759B2 · Bos et al. · 2011 [cited by applicant]
US 8070332B2 · Higgins-Luthman et al. · 2011 [cited by applicant]
US 8090153B2 · Schofield et al. · 2012 [cited by applicant]
US 8142059B2 · Higgins-Luthman et al. · 2012 [cited by applicant]
US 8162518B2 · Schofield · 2012 [cited by applicant]
US 8179437B2 · Schofield et al. · 2012 [cited by applicant]
US 8194133B2 · DeWind et al. · 2012 [cited by applicant]
US 8203440B2 · Schofield et al. · 2012 [cited by applicant]
US 8222588B2 · Schofield et al. · 2012 [cited by applicant]
US 8223203B2 · Ohsumi et al. · 2012 [cited by applicant]
US 8239086B2 · Higgins-Luthman · 2012 [cited by applicant]
US 8254011B2 · Baur et al. · 2012 [cited by applicant]
US 8256821B2 · Lawlor et al. · 2012 [cited by applicant]
US 8289142B2 · Pawlicki et al. · 2012 [cited by applicant]
US 8294608B1 · Lynam · 2012 [cited by applicant]
US 8314689B2 · Schofield et al. · 2012 [cited by applicant]
US 8324552B2 · Schofield et al. · 2012 [cited by applicant]
US 8325986B2 · Schofield et al. · 2012 [cited by applicant]
US 8339453B2 · Blake, III et al. · 2012 [cited by applicant]
US 8355839B2 · Schofield et al. · 2013 [cited by applicant]
US 8376595B2 · Higgins-Luthman · 2013 [cited by applicant]
US 8386114B2 · Higgins-Luthman · 2013 [cited by applicant]
US 8405725B2 · McMahon et al. · 2013 [cited by applicant]
US 8405726B2 · Schofield et al. · 2013 [cited by applicant]
US 8451332B2 · Rawlings · 2013 [cited by applicant]
US 8513590B2 · Heslin et al. · 2013 [cited by applicant]
US 8529075B2 · Yamada et al. · 2013 [cited by applicant]
US 8531278B2 · DeWard et al. · 2013 [cited by applicant]
US 8534887B2 · DeLine et al. · 2013 [cited by applicant]
US 8542451B2 · Lu et al. · 2013 [cited by applicant]
US 8629768B2 · Bos et al. · 2014 [cited by applicant]
US 8665079B2 · Pawlicki et al. · 2014 [cited by applicant]
US 8743203B2 · Karner et al. · 2014 [cited by applicant]
US 8851690B2 · Uken et al. · 2014 [cited by applicant]
US 8944655B2 · Verrat-Debailleul et al. · 2015 [cited by applicant]
US 9150165B1 · Fortin et al. · 2015 [cited by applicant]
US 9156403B2 · Rawlings et al. · 2015 [cited by applicant]
US 9160908B2 · Mori et al. · 2015 [cited by applicant]
US 9233641B2 · Sesti et al. · 2016 [cited by applicant]
US 9277104B2 · Sesti et al. · 2016 [cited by applicant]
US 9451138B2 · Winden et al. · 2016 [cited by applicant]
US 9487159B2 · Achenbach · 2016 [cited by applicant]
US 9596387B2 · Achenbach et al. · 2017 [cited by applicant]
US 9871971B2 · Wang et al. · 2018 [cited by applicant]
US 9896039B2 · Achenbach et al. · 2018 [cited by applicant]
US 10214157B2 · Achenbach et al. · 2019 [cited by applicant]
US 10264219B2 · Mleczko et al. · 2019 [cited by applicant]
US 10272857B2 · Conger et al. · 2019 [cited by applicant]
US 10576908B2 · Achenbach et al. · 2020 [cited by applicant]
US 10946813B2 · Achenbach et al. · 2021 [cited by applicant]
US 11390223B2 · Achenbach et al. · 2022 [cited by applicant]
US 11697382B2 · Achenbach et al. · 2023 [cited by applicant]
US 11964617B2 · Achenbach et al. · 2024 [cited by applicant]
US 20030169522A1 · Schofield et al. · 2003 [cited by applicant]
US 20050141106A1 · Lee et al. · 2005 [cited by applicant]
US 20060050018A1 · Hutzel et al. · 2006 [cited by applicant]
US 20060077575A1 · Nakai et al. · 2006 [cited by applicant]
US 20060103727A1 · Tseng · 2006 [cited by applicant]
US 20070221826A1 · Bechtel et al. · 2007 [cited by applicant]
US 20080252882A1 · Kesterson · 2008 [cited by applicant]
US 20090244361A1 · Gebauer et al. · 2009 [cited by applicant]
US 20090295181A1 · Lawlor et al. · 2009 [cited by applicant]
US 20100110192A1 · Johnston et al. · 2010 [cited by applicant]
US 20100134616A1 · Seger et al. · 2010 [cited by applicant]
US 20100165468A1 · Yamada et al. · 2010 [cited by applicant]
US 20100279438A1 · An et al. · 2010 [cited by applicant]
US 20110025850A1 · Maekawa et al. · 2011 [cited by applicant]
US 20110298925A1 · Inoue et al. · 2011 [cited by applicant]
US 20120008129A1 · Lu et al. · 2012 [cited by applicant]
US 20120013741A1 · Blake, III et al. · 2012 [cited by applicant]
US 20120081550A1 · Sewell · 2012 [cited by applicant]
US 20120265416A1 · Lu et al. · 2012 [cited by applicant]
US 20130002873A1 · Hess · 2013 [cited by applicant]
US 20130076905A1 · Blake, III et al. · 2013 [cited by applicant]
US 20130242099A1 · Sauer et al. · 2013 [cited by applicant]
US 20130293771A1 · Mori et al. · 2013 [cited by applicant]
US 20140015977A1 · Taylor et al. · 2014 [cited by applicant]
US 20140043465A1 · Salomonsson et al. · 2014 [cited by applicant]
US 20140055671A1 · Kawamura · 2014 [cited by applicant]
US 20140160284A1 · Achenbach et al. · 2014 [cited by applicant]
US 20140168507A1 · Renaud · 2014 [cited by applicant]
US 20140226012A1 · Achenbach · 2014 [cited by applicant]
US 20140298642A1 · Sesti et al. · 2014 [cited by applicant]
US 20140321064A1 · Bose et al. · 2014 [cited by applicant]
US 20140354878A1 · Winter et al. · 2014 [cited by applicant]
US 20140373345A1 · Steigerwald · 2014 [cited by applicant]
US 20150015713A1 · Wang et al. · 2015 [cited by applicant]
US 20150029337A1 · Uchiyama et al. · 2015 [cited by applicant]
US 20150124098A1 · Winden et al. · 2015 [cited by applicant]
US 20150146094A1 · Seger et al. · 2015 [cited by applicant]
US 20150222795A1 · Sauer et al. · 2015 [cited by applicant]
US 20150251605A1 · Uken et al. · 2015 [cited by applicant]
US 20150266430A1 · Mleczko et al. · 2015 [cited by applicant]
US 20150327398A1 · Achenbach et al. · 2015 [cited by applicant]
US 20150365569A1 · Mai et al. · 2015 [cited by applicant]
US 20160037028A1 · Biemer · 2016 [cited by applicant]
US 20160268716A1 · Conger et al. · 2016 [cited by applicant]
US 20170054881A1 · Conger · 2017 [cited by examiner]
US 20170129419A1 · Conger · 2017 [cited by examiner]
US 20170133811A1 · Conger et al. · 2017 [cited by applicant]
US 20170295306A1 · Mleczko · 2017 [cited by applicant]
US 20170302829A1 · Mleczko et al. · 2017 [cited by applicant]
US 20180072239A1 · Wienecke et al. · 2018 [cited by applicant]
US 20190007591A1 · Wang · 2019 [cited by examiner]
US 20190118730A1 · Devota · 2019 [cited by examiner]
US 20200010024A1 · Sesti et al. · 2020 [cited by applicant]
US 20200039447A1 · Winden · 2020 [cited by examiner]
US 20200172021A1 · Devota · 2020 [cited by examiner]
US 20210041768A1 · Sesti · 2021 [cited by examiner]
US 20210136356A1 · Rinaldo · 2021 [cited by examiner]
US 20210382375A1 · Sesti · 2021 [cited by examiner]
US 20210392249A1 · Winden · 2021 [cited by examiner]
US 20220009425A1 · Tokito · 2022 [cited by examiner]
US 20220291572A1 · Oba · 2022 [cited by examiner]
US 20220355745A1 · Achenbach · 2022 [cited by examiner]
US 20220360691A1 · Dreiocker et al. · 2022 [cited by applicant]
US 20220373762A1 · Skrocki · 2022 [cited by applicant]
US 20230234518A1 · Furutake · 2023 [cited by examiner]
US 20230284386A1 · McNally · 2023 [cited by examiner]
US 20230328890A1 · Angier · 2023 [cited by examiner]
US 20230336853A1 · Li · 2023 [cited by examiner]
US 20230398951A1 · Bair · 2023 [cited by examiner]
US 20230421907A1 · Wang · 2023 [cited by examiner]
US 20240053174A1 · Mcguire · 2024 [cited by examiner]
US 20240236452A1 · Oh · 2024 [cited by examiner]
US 20240243647A1 · Lee · 2024 [cited by examiner]
US 20240244306A1 · Park · 2024 [cited by examiner]
US 20240244325A1 · Park · 2024 [cited by examiner]
US 20240280880A1 · Deng · 2024 [cited by examiner]