Self-aligned fabrication process for coupling of photonic waveguides
A self-aligned fabrication process for aligning photonic waveguide layers of a 3D photonic structure such that light may be efficiently transferred between the two layers is described. The self-aligned fabrication process comprises using a mask to pattern both photonic waveguide layers, such that they are aligned three-dimensionally via a single lithographic processing step, and thus fabricating a photonically coupled region of the 3D photonic structure. Selective etching may also be used to taper a given photonic waveguide layer for adiabatic coupling, and/or to produce other non-trivial geometric shapes in the photonic waveguide layers. Such 3D photonic structures may be fabricated for use in quantum memory devices, in which one of the photonic waveguide layers may host quantum memories and another photonic waveguide layer may interface with an optical fiber, such that light may be transferred between an optical fiber and respective ones of the quantum memories.
1. A quantum memory device, comprising:
an optical fiber port;
a plurality of quantum memories;
a 3D photonic structure configured to transport light between an optical fiber connected to the optical fiber port and respective ones of the plurality of quantum memories, wherein the 3D photonic structure comprises:
a substrate; and
a photonically coupled waveguide region, comprising:
a first photonic waveguide layer, deposited onto the substrate, configured to interface with the optical fiber; and
a second photonic waveguide layer, bonded to the first photonic waveguide layer, configured to interface with the respective ones of the plurality of quantum memories, wherein the first photonic waveguide layer and the second photonic waveguide layer have been photonically coupled via a self-aligned fabrication process.
2. The quantum memory device of claim 1 , wherein the photonically coupled waveguide region, formed via the self-aligned fabrication process, is formed by:
removing, based, at least in part, on a single masking pattern, respective portions of the first photonic waveguide layer and the second photonic waveguide layer such that a portion of the substrate is exposed and a remaining portion of the substrate is unexposed, wherein a remaining portion of the first photonic waveguide layer remains deposited on the remaining portion of the substrate and a remaining portion of the second photonic waveguide layer remains deposited on the remaining portion of the first photonic waveguide layer;
removing a respective part of the remaining substrate adjacent to the first photonic waveguide layer such that the remaining portions of the first and second photonic waveguide layers are at least partially separated from a resulting remainder of the substrate, wherein the remaining portions of the first and second photonic waveguide layers and the resulting remainder of the substrate form an intermediate stack; and
selectively removing a portion of the first photonic waveguide layer or a portion of the second photonic waveguide layer of the intermediate stack, wherein unremoved portions of the first photonic waveguide layer or the second photonic waveguide layer of the intermediate stack form the photonically coupled waveguide region of the 3D photonic structure.
3. The quantum memory device of claim 1 , wherein:
the first photonic waveguide layer comprises a spacer layer; and
the 3D photonic structure is configured to transport the light via evanescent coupling.
4. The quantum memory device of claim 1 , further comprising a network of optical switches, patterned into the first photonic waveguide layer, configured to provide routes between the optical fiber and the photonically coupled waveguide region.
5. The quantum memory device of claim 1 , further comprising metal contacts, patterned into the first photonic waveguide layer, configured to route electrical control signals to respective ones of the plurality of quantum memories.
6. The quantum memory device of claim 1 , wherein the plurality of quantum memories have been patterned into the second photonic waveguide layer.
7. The quantum memory device of claim 1 , further comprising at least one of:
one or more photonic detectors;
one or more electrooptic modulators; or
one or more light sources.
8. The quantum memory device of claim 1 , wherein the first photonic waveguide layer and the second photonic waveguide layer are bonded to one another prior to forming the photonically coupled waveguide region.
9. The quantum memory device of claim 1 , wherein said bonding comprises one of the following techniques:
van der Waals bonding;
eutectic bonding; or
adhesive bonding.
10. The quantum memory device of claim 1 , wherein the first photonic waveguide layer comprises at least one of the following materials:
silicon nitride;
lithium niobate; or
aluminum nitride.
11. The quantum memory device of claim 1 , wherein the first photonic waveguide layer comprises at least one of the following materials:
diamond;
silicon;
silicon carbide;
lithium niobate; or
aluminum nitride.
12. A 3D photonic structure, comprising:
a substrate; and
a photonically coupled waveguide region, comprising:
a first photonic waveguide layer deposited onto the substrate; and
a second photonic waveguide layer bonded to the first photonic waveguide layer,
wherein:
the 3D photonic structure is configured to transport light between the first photonic waveguide layer and the second photonic waveguide layer via the photonically coupled waveguide region; and
the first photonic waveguide layer and the second photonic waveguide layer have been photonically coupled via a self-aligned fabrication process.
13. The 3D photonic structure of claim 12 , wherein:
the first photonic waveguide layer comprises a spacer layer; and
the spacer layer comprises at least one of:
a metal material layer;
a polymer material layer; or
a dielectric material layer.
14. The 3D photonic structure of claim 12 , wherein in the self-aligned fabrication process, the first photonic waveguide layer and the second photonic waveguide layer are bonded to one another prior to forming the photonically coupled waveguide region.
15. The 3D photonic structure of claim 14 , wherein the bond is formed using one of the following techniques:
van der Waals bonding;
eutectic bonding; or
adhesive bonding.
16. The 3D photonic structure of claim 12 , wherein the photonically coupled waveguide region, formed via the self-aligned fabrication process, is formed by:
removing, based, at least in part, on a single masking pattern, respective portions of the first photonic waveguide layer and the second photonic waveguide layer such that a portion of the substrate is exposed and a remaining portion of the substrate is unexposed, wherein a remaining portion of the first photonic waveguide layer remains deposited on the remaining portion of the substrate and a remaining portion of the second photonic waveguide layer remains deposited on the remaining portion of the first photonic waveguide layer;
removing a respective part of the remaining substrate adjacent to the first photonic waveguide layer such that the remaining portions of the first and second photonic waveguide layers are at least partially separated from a resulting remainder of the substrate, wherein the remaining portions of the first and second photonic waveguide layers and the resulting remainder of the substrate form an intermediate stack; and
selectively removing a portion of the first photonic waveguide layer or a portion of the second photonic waveguide layer of the intermediate stack, wherein unremoved portions of the first photonic waveguide layer or the second photonic waveguide layer of the intermediate stack form the photonically coupled waveguide region of the 3D photonic structure.
17. The 3D photonic structure of claim 16 , wherein:
at least one of the unremoved portions of the first photonic waveguide layer or the second photonic waveguide layer of the photonically coupled waveguide region is tapered; and
the 3D photonic structure is configured to transport the light via adiabatic coupling between the first photonic waveguide layer and the second photonic waveguide layer.
18. The 3D photonic structure of claim 12 , wherein the 3D photonic structure is configured to transport the light via evanescent coupling.
19. The 3D photonic structure of claim 12 , wherein the first photonic waveguide layer comprises at least one of the following materials:
silicon nitride;
lithium niobate; or
aluminum nitride.
20. The 3D photonic structure of claim 12 , wherein the second photonic waveguide layer comprises at least one of the following materials:
diamond;
silicon;
silicon carbide;
lithium niobate; or
aluminum nitride.