Granted Patent B2

US 12,309,979 · App. 17/970,318 · Granted May 20, 2025

Inventors: Tyler Baxter Duncan (Austin, TX); Anthony Middleton (Cedar Park, TX)

Assignee: DELL PRODUCTS L.P.

H05K7/20781H05K7/20272H05K7/20736

Abstract

Claims (74)

1. A modular information technology component (MITC), comprising:

a first information handling system (IHS);

a utility control component (UCC), wherein the UCC is integrated within the MITC to:

detect and manage a temperature within the first IHS,

detect and suppress a fire within a second IHS that is deployed to the MITC,

manage a power distribution to the second IHS from a modular power supply component (MPSC), wherein the MPSC is designed based on a hurricane rating of a location that the MITC is deployed,

form a UCC-integrated MITC, wherein the UCC-integrated MITC is manufactured as a monolithic system; and

a first hinged bracket,

wherein the first hinged bracket comprises a first hinge, a first base, and a first holder,

wherein a first portion of the first base is connected to the first IHS, wherein a second portion of the first base is connected to the first hinge,

wherein a first portion of the first holder is connected to the first hinge, wherein a second portion of the first holder is connected to a first information technology component (ITC), wherein the first holder and the first ITC are oriented in a first direction, and

wherein, after rotating inward or outward about the first hinge, the first holder and the first ITC are oriented in a second direction, wherein the first direction and the second direction are different.

2. The MITC of claim 1 , wherein the first ITC is a direct liquid cooling (DLC) manifold or a power distribution unit (PDU).

3. The MITC of claim 2 ,

wherein the DLC manifold comprises a cold liquid pipe and a hot liquid pipe,

wherein the cold liquid pipe is connected to the first IHS, wherein the cold liquid pipe delivers cold liquid to the first IHS to cool off the first IHS, and

wherein the hot liquid pipe is connected to the first IHS, wherein the hot liquid pipe delivers heated cold liquid to the DLC manifold.

4. The MITC of claim 2 ,

wherein the PDU comprises cables,

wherein the cables are connected to the first IHS, and

wherein the cables transmit power to the first IHS.

5. The MITC of claim 1 , wherein the MITC further comprises a second hinged bracket,

wherein the second hinged bracket comprises a second hinge, a second base, and a second holder,

wherein a first portion of the second base is connected to the first IHS, wherein a second portion of the second base is connected to the second hinge,

wherein a first portion of the second holder is connected to the second hinge, wherein a second portion of the second holder is connected to a second ITC, wherein the second holder and the second ITC are oriented in the first direction, and

wherein, after rotating inward or outward about the second hinge, the second holder and the second ITC are oriented in a third direction, wherein the second direction and the third direction are different or the same.

6. The MITC of claim 1 , wherein the first IHS comprises a rack and a plurality of computing devices, wherein the rack is a housing for the plurality of computing devices.

7. A modular data center, comprising:

a modular information technology component (MITC), wherein the MITC comprises a first information handling system (IHS), a utility control component (UCC), and a first hinged bracket,

wherein the UCC is integrated within the MITC to:

detect and manage a temperature within the first IHS,

detect and suppress a fire within a second IHS that is deployed to the MITC,

manage a power distribution to the second IHS from a modular power supply component (MPSC), wherein the MPSC is designed based on a hurricane rating of a location that the MITC is deployed,

form a UCC-integrated MITC, wherein the UCC-integrated MITC is manufactured as a monolithic system,

wherein the first hinged bracket comprises a first hinge, a first base, and a first holder,

wherein a first portion of the first base is connected to the first IHS, wherein a second portion of the first base is connected to the first hinge,

wherein a first portion of the first holder is connected to the first hinge, wherein a second portion of the first holder is connected to a first information technology component (ITC), wherein the first holder and the first ITC are oriented in a first direction, and

wherein, after rotating inward or outward about the first hinge, the first holder and the first ITC are oriented in a second direction, wherein the first direction and the second direction are different; and

a modular environmental control component (MECC),

wherein the MECC comprises a plurality of environmental control components (ECCs) and built-in airflow connection components, wherein the built-in airflow connection components remove and supply air to the MITC.

8. The modular data center of claim 7 , wherein the first ITC is a direct liquid cooling (DLC) manifold or a power distribution unit (PDU).

9. The modular data center of claim 8 ,

wherein the DLC manifold comprises a cold liquid pipe and a hot liquid pipe,

wherein the cold liquid pipe is connected to the first IHS, wherein the cold liquid pipe delivers cold liquid to the first IHS to cool off the first IHS, and

wherein the hot liquid pipe is connected to the first IHS, wherein the hot liquid pipe delivers heated cold liquid to the DLC manifold.

10. The modular data center of claim 8 ,

wherein the PDU comprises cables,

wherein the cables are connected to the first IHS, and

wherein the cables transmit power to the first IHS.

11. The modular data center of claim 7 , wherein the MITC further comprises a second hinged bracket,

wherein the second hinged bracket comprises a second hinge, a second base, and a second holder,

wherein a first portion of the second base is connected to the first IHS, wherein a second portion of the second base is connected to the second hinge, wherein a first portion of the second holder is connected to the second hinge,

wherein a second portion of the second holder is connected to a second ITC, wherein the second holder and the second ITC are oriented in the first direction, and

wherein, after rotating inward or outward about the second hinge, the second holder and the second ITC are oriented in a third direction, wherein the second direction and the third direction are different or the same.

12. The modular data center of claim 7 , wherein the first IHS comprises a rack and a plurality of computing devices, wherein the rack is a housing for the plurality of computing devices.

13. An information handling system (IHS), comprising:

a rack;

a computing device;

a hinged bracket,

wherein the hinged bracket comprises a hinge, a base, and a holder,

wherein a first portion of the base is connected to the rack, wherein a second portion of the base is connected to the hinge,

wherein a first portion of the holder is connected to the hinge, wherein a second portion of the holder is connected to an information technology component (ITC), wherein the holder and the ITC are oriented in a first direction,

wherein, after rotating inward or outward about the hinge, the holder and the ITC are oriented in a second direction, wherein the first direction and the second direction are different,

wherein the ITC is a direct liquid cooling (DLC) manifold or a power distribution unit (PDU),

wherein the PDU transmits power from a modular power supply component (MPSC) to the computing device, and

wherein the MPSC is designed by considering a hurricane rating of a location that the IHS is deployed.

14. The IHS of claim 13 , wherein the IHS further comprises a second computing device,

wherein the DLC manifold comprises a cold liquid pipe and a hot liquid pipe,

wherein the cold liquid pipe is connected to the second computing device, wherein the cold liquid pipe delivers cold liquid to the second computing device to cool off the second computing device, and

wherein the hot liquid pipe is connected to the second computing device, wherein the hot liquid pipe delivers heated cold liquid to the DLC manifold.

15. The IHS of claim 13 ,

wherein the PDU comprises cables,

wherein the cables are connected to the computing device, and

wherein the cables transmit power to the computing device.

Assignments (1)

Continuity (2)

References Cited (52)