Flexible display module and electronic device including the same
An electronic device is provided. The electronic device includes a housing, a display, a middle plate, an adhesive layer, a support layer, and a coating layer. The housing includes a front plate facing a direction, a rear plate facing an opposite direction, and a lateral member surrounding a space between the front and rear plate. The display is configured to be seen through the front plate, and includes a first and second surface. The middle plate is disposed between the display and the rear plate, and includes a surface facing the display, and a recess. The adhesive layer is attached to the display, and the support layer is disposed between the adhesive layer and the middle plate. The coating layer is disposed between the support layer and the adhesive layer and is disposed in a first portion overlapped with the recess when viewed from the display.
1. An electronic device comprising:
a flexible display;
a plurality of plates disposed under the flexible display, each of the plates being disposed to be separated from each other with respect to a folding area of the electronic device,
a plurality of support layers supporting the flexible display, each of the support layers being disposed to be separated from each other with respect to the folding area of the electronic device, wherein a first support layer of the plurality of support layers is disposed between a first plate of the plurality of plates and the flexible display, and a second support layer of the plurality of support layers is disposed between a second plate of the plurality of plates and the flexible display; and
a plurality of buffer layers, each of the buffer layers being disposed to be separated from each other with respect to the folding area of the electronic device,
wherein a first buffer layer of the plurality of buffer layers is coupled to the first support layer and disposed between the first support layer and the first plate, and a second buffer layer of the plurality of buffer layers is coupled to the second support layer and disposed between the second support layer and the second plate, and
wherein the plurality of buffer layers absorb at least one of recess or hole formed on a surface of the plurality of plates.
2. The electronic device of claim 1 , wherein the plurality of buffer layers absorb an uneven surface formed by the at least one of recess or hole included in the plurality of plates and elastically support the support layer based on an elastic force generated by compression state.
3. The electronic device of claim 1 , further comprising:
a plurality of support plates being disposed to be separated from each other with respect to the folding area of the electronic device,
wherein a first support plate of the plurality of support plates is disposed between the first support layer and the flexible display, and a second support plate of the plurality of support plates is disposed between the second support layer and the flexible display.
4. The electronic device of claim 3 , further comprising:
a plurality of adhesive layers, each of the adhesive layers being disposed to be separated from each other with respect to the folding area of the electronic device,
wherein a first adhesive layer of the plurality of adhesive layers is disposed between the first support layer and the flexible display, and a second adhesive layer of the plurality of adhesive layers is disposed between the second support layer and the flexible display; and
wherein the plurality of support plates, each of the support plates being located in an empty space between the plurality of adhesive layers.
5. The electronic device of claim 4 ,
wherein a thickness of the first support plate is formed smaller than a thickness of the first adhesive layer, and
wherein a thickness of the second support plate is formed smaller than a thickness of the second adhesive layer.
6. The electronic device of claim 1 , wherein the first support layer is disposed adjacent to the folding area, and the second support layer is disposed adjacent to the folding area.
7. The electronic device of claim 1 , wherein the first buffer layer is disposed adjacent to the folding area, and the second buffer layer is disposed adjacent to the folding area.
8. The electronic device of claim 7 , further comprising:
a first edge adhesive layer is combined to an edge of the first support layer and an edge of the first plate; and
a second edge adhesive layer is combined to an edge of the second support layer and an edge of the second plate;
wherein the plurality of buffer layers being located in an empty space between the first edge adhesive layer and the second edge adhesive layer.
9. The electronic device of claim 8 ,
wherein a thickness of the first buffer layer is formed thicker than a thickness of the first edge adhesive layer, and
wherein a thickness of the second buffer layer is formed thicker than a thickness of the second edge adhesive layer.
10. The electronic device of claim 9 ,
wherein the first buffer layer elastically supports the first support layer with an elastic force generated based on the first buffer layer being disposed in a compressed state between the first support layer and the first plate, and
wherein the second buffer layer elastically supports the second support layer with an elastic force generated based on the second buffer layer being disposed in a compressed state between the second support layer and the second plate.
11. The electronic device of claim 1 ,
wherein a size of the first buffer layer is smaller than a size of the first support layer, and
wherein a size of the second buffer layer is smaller than a size of the second support layer.
12. The electronic device of claim 1 , wherein the plurality of buffer layers formed of an elastic material.