Shielded connector assemblies with temperature and alignment controls
High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.
1. A connector assembly, comprising:
a housing comprising a port;
a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and
a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.
2. The connector assembly according to claim 1 , wherein:
the plurality of communication signal conductors comprise a plurality of high-speed communication signal conductors and a plurality of low-speed communication signal conductors; and
the plurality of low-speed communication signal conductors are centrally positioned in the row of conductors, with a first pair of the plurality of high-speed communication signal conductors on a first side of the low-speed communication signal conductors and a second pair of the plurality of high-speed communication signal conductors on a second side of the low-speed communication signal conductors.
3. The connector assembly according to claim 1 , wherein:
the plurality of communication signal conductors comprise a plurality of high-speed communication signal conductors and a plurality of low-speed communication signal conductors; and
the plurality of low-speed communication signal conductors are centrally positioned in the row of conductors, with two pairs of the plurality of high-speed communication signal conductors on a first side of the low-speed communication signal conductors and another two pairs of the plurality of high-speed communication signal conductors on a second side of the low-speed communication signal conductors.
4. The connector assembly according to claim 1 , wherein the ground path assembly comprises a plurality of conductive ground shields positioned over the plurality of ground conductors.
5. The connector assembly according to claim 1 , wherein the conductive ground shield comprises a laminate of dielectric and conductive metal.
6. The connector assembly according to claim 1 , wherein the conductive ground shield comprises a plated plastic ground shield, and the metal ground shield insert is stitch mated with the plated plastic ground shield.
7. The connector assembly according to claim 1 , wherein the ground path assembly comprises a dual ground path for a least one ground conductor among the plurality of ground conductors.
8. The connector assembly according to claim 1 , wherein:
a ground conductor among the plurality of ground conductors comprises a contact tip portion and a tail portion; and
the ground path assembly comprises:
the conductive ground shield; and
conductive spring fingers inserted into channels in the conductive ground shield; and
a conductive spring finger among the conductive spring fingers contacts the contact tip portion of the ground conductor.
9. The connector assembly according to claim 1 , wherein:
the row of conductors comprises a row of transmit conductors;
the wafer assembly further comprises a second row of conductors; and
the second row of conductors comprises a row of receive conductors.
10. The connector assembly according to claim 1 , wherein:
the wafer assembly further comprises a second row of conductors;
the second row of conductors comprises a plurality of high-speed communication signal conductors, a plurality of low-speed communication signal conductors, and a second plurality of ground conductors arranged in the second row of conductors; and
the wafer assembly further comprises a second conductive ground shield between the row of conductors and the second row of conductors.
11. The connector assembly according to claim 10 , wherein:
the plurality of low-speed communication signal conductors of the second row of conductors are centrally positioned in the second row of conductors; and
the plurality of low-speed communication signal conductors of the second row of conductors are offset from a plurality of low-speed communication signal conductors of the row of conductors, to form a centrally positioned air gap in the wafer assembly.
12. The connector assembly according to claim 1 , wherein the wafer assembly further comprises a second row of conductors, a third row of conductors, and a fourth row of conductors.
13. The connector assembly according to claim 12 , wherein the wafer assembly further comprises:
a second conductive ground shield between the row of conductors and the second row of conductors; and
a third conductive ground shield between the third row of conductors and the fourth row of conductors.
14. The connector assembly according to claim 13 , wherein the second row of conductors faces the third row of conductors without a conductive ground shield between the second row of conductors and the third row of conductors.
15. The connector assembly according to claim 12 , wherein the wafer assembly further comprises a plurality of dielectric lead frame support structures that support and electrically isolate the row of conductors, the second row of conductors, the third row of conductors, and the fourth row of conductors.
16. The connector assembly according to claim 1 , further comprising:
a side plate on one side of the housing, the side plate comprising an aperture, wherein:
the wafer assembly further comprises a protrusion at one end of the row of conductors; and
the protrusion is inserted into the aperture of the side plate to align the row of conductors.
17. The connector assembly according to claim 16 , further comprising:
a second side plate on another side of the housing, the second side plate comprising an aperture, wherein:
the wafer assembly further comprises a second protrusion at another end of the row of conductors; and
the second protrusion is inserted into the aperture of the second side plate to align the row of conductors.
18. The connector assembly according to claim 17 , wherein:
the side plate extends along a first bottom edge of the housing, on the one side of the housing; and
the second side plate extends along a second bottom edge of the housing, on the other side of the housing.
19. The connector assembly according to claim 1 , wherein:
the ground path assembly comprises a first conductive ground shield and a second conductive ground shield;
the plurality of communication signal conductors comprise a plurality of high-speed communication signal conductors and a plurality of low-speed communication signal conductors; and
the plurality of low-speed communication signal conductors are centrally positioned in the row of conductors, with a first pair of the plurality of high-speed communication signal conductors extending along the first conductive ground shield on a first side of the low-speed communication signal conductors and a second pair of the plurality of high-speed communication signal conductors extending along the second conductive ground shield on a second side of the low-speed communication signal conductors.
20. The connector assembly according to claim 19 , wherein:
the wafer assembly further comprises a gap in the row of conductors between the first conductive ground shield and the second conductive ground shield; and
the plurality of low-speed communication signal conductors extend between the gap.