Metal dual interface card
A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
1. A transaction card comprising:
a metal card body having first and second surfaces;
a first module secured in the card body and comprising a first circuit;
a second module secured in a void in the metal card body, the second module comprising a second circuit and an antenna, wherein (i) the first circuit and the second circuit are not physically electrically connected to one another and (ii) the first circuit and the second transaction circuit are not connected to any shared circuit component, and (iii) at least one of the first module and the second module comprises a transaction module;
wherein the void comprises a blind pocket open to the second surface of the card body; and
wherein the second module comprises an outer layer disposed flush with the second surface of the card body and the second module further comprises a layer containing the second circuit and the antenna, an RF shielding layer, and an adhesive layer; and
wherein the second module comprises a multi-layer plug or disc that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body.
2. The transaction card of claim 1 , wherein the first module and the second module both comprise transaction modules.
3. The transaction card of claim 1 , wherein the first module comprises a contact-only transaction module and the second module comprises a contactless transaction module.
4. The transaction card of claim 1 , wherein the second transaction module is adhesively bonded to a bottom of the pocket.
5. The transaction card of claim 4 , wherein the second transaction module is adhesively bonded to a bottom of the pocket by the adhesive layer of the second transaction module.
6. The transaction card of claim 1 , wherein the first circuit and the second circuit are independently personalized.
7. The transaction card of claim 1 , wherein the layer containing the second circuit and the antenna is located between the first and second outer layers.
8. The transaction card of claim 7 , wherein the second module comprises an annular RF shielding component disposed at or near an outer periphery of the plug or disc for at least a portion of a dimension from the first surface of the card to the second surface of the card.
9. A process for manufacturing a transaction card, the process comprising the steps of:
(a) constructing a metal card body having first and second surfaces;
(b) securing a first module in the card body, the first module comprising a first circuit;
(c) forming a void comprising a blind pocket open to the second surface of the card body;
(d) securing a second module in the void, the second module comprising a second circuit and an antenna, wherein (i) the first circuit and the second circuit are not physically electrically connected to one another and (ii) the first circuit and the second transaction circuit are not connected to any shared circuit component, and (iii) at least one of the first module and the second module comprises a transaction module; and
wherein the second module comprises an outer layer disposed flush with the second surface of the card body and the second module further comprises a layer containing the second circuit and the antenna, an RF shielding layer, and an adhesive layer; and
wherein step (d) further comprises providing the second module as a multi-layer plug or disc that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body.
10. The process of claim 9 , wherein the step of securing the second module in the void comprises adhesively bonding the contactless transaction portion to a bottom of the pocket with the outer layer of the contactless transaction portion disposed flush with the second surface of the card body.
11. The process of claim 10 , wherein the step of securing the first module in the card body is performed after bonding the contactless transaction portion to the bottom of the pocket.
12. The process of claim 9 , further comprising (e) personalizing the first circuit independently from personalizing the second circuit.
13. The process of claim 9 , wherein step (a) comprises constructing the metal card body as a two-piece construction, including a first piece embodying the first surface and a second piece embodying the second surface.
14. The process of claim 13 , further comprising providing each of the first module and the second module with at least one tab positioned to be received at an interface between the first piece of the card body and the second piece of the card body.
15. The process of claim 14 , further comprising providing one or more slots in the first piece of the card body, the second piece of the card body, or both, positioned to receive the at least one tab on one or both of the first module and the second module.
16. The process of claim 9 , wherein step (d) of providing the second module as the multi-layer plug or disc comprises embedding or bonding the second module having the second circuit and the antenna into the multi-layer plug or disc.
17. The process of claim 16 , wherein the second module having the second circuit and the antenna is embedded or bonded into the multi-layer plug or disc prior to securing the second module in the void.
18. The process of claim 9 , further comprising assembling the multi-layer plug or disc, and assembling the multi-layer plug or disc comprises providing at least one adhesive inlay, and adhering the at least one adhesive inlay to one or more of the other layers to assemble the multi-layer plug or disc.
19. The process of claim 18 , wherein the multi-layer plug or disc comprises a first filler layer and a second filler layer, the second module having the second circuit and the antenna being disposed between the first filler layer and the second filler layer.