Wall-mounted NFC device that self disables upon removal
The present disclosure presents wall-mounted near field communication systems and related methods. One such system comprises a sign assembly having a near field communication (NFC) tag comprising a first conducting member, a substrate assembly having a weakness area, wherein the substrate assembly comprises a plastic substrate; and first adhesive securing the NFC tag device to the substrate assembly such that the first conducting member is disposed proximate the weakness area.
1. A sign assembly comprising:
a base member comprising an opening;
a threaded connector disposed through the opening of the base member; and
a near field communication (NFC) tag device comprising:
a first conducting member representing an antenna,
a second conducting member representing an anti-tamper loop, the second conducting member being secured to the threaded connector by adhesive, and
an electronically readable medium containing electronically executable instructions for performing operations comprising:
determining that a circuit comprising the second conducting member is open, and
based on determining that the circuit comprising the second conducting member is open, causing first tamper data to be sent using the antenna, the first tamper data indicating that the sign assembly has been tampered with.
2. The sign assembly of claim 1 , wherein the threaded connector secures the sign assembly to a wall of a building, and wherein the threaded connector is a screw or bolt.
3. The sign assembly of claim 1 , wherein the first conducting member is secured to one or more surfaces of the base member by adhesive.
4. A sign assembly comprising:
a near field communication (NFC) tag device comprising:
a first conducting member representing an antenna,
a second conducting member representing an anti-tamper loop, and
an electronically readable medium containing electronically executable instructions for performing operations comprising:
determining that a circuit comprising the second conducting member is open, and
based on determining that the circuit comprising the second conducting member is open, causing first tamper data to be sent using the antenna, the first tamper data indicating that the sign assembly has been tampered with,
a plastic substrate comprising a weakness area; and
adhesive securing the NFC tag device to the plastic substrate proximate the weakness area of the plastic substrate.
5. The sign assembly of claim 4 , wherein the plastic substrate comprises a first portion having a first force resistance strength value and a second portion corresponding to the weakness area having a second force resistance strength value, wherein the first force resistance strength value is greater than the second force resistance strength value.
6. The sign assembly of claim 5 , wherein the first force resistance strength value and the second force resistance strength value are tear strength values.
7. The sign assembly of claim 5 , wherein the first force resistance strength value and the second force resistance strength value are tensile strength values.
8. The sign assembly of claim 5 , wherein the first force resistance strength value and the second force resistance strength value are yield strength values or shear strength values.
9. The sign assembly of claim 5 , wherein the first portion has a first thickness and the second portion has a second thickness, the first thickness being greater than the second thickness.
10. The sign assembly of claim 4 , wherein the second conducting member is disposed at the weakness area.
11. The sign assembly of claim 4 , wherein the NFC tag device and the plastic substrate are part of an inlay, and wherein the inlay is secured by adhesive between first and second plates of the sign assembly.
12. The sign assembly of claim 4 , wherein the first conducting member is disposed at the weakness area.
13. A sign assembly comprising:
a near field communication (NFC) tag device comprising a first conducting member,
a substrate assembly having a weakness area, the substrate assembly comprising:
a plastic substrate,
a first portion having a first force resistance strength value, and
a second portion corresponding to the weakness area having a second force resistance strength value, wherein the first force resistance strength value is greater than the second force resistance strength value; and
adhesive securing the NFC tag device to the substrate assembly such that the first conducting member is disposed proximate the weakness area.
14. The sign assembly of claim 13 , wherein the plastic substrate comprises the first portion and the second portion.
15. The sign assembly of claim 14 , wherein the first force resistance strength value and the second force resistance strength value are tear strength values.
16. The sign assembly of claim 14 , wherein the first force resistance strength value and the second force resistance strength value are tensile strength values or yield strength values.
17. The sign assembly of claim 13 , wherein the adhesive comprises a third portion having a third force resistance strength value and a fourth portion corresponding to the weakness area having a fourth force resistance strength value, wherein the third force resistance strength value is greater than the fourth force resistance strength value.
18. The sign assembly of claim 13 , wherein the plastic substrate comprises a first portion having a first thickness and a second portion corresponding to the weakness area having a second thickness, wherein the first thickness is greater than the second thickness.
19. The sign assembly of claim 13 , wherein the adhesive comprises a third portion having a first thickness and a fourth portion corresponding to the weakness area having a second thickness, wherein the first thickness is greater than the second thickness.
20. The sign assembly of claim 13 , wherein the substrate assembly comprises one or more channels defined in the plastic substrate that cause weakness of the weakness area.
21. The sign assembly of claim 13 , wherein the adhesive is arranged so as to cause weakness of the weakness area.
22. The sign assembly of claim 13 , wherein the first conducting member is an antenna.
23. The sign assembly of claim 13 , wherein the first conducting member is an anti-tamper wire loop.
24. The sign assembly of claim 13 , wherein the first conducting member is secured to the substrate assembly at the weakness area.
25. A sign assembly comprising:
a near field communication (NFC) tag device comprising a first conducting member;
a substrate assembly having a weakness area, the substrate assembly comprising:
a plastic substrate comprising:
a first portion having a first force resistance strength value, and
a second portion corresponding to the weakness area having a second force resistance strength value, wherein the first force resistance strength value is greater than the second force resistance strength value; and
adhesive securing the NFC tag device to the substrate assembly such that the first conducting member is disposed proximate the weakness area.